JPS6159815A - 封入されたチツプコンデンサ - Google Patents
封入されたチツプコンデンサInfo
- Publication number
- JPS6159815A JPS6159815A JP60181959A JP18195985A JPS6159815A JP S6159815 A JPS6159815 A JP S6159815A JP 60181959 A JP60181959 A JP 60181959A JP 18195985 A JP18195985 A JP 18195985A JP S6159815 A JPS6159815 A JP S6159815A
- Authority
- JP
- Japan
- Prior art keywords
- tantalum
- insulator
- capacitor
- chip capacitor
- encapsulated chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims description 38
- 229910052715 tantalum Inorganic materials 0.000 claims description 25
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000001465 metallisation Methods 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims 8
- ROSDCCJGGBNDNL-UHFFFAOYSA-N [Ta].[Pb] Chemical compound [Ta].[Pb] ROSDCCJGGBNDNL-UHFFFAOYSA-N 0.000 claims 1
- 238000000576 coating method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000012261 overproduction Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Emergency Protection Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US643184 | 1984-08-22 | ||
| US06/643,184 US4561041A (en) | 1984-08-22 | 1984-08-22 | Escapsulated chip capacitor assemblies |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6159815A true JPS6159815A (ja) | 1986-03-27 |
| JPH0467768B2 JPH0467768B2 (US07321065-20080122-C00160.png) | 1992-10-29 |
Family
ID=24579716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60181959A Granted JPS6159815A (ja) | 1984-08-22 | 1985-08-21 | 封入されたチツプコンデンサ |
Country Status (5)
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4688322A (en) * | 1986-02-06 | 1987-08-25 | Sprague Electric Company | Solid electrolyte chip capacitor method |
| US4972299A (en) * | 1987-12-09 | 1990-11-20 | Nippon Chemi-Con Corporation | Chip type capacitor and manufacturing thereof |
| US4910642A (en) * | 1988-12-05 | 1990-03-20 | Sundstrand Corporation | Coolant activated contact compact high intensity cooler |
| JP2541357B2 (ja) * | 1990-10-29 | 1996-10-09 | 日本電気株式会社 | チップ型固体電解コンデンサの製造方法 |
| US5390074A (en) * | 1991-09-30 | 1995-02-14 | Matsushita Electric Industrial Co., Ltd. | Chip-type solid electrolytic capacitor and method of manufacturing the same |
| JP3150244B2 (ja) * | 1993-07-09 | 2001-03-26 | ローム株式会社 | 固体電解コンデンサにおけるコンデンサ素子の構造 |
| JP5453174B2 (ja) * | 2010-06-01 | 2014-03-26 | Ｎｅｃトーキン株式会社 | 下面電極型の固体電解積層コンデンサおよびその実装体 |
| US9941056B2 (en) | 2013-01-25 | 2018-04-10 | Kemet Electronics Corporation | Solid electrolytic capacitor and method |
| CN108054012A (zh) * | 2017-12-15 | 2018-05-18 | 株洲中电电容器有限公司 | 一种可表贴安装的模塑封装液体钽电容器 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50118243A (US07321065-20080122-C00160.png) * | 1974-03-04 | 1975-09-16 | ||
| JPS54126951A (en) * | 1978-03-24 | 1979-10-02 | Matsushita Electric Ind Co Ltd | Method of producing solid electrolytic condenser |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1064368A (en) * | 1965-11-02 | 1967-04-05 | Standard Telephones Cables Ltd | Capacitor |
| GB1116328A (en) * | 1967-03-17 | 1968-06-06 | Standard Telephones Cables Ltd | Solid electrolytic capacitors |
| US3579813A (en) * | 1968-12-23 | 1971-05-25 | Matsuo Electric Co | Method of making electronic components on comblike metal fingers and severing the fingers |
| US3581159A (en) * | 1969-11-12 | 1971-05-25 | Union Carbide Corp | Solid electrolyte capacitor having improved counterelectrode system |
| US3789274A (en) * | 1972-07-24 | 1974-01-29 | Sprague Electric Co | Solid electrolytic capacitors having hard solder cathode coating |
| US3971970A (en) * | 1974-11-27 | 1976-07-27 | P. R. Mallory & Co., Inc. | Electrical component with low impedance at high frequency |
| CA1077582A (en) * | 1975-12-10 | 1980-05-13 | Mallory Components Limited | Termination means for an electrical device |
| JPS5845171B2 (ja) * | 1976-01-30 | 1983-10-07 | 日本電気株式会社 | 固体電解コンデンサの製造方法 |
| US4090288A (en) * | 1976-03-15 | 1978-05-23 | Sprague Electric Company | Solid electrolyte capacitor with metal loaded resin end caps |
| US4064611A (en) * | 1977-01-14 | 1977-12-27 | Sprague Electric Company | Method for terminating solid electrolyte capacitors |
| US4107762A (en) * | 1977-05-16 | 1978-08-15 | Sprague Electric Company | Solid electrolyte capacitor package with an exothermically-alloyable fuse |
| US4282645A (en) * | 1978-07-31 | 1981-08-11 | Sprague Electric Company | Method of assembling an encapsulated chip capacitor |
| JPS6026289B2 (ja) * | 1979-04-13 | 1985-06-22 | ソニー株式会社 | タンタルコンデンサ |
| US4288842A (en) * | 1979-06-11 | 1981-09-08 | Emhart Industries, Inc. | Solid chip capacitor and method of manufacture |
| JPS58196829U (ja) * | 1982-06-24 | 1983-12-27 | 松尾電機株式会社 | 固体電解コンデンサ |
| US4488204A (en) * | 1983-11-01 | 1984-12-11 | Union Carbide Corporation | Device for use in making encapsulated chip capacitor assemblies |
-
1984
- 1984-08-22 US US06/643,184 patent/US4561041A/en not_active Expired - Lifetime
-
1985
- 1985-08-09 CA CA000488453A patent/CA1220825A/en not_active Expired
- 1985-08-18 EP EP85110322A patent/EP0173192B1/en not_active Expired
- 1985-08-18 DE DE8585110322T patent/DE3568509D1/de not_active Expired
- 1985-08-21 JP JP60181959A patent/JPS6159815A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50118243A (US07321065-20080122-C00160.png) * | 1974-03-04 | 1975-09-16 | ||
| JPS54126951A (en) * | 1978-03-24 | 1979-10-02 | Matsushita Electric Ind Co Ltd | Method of producing solid electrolytic condenser |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3568509D1 (en) | 1989-04-06 |
| JPH0467768B2 (US07321065-20080122-C00160.png) | 1992-10-29 |
| EP0173192A1 (en) | 1986-03-05 |
| EP0173192B1 (en) | 1989-03-01 |
| CA1220825A (en) | 1987-04-21 |
| US4561041A (en) | 1985-12-24 |
