JPS6149111B2 - - Google Patents
Info
- Publication number
- JPS6149111B2 JPS6149111B2 JP57009598A JP959882A JPS6149111B2 JP S6149111 B2 JPS6149111 B2 JP S6149111B2 JP 57009598 A JP57009598 A JP 57009598A JP 959882 A JP959882 A JP 959882A JP S6149111 B2 JPS6149111 B2 JP S6149111B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- polyimide resin
- resin
- stainless steel
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001721 polyimide Polymers 0.000 claims description 25
- 239000009719 polyimide resin Substances 0.000 claims description 19
- 229910001220 stainless steel Inorganic materials 0.000 claims description 15
- 239000010935 stainless steel Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 14
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 239000000758 substrate Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 229920002284 Cellulose triacetate Polymers 0.000 description 4
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical group FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57009598A JPS58128846A (ja) | 1982-01-26 | 1982-01-26 | ポリイミド系樹脂片面銅張積層板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57009598A JPS58128846A (ja) | 1982-01-26 | 1982-01-26 | ポリイミド系樹脂片面銅張積層板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58128846A JPS58128846A (ja) | 1983-08-01 |
| JPS6149111B2 true JPS6149111B2 (ru) | 1986-10-28 |
Family
ID=11724752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57009598A Granted JPS58128846A (ja) | 1982-01-26 | 1982-01-26 | ポリイミド系樹脂片面銅張積層板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58128846A (ru) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH062369B2 (ja) * | 1985-08-02 | 1994-01-12 | 三井石油化学工業株式会社 | 多層プリント配線基板製造用ポリ４―メチル―１―ペンテン製表面粗化フィルム及びシート |
| CA1296833C (en) * | 1988-04-05 | 1992-03-03 | Erica Marie-Jose Besso | Polymethylpentene release sheet |
| US5057372A (en) * | 1989-03-22 | 1991-10-15 | The Dow Chemical Company | Multilayer film and laminate for use in producing printed circuit boards |
| JP2012054515A (ja) * | 2010-09-03 | 2012-03-15 | Fuji Electric Co Ltd | 太陽電池モジュールの製造方法 |
| CN102529222B (zh) * | 2010-12-15 | 2014-07-02 | 新高电子材料（中山）有限公司 | 一种低热阻高绝缘金属基覆铜板及其制备方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5698135A (en) * | 1980-01-07 | 1981-08-07 | Toshiba Chem Corp | Preparation of polymide resin laminated plate with one copper |
| JPS56111637A (en) * | 1979-08-22 | 1981-09-03 | Hitachi Chem Co Ltd | Production of adhesive-coated laminated sheet |
| JPS5770654A (en) * | 1980-10-22 | 1982-05-01 | Mitsubishi Gas Chemical Co | Manufacture of laminated board |
-
1982
- 1982-01-26 JP JP57009598A patent/JPS58128846A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56111637A (en) * | 1979-08-22 | 1981-09-03 | Hitachi Chem Co Ltd | Production of adhesive-coated laminated sheet |
| JPS5698135A (en) * | 1980-01-07 | 1981-08-07 | Toshiba Chem Corp | Preparation of polymide resin laminated plate with one copper |
| JPS5770654A (en) * | 1980-10-22 | 1982-05-01 | Mitsubishi Gas Chemical Co | Manufacture of laminated board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58128846A (ja) | 1983-08-01 |
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