JPS6163020A - 薄膜形成方法 - Google Patents
薄膜形成方法Info
- Publication number
- JPS6163020A JPS6163020A JP59183728A JP18372884A JPS6163020A JP S6163020 A JPS6163020 A JP S6163020A JP 59183728 A JP59183728 A JP 59183728A JP 18372884 A JP18372884 A JP 18372884A JP S6163020 A JPS6163020 A JP S6163020A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- gas
- substrate
- forming method
- film forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10P14/3411—
-
- H10P14/24—
-
- H10P14/271—
Landscapes
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59183728A JPS6163020A (ja) | 1984-09-04 | 1984-09-04 | 薄膜形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59183728A JPS6163020A (ja) | 1984-09-04 | 1984-09-04 | 薄膜形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6163020A true JPS6163020A (ja) | 1986-04-01 |
| JPH036653B2 JPH036653B2 (en:Method) | 1991-01-30 |
Family
ID=16140923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59183728A Granted JPS6163020A (ja) | 1984-09-04 | 1984-09-04 | 薄膜形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6163020A (en:Method) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01181533A (ja) * | 1988-01-12 | 1989-07-19 | Toshiba Corp | 半導体装置の製造方法 |
| US4906585A (en) * | 1987-08-04 | 1990-03-06 | Siemens Aktiengesellschaft | Method for manufacturing wells for CMOS transistor circuits separated by insulating trenches |
| US5013691A (en) * | 1989-07-31 | 1991-05-07 | At&T Bell Laboratories | Anisotropic deposition of silicon dioxide |
| JPH0697158A (ja) * | 1991-09-12 | 1994-04-08 | Semiconductor Energy Lab Co Ltd | 光気相反応方法 |
| US5427824A (en) * | 1986-09-09 | 1995-06-27 | Semiconductor Energy Laboratory Co., Ltd. | CVD apparatus |
| US5837614A (en) * | 1993-02-19 | 1998-11-17 | Semiconductor Energy Laboratory Co., Ltd. | Insulating film and method of producing semiconductor device |
| US6013338A (en) * | 1986-09-09 | 2000-01-11 | Semiconductor Energy Laboratory Co., Ltd. | CVD apparatus |
| US6168980B1 (en) | 1992-08-27 | 2001-01-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for forming the same |
| US6261875B1 (en) | 1993-03-12 | 2001-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and process for fabricating the same |
| US6586346B1 (en) | 1990-02-06 | 2003-07-01 | Semiconductor Energy Lab | Method of forming an oxide film |
| US7465679B1 (en) | 1993-02-19 | 2008-12-16 | Semiconductor Energy Laboratory Co., Ltd. | Insulating film and method of producing semiconductor device |
-
1984
- 1984-09-04 JP JP59183728A patent/JPS6163020A/ja active Granted
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5427824A (en) * | 1986-09-09 | 1995-06-27 | Semiconductor Energy Laboratory Co., Ltd. | CVD apparatus |
| US5629245A (en) * | 1986-09-09 | 1997-05-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming a multi-layer planarization structure |
| US5855970A (en) * | 1986-09-09 | 1999-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Method of forming a film on a substrate |
| US6013338A (en) * | 1986-09-09 | 2000-01-11 | Semiconductor Energy Laboratory Co., Ltd. | CVD apparatus |
| US4906585A (en) * | 1987-08-04 | 1990-03-06 | Siemens Aktiengesellschaft | Method for manufacturing wells for CMOS transistor circuits separated by insulating trenches |
| JPH01181533A (ja) * | 1988-01-12 | 1989-07-19 | Toshiba Corp | 半導体装置の製造方法 |
| US5013691A (en) * | 1989-07-31 | 1991-05-07 | At&T Bell Laboratories | Anisotropic deposition of silicon dioxide |
| US6586346B1 (en) | 1990-02-06 | 2003-07-01 | Semiconductor Energy Lab | Method of forming an oxide film |
| US6960812B2 (en) | 1990-02-06 | 2005-11-01 | Semiconductor Energy Laboratory Co., Ltd. | Method of forming an oxide film |
| US7301211B2 (en) | 1990-02-06 | 2007-11-27 | Semiconductor Energy Laboratory Co. Ltd. | Method of forming an oxide film |
| JPH0697158A (ja) * | 1991-09-12 | 1994-04-08 | Semiconductor Energy Lab Co Ltd | 光気相反応方法 |
| US6168980B1 (en) | 1992-08-27 | 2001-01-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for forming the same |
| US7416907B2 (en) | 1992-08-27 | 2008-08-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for forming the same |
| US6025630A (en) * | 1993-02-19 | 2000-02-15 | Semiconductor Energy Laboratory Co., Ltd. | Insulating film formed using an organic silane and method of producing semiconductor device |
| US5866932A (en) * | 1993-02-19 | 1999-02-02 | Semiconductor Energy Laboratory Co., Ltd. | Insulating film formed using an organic silane and method of producing semiconductor device |
| US5837614A (en) * | 1993-02-19 | 1998-11-17 | Semiconductor Energy Laboratory Co., Ltd. | Insulating film and method of producing semiconductor device |
| US7465679B1 (en) | 1993-02-19 | 2008-12-16 | Semiconductor Energy Laboratory Co., Ltd. | Insulating film and method of producing semiconductor device |
| US6541313B2 (en) | 1993-03-12 | 2003-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and process for fabricating the same |
| US6939749B2 (en) | 1993-03-12 | 2005-09-06 | Semiconductor Energy Laboratory Co., Ltd | Method of manufacturing a semiconductor device that includes heating the gate insulating film |
| US6261875B1 (en) | 1993-03-12 | 2001-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and process for fabricating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH036653B2 (en:Method) | 1991-01-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |