JPS6155773B2 - - Google Patents
Info
- Publication number
- JPS6155773B2 JPS6155773B2 JP54092581A JP9258179A JPS6155773B2 JP S6155773 B2 JPS6155773 B2 JP S6155773B2 JP 54092581 A JP54092581 A JP 54092581A JP 9258179 A JP9258179 A JP 9258179A JP S6155773 B2 JPS6155773 B2 JP S6155773B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- die pad
- wiring layer
- emitting diode
- metal wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W90/00—
-
- H10W72/073—
-
- H10W72/075—
-
- H10W72/50—
-
- H10W72/5363—
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- H10W72/5522—
-
- H10W72/884—
-
- H10W90/734—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9258179A JPS5618480A (en) | 1979-07-23 | 1979-07-23 | Manufacture of display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9258179A JPS5618480A (en) | 1979-07-23 | 1979-07-23 | Manufacture of display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5618480A JPS5618480A (en) | 1981-02-21 |
| JPS6155773B2 true JPS6155773B2 (enExample) | 1986-11-29 |
Family
ID=14058389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9258179A Granted JPS5618480A (en) | 1979-07-23 | 1979-07-23 | Manufacture of display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5618480A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5844726A (ja) * | 1981-09-11 | 1983-03-15 | Nippon Telegr & Teleph Corp <Ntt> | ゲッタリング方法 |
| JP2531636B2 (ja) * | 1986-08-18 | 1996-09-04 | ロ−ム株式会社 | サ−マルヘツド |
| JP3736001B2 (ja) * | 1996-02-29 | 2006-01-18 | 株式会社デンソー | 電子部品の実装方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51126068A (en) * | 1975-04-25 | 1976-11-02 | Hitachi Ltd | Manufacturing method of semi-conductor equipment |
-
1979
- 1979-07-23 JP JP9258179A patent/JPS5618480A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5618480A (en) | 1981-02-21 |
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