JPS5874365U - printed wiring body - Google Patents
printed wiring bodyInfo
- Publication number
- JPS5874365U JPS5874365U JP16979481U JP16979481U JPS5874365U JP S5874365 U JPS5874365 U JP S5874365U JP 16979481 U JP16979481 U JP 16979481U JP 16979481 U JP16979481 U JP 16979481U JP S5874365 U JPS5874365 U JP S5874365U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- sub
- wiring body
- printed wiring
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は従来のプリント配線体の組立前の概
略斜視図及び組立後の部分拡大断面図、第３図及び第４
図は第１図のサブプリント基板凸部の表面図及び裏面図
、第５図は第２図のメインプリント基板の部分裏面図、
第６図及び第７図は本考案の一実施例を示す組立前の概
略斜視図及びＩ−■線に沿う拡大断面図、第８図は第６
図の組立後の部分拡大断面図、第９図及び第１０図は第
６図のサブプリント基板の製造例を説明するため□の各
工程での部分断面図である。、
１１・・・・・・メインプリント基板、１２五・・・嵌
合穴、１３・・・・・・サブプリント基板、１４・・・
・・・凸部、１５゜１６、 １７． １８・・・・・・
導電ランド、１８′・・・・・・半田付部分、１９．２
０・・・・・・半田。Figures 1 and 2 are a schematic perspective view of a conventional printed wiring body before assembly, a partially enlarged sectional view after assembly, and Figures 3 and 4.
The figure is a front view and a back view of the convex part of the sub-printed board in Fig. 1, and Fig. 5 is a partial back view of the main printed board in Fig. 2.
6 and 7 are a schematic perspective view and an enlarged sectional view taken along the line I-■, showing one embodiment of the present invention before assembly, and FIG.
FIGS. 9 and 10 are partially enlarged cross-sectional views after assembly, and are partial cross-sectional views at each step of □ for explaining an example of manufacturing the sub-printed board shown in FIG. 6. , 11... Main printed board, 125... Fitting hole, 13... Sub printed board, 14...
...Protrusion, 15°16, 17. 18...
Conductive land, 18'...Soldering part, 19.2
0...Solder.
Claims (1)
板の一端部に形成した凸部を嵌合し、−サブプリント基
板の凸部両面の導電ランドと対応するメインプリント基
板の導電ランドとを半田結合するプリント配線体であっ
て、前記凸部の一方の導電ランド面を前記サブプリント
基板からフリーにし、前記半田結合のヒートサイクル特
性の低下を阻止したことを特徴とするプリント配線体。Fit the protrusion formed at one end of the sub-printed board into the fitting hole formed on the main printed board, and solder connect the conductive lands on both sides of the protrusion on the sub-printed board and the corresponding conductive lands on the main printed board. 1. A printed wiring body, characterized in that one conductive land surface of the convex portion is free from the sub-printed board to prevent deterioration of heat cycle characteristics of the solder bond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16979481U JPS5874365U (en) | 1981-11-14 | 1981-11-14 | printed wiring body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16979481U JPS5874365U (en) | 1981-11-14 | 1981-11-14 | printed wiring body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5874365U true JPS5874365U (en) | 1983-05-19 |
Family
ID=29961767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16979481U Pending JPS5874365U (en) | 1981-11-14 | 1981-11-14 | printed wiring body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5874365U (en) |
-
1981
- 1981-11-14 JP JP16979481U patent/JPS5874365U/en active Pending
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