JPS6153875B2 - - Google Patents

Info

Publication number

JPS6153875B2

JPS6153875B2 JP7845178A JP7845178A JPS6153875B2 JP S6153875 B2 JPS6153875 B2 JP S6153875B2 JP 7845178 A JP7845178 A JP 7845178A JP 7845178 A JP7845178 A JP 7845178A JP S6153875 B2 JPS6153875 B2 JP S6153875B2

Authority

JP

Japan

Prior art keywords

pressure

pressure receiving

hole

sensing element

sensitive element

Prior art date

1978-06-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 229910052751 metal Inorganic materials 0.000 claims description 26
• 239000002184 metal Substances 0.000 claims description 26
• 229910000679 solder Inorganic materials 0.000 claims description 21
• 239000011521 glass Substances 0.000 claims description 10
• 239000004065 semiconductor Substances 0.000 claims description 9
• 238000002844 melting Methods 0.000 claims description 8
• 230000008018 melting Effects 0.000 claims description 7
• 230000005540 biological transmission Effects 0.000 claims description 2
• 229910052710 silicon Inorganic materials 0.000 description 19
• 239000010703 silicon Substances 0.000 description 19
• XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 18
• 239000000853 adhesive Substances 0.000 description 12
• 230000001070 adhesive effect Effects 0.000 description 12
• 238000007747 plating Methods 0.000 description 8
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
• 239000010408 film Substances 0.000 description 6
• 230000000694 effects Effects 0.000 description 4
• 239000000126 substance Substances 0.000 description 4
• 238000006243 chemical reaction Methods 0.000 description 3
• 238000000034 method Methods 0.000 description 3
• 229910052759 nickel Inorganic materials 0.000 description 3
• 229910052782 aluminium Inorganic materials 0.000 description 2
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
• 239000000919 ceramic Substances 0.000 description 2
• 239000007789 gas Substances 0.000 description 2
• 230000032683 aging Effects 0.000 description 1
• 238000009530 blood pressure measurement Methods 0.000 description 1
• 229910052878 cordierite Inorganic materials 0.000 description 1
• 230000007812 deficiency Effects 0.000 description 1
• 238000009792 diffusion process Methods 0.000 description 1
• JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
• 230000005611 electricity Effects 0.000 description 1
• 238000007772 electroless plating Methods 0.000 description 1
• 229910052737 gold Inorganic materials 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• 238000009434 installation Methods 0.000 description 1
• 229910000833 kovar Inorganic materials 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 238000005259 measurement Methods 0.000 description 1
• 238000010297 mechanical methods and process Methods 0.000 description 1
• 150000003376 silicon Chemical class 0.000 description 1
• 229910052709 silver Inorganic materials 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 238000004381 surface treatment Methods 0.000 description 1
• 239000010409 thin film Substances 0.000 description 1
• 238000007740 vapor deposition Methods 0.000 description 1
• 238000009736 wetting Methods 0.000 description 1