JPS6161725B2 - - Google Patents
Info
- Publication number
- JPS6161725B2 JPS6161725B2 JP56173819A JP17381981A JPS6161725B2 JP S6161725 B2 JPS6161725 B2 JP S6161725B2 JP 56173819 A JP56173819 A JP 56173819A JP 17381981 A JP17381981 A JP 17381981A JP S6161725 B2 JPS6161725 B2 JP S6161725B2
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- metal paste
- sheet
- conductor
- triplate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 26
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000010304 firing Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- MUJOIMFVNIBMKC-UHFFFAOYSA-N fludioxonil Chemical compound C=12OC(F)(F)OC2=CC=CC=1C1=CNC=C1C#N MUJOIMFVNIBMKC-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17381981A JPS5873204A (ja) | 1981-10-27 | 1981-10-27 | トリプレ−ト構造のマイクロ波伝送線路の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17381981A JPS5873204A (ja) | 1981-10-27 | 1981-10-27 | トリプレ−ト構造のマイクロ波伝送線路の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5873204A JPS5873204A (ja) | 1983-05-02 |
JPS6161725B2 true JPS6161725B2 (de) | 1986-12-26 |
Family
ID=15967735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17381981A Granted JPS5873204A (ja) | 1981-10-27 | 1981-10-27 | トリプレ−ト構造のマイクロ波伝送線路の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5873204A (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007044438A (ja) * | 2005-08-12 | 2007-02-22 | Omron Healthcare Co Ltd | 電子血圧計 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5821902A (ja) * | 1981-07-30 | 1983-02-09 | Murata Mfg Co Ltd | ストリツプラインの製造方法 |
-
1981
- 1981-10-27 JP JP17381981A patent/JPS5873204A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5821902A (ja) * | 1981-07-30 | 1983-02-09 | Murata Mfg Co Ltd | ストリツプラインの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS5873204A (ja) | 1983-05-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6184477B1 (en) | Multi-layer circuit substrate having orthogonal grid ground and power planes | |
US4777718A (en) | Method of forming and connecting a resistive layer on a pc board | |
US20030151863A1 (en) | Power splitter having counter rotating circuit lines | |
JP4278326B2 (ja) | 空洞内における非対称型ストリップライン及びマイクロストリップ間の遷移 | |
JP3347607B2 (ja) | 積層型導波管線路 | |
US4737747A (en) | Printed circuit resistive element | |
JPS6161725B2 (de) | ||
KR100287646B1 (ko) | 스트립 라인 구조를 갖는 마이크로웨이브 소자 및 그의제조방법 | |
JPH06252612A (ja) | ストリップ線路内蔵回路基板 | |
JP3126382B2 (ja) | 回路の製造方法 | |
JP2000068149A (ja) | 積層電子部品及びその製造方法 | |
JPS5892102A (ja) | トリプレ−ト線路の接続方法 | |
JP3784185B2 (ja) | 電子部品搭載用配線基板 | |
JP3784188B2 (ja) | 電子部品搭載用配線基板 | |
JP2000188475A (ja) | セラミック多層基板の製造方法 | |
JP2871613B2 (ja) | マルチチップモジュール用基板及びその製造方法 | |
JP2737652B2 (ja) | 多層セラミック基板およびその製造方法 | |
JPH05183306A (ja) | トリプレート構造の誘電体基板 | |
JPH0945830A (ja) | チップ状電子部品 | |
US6670856B1 (en) | Tunable broadside coupled transmission lines for electromagnetic waves | |
JP2540933B2 (ja) | 半導体素子と回路基板又はキャリヤとの接続方法 | |
JP4644989B2 (ja) | セラミック回路基板の製造方法 | |
JPH03131102A (ja) | 半導体素子と回路基板又はキャリヤとの接続方法 | |
JP2869258B2 (ja) | 誘電体共振器およびフィルタの製造方法 | |
JPH01257397A (ja) | 金属プリント基板 |