JPS6164173A - 赤外線検出素子の製造方法 - Google Patents
赤外線検出素子の製造方法Info
- Publication number
- JPS6164173A JPS6164173A JP59186831A JP18683184A JPS6164173A JP S6164173 A JPS6164173 A JP S6164173A JP 59186831 A JP59186831 A JP 59186831A JP 18683184 A JP18683184 A JP 18683184A JP S6164173 A JPS6164173 A JP S6164173A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- crystal
- manufacturing
- hgcdte
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/125—The active layers comprising only Group II-VI materials, e.g. CdS, ZnS or CdTe
- H10F71/1253—The active layers comprising only Group II-VI materials, e.g. CdS, ZnS or CdTe comprising at least three elements, e.g. HgCdTe
Landscapes
- Light Receiving Elements (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59186831A JPS6164173A (ja) | 1984-09-06 | 1984-09-06 | 赤外線検出素子の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59186831A JPS6164173A (ja) | 1984-09-06 | 1984-09-06 | 赤外線検出素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6164173A true JPS6164173A (ja) | 1986-04-02 |
JPH0546708B2 JPH0546708B2 (enrdf_load_stackoverflow) | 1993-07-14 |
Family
ID=16195376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59186831A Granted JPS6164173A (ja) | 1984-09-06 | 1984-09-06 | 赤外線検出素子の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6164173A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08117089A (ja) * | 1994-10-26 | 1996-05-14 | Sugamo Heiwa Reien:Kk | パネル祭壇 |
-
1984
- 1984-09-06 JP JP59186831A patent/JPS6164173A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0546708B2 (enrdf_load_stackoverflow) | 1993-07-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5016986A (en) | Display device having an improvement in insulating between conductors connected to electronic components | |
US4021767A (en) | Hall element and method of manufacturing same | |
JPH0319703B2 (enrdf_load_stackoverflow) | ||
EP0186818B1 (en) | Chip to pin interconnect method | |
JPH02150754A (ja) | 感応素子の製造方法 | |
US4570329A (en) | Apparatus and method for fabricating backside mosaic of photoconductive infrared detectors | |
JPS6164173A (ja) | 赤外線検出素子の製造方法 | |
US4025793A (en) | Radiation detector with improved electrical interconnections | |
JP2502581B2 (ja) | 半導体素子の突起電極形成方法 | |
JP2782870B2 (ja) | リードフレーム | |
JPS59104523A (ja) | 赤外線検知素子の製造方法 | |
JPS646554B2 (enrdf_load_stackoverflow) | ||
JPH0330986B2 (enrdf_load_stackoverflow) | ||
JP3214507B2 (ja) | 電子部品、電子回路素子搭載用基板及びその製造方法 | |
JP2000101162A (ja) | 小型磁電変換素子とその製造方法 | |
JPS60106976A (ja) | エツチング終点検出方法 | |
JPS5814746B2 (ja) | ハンドウタイソウチノセイゾウホウホウ | |
JPS6329993A (ja) | 配線基板およびその製造方法 | |
JPS59171821A (ja) | 赤外線検知素子の製造方法 | |
JPH0153729B2 (enrdf_load_stackoverflow) | ||
JPS61121348A (ja) | 半導体装置 | |
JP2621186B2 (ja) | 転写用バンプの形成方法 | |
JPS61100981A (ja) | 半導体装置の製造方法 | |
JPS592329A (ja) | 半導体集積回路基板の製造方法 | |
JP2003273147A (ja) | 半導体装置およびその製造方法 |