JPS6158967B2 - - Google Patents
Info
- Publication number
- JPS6158967B2 JPS6158967B2 JP9473881A JP9473881A JPS6158967B2 JP S6158967 B2 JPS6158967 B2 JP S6158967B2 JP 9473881 A JP9473881 A JP 9473881A JP 9473881 A JP9473881 A JP 9473881A JP S6158967 B2 JPS6158967 B2 JP S6158967B2
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- ionized
- vapor
- semiconductor
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Photovoltaic Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9473881A JPS57208126A (en) | 1981-06-18 | 1981-06-18 | Manufacture of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9473881A JPS57208126A (en) | 1981-06-18 | 1981-06-18 | Manufacture of semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57208126A JPS57208126A (en) | 1982-12-21 |
| JPS6158967B2 true JPS6158967B2 (cg-RX-API-DMAC7.html) | 1986-12-13 |
Family
ID=14118448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9473881A Granted JPS57208126A (en) | 1981-06-18 | 1981-06-18 | Manufacture of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57208126A (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6230315A (ja) * | 1985-07-31 | 1987-02-09 | Anelva Corp | 電子銃装置 |
-
1981
- 1981-06-18 JP JP9473881A patent/JPS57208126A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57208126A (en) | 1982-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH11504751A (ja) | 窒化ホウ素冷陰極 | |
| JP3041133B2 (ja) | イオン化蒸着装置 | |
| US6913675B2 (en) | Film forming apparatus, substrate for forming oxide thin film, and production method thereof | |
| US5952061A (en) | Fabrication and method of producing silicon films | |
| EP0029747A1 (en) | An apparatus for vacuum deposition and a method for forming a thin film by the use thereof | |
| JPS6158967B2 (cg-RX-API-DMAC7.html) | ||
| JPS6158968B2 (cg-RX-API-DMAC7.html) | ||
| JPS63472A (ja) | 真空成膜装置 | |
| JPS5941509B2 (ja) | 強付着性の特に硬質炭素層を大きな面積に蒸着するための装置 | |
| JP2971541B2 (ja) | 薄膜形成装置 | |
| JP3007579B2 (ja) | シリコン薄膜の製造方法 | |
| JP3174313B2 (ja) | 薄膜形成装置 | |
| JP3452458B2 (ja) | 薄膜形成装置 | |
| JPS60211823A (ja) | 薄膜半導体形成装置 | |
| JP2905512B2 (ja) | 薄膜形成装置 | |
| JPS63213664A (ja) | イオンプレ−テイング装置 | |
| JPS639743B2 (cg-RX-API-DMAC7.html) | ||
| JP3330632B2 (ja) | 薄膜蒸着装置 | |
| JP2002069616A (ja) | アナターゼ型酸化チタン薄膜の製造方法 | |
| JPH0525616A (ja) | 薄膜形成装置 | |
| JPS6157695B2 (cg-RX-API-DMAC7.html) | ||
| JPS5837247B2 (ja) | アモルフアスシリコンの製造方法 | |
| JPH0472061A (ja) | 薄膜形成装置 | |
| JPH0610334B2 (ja) | 高融点・高沸点・高硬度物質の硼化薄膜形成方法 | |
| JPS60125369A (ja) | 薄膜蒸着装置 |