JPS6161773U - - Google Patents
Info
- Publication number
- JPS6161773U JPS6161773U JP14514684U JP14514684U JPS6161773U JP S6161773 U JPS6161773 U JP S6161773U JP 14514684 U JP14514684 U JP 14514684U JP 14514684 U JP14514684 U JP 14514684U JP S6161773 U JPS6161773 U JP S6161773U
- Authority
- JP
- Japan
- Prior art keywords
- connector
- solder
- board
- slope
- joint portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
Description
第１図は本考案に係るコネクタ構造を説明する
断面図で同図Ａは接続ピンを接合する前の状態、
同図Ｂはコネクタ接続をした状態図、第２図はＬ
ＳＩモジユールのプリント基板へのコネクタ接続
を説明する断面図、第３図と第４図は従来の接続
ピンの溶着状態を示す断面図である。
図において、１はＬＳＩモジユール、３は多層
配線基板、４はリードピン、５はコネクタ、６，
１４はガイド孔、７，１２は接続ピン、８は半田
溜め、９はプリント基板、１０はスルーホール、
１１は耐熱性基板、１３は結晶化ガス、１５は低
融点半田、である。
Fig. 1 is a sectional view explaining the connector structure according to the present invention, and Fig. 1A shows the state before connecting the connecting pins;
Figure B is a state diagram with the connector connected, Figure 2 is L
FIGS. 3 and 4 are cross-sectional views for explaining the connector connection of the SI module to the printed circuit board, and FIGS. 3 and 4 are cross-sectional views showing the welded state of conventional connection pins. In the figure, 1 is an LSI module, 3 is a multilayer wiring board, 4 is a lead pin, 5 is a connector, 6,
14 is a guide hole, 7 and 12 are connection pins, 8 is a solder reservoir, 9 is a printed circuit board, 10 is a through hole,
11 is a heat-resistant substrate, 13 is a crystallizing gas, and 15 is a low melting point solder.
Claims (1)
ンがコネクタ基板の上部にマトリツクス状に配設
された半田溜に挿入固定されると共に該半田溜の
下部に設けた接点ピンによりプリント基板のスル
ーホール孔に挿入し固定するコネクタにおいて、
接点ピンのコネクタ基板への接合部およびこの上
部に設けた半田溜がそれぞれ擂鉢状の傾斜を備え
て形成されていると共に接点ピンの頭部がこれに
嵌合する形状に傾斜を付けて設けられており、該
接点ピンを前記コネクタ基板に挿入し溶着してな
ることを特徴とする高密度コネクタ。 The lead pins of the module equipped with multiple LSIs are inserted and fixed into the solder pools arranged in a matrix on the top of the connector board, and are inserted into the through holes of the printed circuit board using the contact pins provided at the bottom of the solder pools. In the connector to be fixed,
The joint portion of the contact pin to the connector board and the solder reservoir provided on the top thereof are each formed with a mortar-like slope, and the head of the contact pin is provided with a slope to fit into the joint portion. A high-density connector characterized in that the contact pins are inserted into the connector board and welded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14514684U JPH023266Y2 (en) | 1984-09-26 | 1984-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14514684U JPH023266Y2 (en) | 1984-09-26 | 1984-09-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6161773U true JPS6161773U (en) | 1986-04-25 |
| JPH023266Y2 JPH023266Y2 (en) | 1990-01-25 |
Family
ID=30703403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14514684U Expired JPH023266Y2 (en) | 1984-09-26 | 1984-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH023266Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010049835A (en) * | 2008-08-19 | 2010-03-04 | Toyota Motor Corp | Electronic component built-in connector |
-
1984
- 1984-09-26 JP JP14514684U patent/JPH023266Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010049835A (en) * | 2008-08-19 | 2010-03-04 | Toyota Motor Corp | Electronic component built-in connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH023266Y2 (en) | 1990-01-25 |
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