JPS6161389A - マルチリ−ド接続方法 - Google Patents
マルチリ−ド接続方法Info
- Publication number
- JPS6161389A JPS6161389A JP18331184A JP18331184A JPS6161389A JP S6161389 A JPS6161389 A JP S6161389A JP 18331184 A JP18331184 A JP 18331184A JP 18331184 A JP18331184 A JP 18331184A JP S6161389 A JPS6161389 A JP S6161389A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- flexible printed
- printed circuit
- circuit board
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18331184A JPS6161389A (ja) | 1984-08-31 | 1984-08-31 | マルチリ−ド接続方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18331184A JPS6161389A (ja) | 1984-08-31 | 1984-08-31 | マルチリ−ド接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6161389A true JPS6161389A (ja) | 1986-03-29 |
| JPH0223992B2 JPH0223992B2 (enExample) | 1990-05-28 |
Family
ID=16133466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18331184A Granted JPS6161389A (ja) | 1984-08-31 | 1984-08-31 | マルチリ−ド接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6161389A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01136122A (ja) * | 1987-11-24 | 1989-05-29 | Nec Corp | 液晶ディスプレイ駆動基板の接続方法 |
| JPH02236978A (ja) * | 1989-03-08 | 1990-09-19 | Hitachi Chem Co Ltd | 回路接続装置 |
-
1984
- 1984-08-31 JP JP18331184A patent/JPS6161389A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01136122A (ja) * | 1987-11-24 | 1989-05-29 | Nec Corp | 液晶ディスプレイ駆動基板の接続方法 |
| JPH02236978A (ja) * | 1989-03-08 | 1990-09-19 | Hitachi Chem Co Ltd | 回路接続装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0223992B2 (enExample) | 1990-05-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100600454B1 (ko) | 전자소자의 실장방법 | |
| KR100476126B1 (ko) | 액정패널의압착장치및액정장치의제조방법 | |
| CN100426479C (zh) | 搭接方法及其搭接装置 | |
| JPS6161389A (ja) | マルチリ−ド接続方法 | |
| JP3416979B2 (ja) | 接合装置 | |
| JP3028740B2 (ja) | 光ビームはんだ付け方法 | |
| KR100549796B1 (ko) | 레이저를 이용한 이방전도성필름 본딩 장치 및 방법 | |
| JP3109757B2 (ja) | テープキャリアパッケージと回路基板との接続方法 | |
| KR100879005B1 (ko) | 레이저 본딩장치 및 레이저 본딩방법 | |
| CN107949178A (zh) | 一种利用激光密封薄膜线路板的装置及工艺方法 | |
| JP2662598B2 (ja) | 回路接続装置 | |
| JPH0541091U (ja) | 異方導電圧着装置 | |
| JP2003140179A (ja) | 液晶表示パネルへの回路部品接続装置 | |
| JPH019105Y2 (enExample) | ||
| JP3747849B2 (ja) | 電子部品のボンディング装置およびボンディング方法 | |
| JP2005136257A (ja) | 実装部品の導通接合方法 | |
| CN102184680A (zh) | 用于绑定平板显示器的方法和装置 | |
| JP3152449B2 (ja) | Ic部品のリード接合装置及び方法 | |
| CN1915645A (zh) | 热压机 | |
| KR100645003B1 (ko) | 백업플레이트에서 열을 가하는 열 압착 방법 및 압착부 | |
| JP3256144B2 (ja) | ボンディング装置 | |
| JP3521453B2 (ja) | 回路基板接続方法 | |
| JP2001007128A (ja) | 基板間の接続方法及び基板間接続装置 | |
| JPH04322492A (ja) | Lcdに対するtcp接続方法およびその接続装置 | |
| JPH04303582A (ja) | 圧着方法および圧着装置 |