JPS6161253B2 - - Google Patents
Info
- Publication number
- JPS6161253B2 JPS6161253B2 JP4510379A JP4510379A JPS6161253B2 JP S6161253 B2 JPS6161253 B2 JP S6161253B2 JP 4510379 A JP4510379 A JP 4510379A JP 4510379 A JP4510379 A JP 4510379A JP S6161253 B2 JPS6161253 B2 JP S6161253B2
- Authority
- JP
- Japan
- Prior art keywords
- hydrofluoric acid
- silicon substrate
- drying
- dioxide film
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4510379A JPS55138236A (en) | 1979-04-12 | 1979-04-12 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4510379A JPS55138236A (en) | 1979-04-12 | 1979-04-12 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55138236A JPS55138236A (en) | 1980-10-28 |
| JPS6161253B2 true JPS6161253B2 (enExample) | 1986-12-24 |
Family
ID=12709945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4510379A Granted JPS55138236A (en) | 1979-04-12 | 1979-04-12 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55138236A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2865876B2 (ja) * | 1994-04-06 | 1999-03-08 | フィッシャーヴェルケ アルツール フィッシャー ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト | 自動車組み付け用の特に傘のための保管装置 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62252140A (ja) * | 1986-04-25 | 1987-11-02 | Nippon Mining Co Ltd | InPウエ−ハの洗浄方法 |
| US5098866A (en) * | 1988-12-27 | 1992-03-24 | Texas Instruments Incorporated | Method for reducing hot-electron-induced degradation of device characteristics |
-
1979
- 1979-04-12 JP JP4510379A patent/JPS55138236A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2865876B2 (ja) * | 1994-04-06 | 1999-03-08 | フィッシャーヴェルケ アルツール フィッシャー ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト | 自動車組み付け用の特に傘のための保管装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55138236A (en) | 1980-10-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2899344A (en) | Rinse in | |
| US2961354A (en) | Surface treatment of semiconductive devices | |
| WO2019125853A1 (en) | Freezing a sacrificial material in forming a semiconductor | |
| JPS6161253B2 (enExample) | ||
| JPH0380338B2 (enExample) | ||
| US6207588B1 (en) | Method for simultaneously forming thinner and thicker parts of a dual oxide layer having varying thicknesses | |
| JPH10270434A (ja) | 半導体ウエーハの洗浄方法及び酸化膜の形成方法 | |
| US10475656B2 (en) | Hydrosilylation in semiconductor processing | |
| JPH05160095A (ja) | 半導体ウェハーの洗浄乾燥方法 | |
| JP2000150511A (ja) | 酸化タンタル膜の熱処理方法 | |
| KR950001904A (ko) | 게이트전극 형성방법 | |
| JPH0252431A (ja) | 半導体装置の製造方法 | |
| JPS6476726A (en) | Manufacture of semiconductor | |
| KR950030397A (ko) | 반도체 소자의 캐패시터 형성방법 | |
| KR0179022B1 (ko) | 반도체장치의 소자격리방법 | |
| JPH0474421A (ja) | 半導体装置の製造方法 | |
| JP2875503B2 (ja) | 半導体の処理方法 | |
| KR970003582A (ko) | 반도체 웨이퍼 세정방법 | |
| JPH04326518A (ja) | 半導体装置の洗浄方法 | |
| JPH04113623A (ja) | 絶縁膜の形成方法 | |
| JPH043661B2 (enExample) | ||
| JPS593869B2 (ja) | シリコンゲ−ト型電界効果半導体装置の製造方法 | |
| KR940001301A (ko) | 접촉창 표면세정방법 | |
| JPH04206640A (ja) | メサ型半導体素子の形成方法 | |
| JPH02299233A (ja) | 半導体装置の製造方法 |