JPS6147699A - Sealed cooler - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a closed type cooling device whose cooling method is similar to that of a natural body.

[Technical background of the invention and its problems]

A conventional closed-type cooling device is shown in FIG. 5, which is an internal perspective view with the front door omitted.
A cooling fin 1, which also serves as the side surface of the casing, houses a high heat generating element 2 such as a semiconductor element, and other electrical components 3 of low heat generating elements, for example, inside the casing.

In a conventional closed type cooling device, a high heat generating body 2 such as a semiconductor element is cooled by cooling fins 1, but a low heat generating body 3 is used. Other electrical components may be adversely affected, and if the internal temperature of the casing exceeds the permissible temperature of the electrical components, the electrical components may be destroyed.

Generally, the permissible temperature of a high heating element 2 such as a semiconductor element is approximately 11
The allowable temperature of the low heating element 3 for other electrical components is approximately 60-70' (5-150°C).

Therefore, it was necessary to make the cooling fins 1 thicker in order to keep the temperature inside the casing of the closed type cooling device below the permissible temperature of the low heating element 3 of about 60Ω to 70°C.

By increasing the size of the cooling fins 1, the entire device also becomes larger, heavier, and more expensive.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned points, and an object of the present invention is to provide a closed type cooling device in which the cooling fins are miniaturized and the low heat generation element is not influenced by the high heat generation element.

[Summary of the Invention] In order to achieve this object, the present invention is characterized in that the high heat generating element inside the casing is surrounded by a heat insulating material to facilitate heating of the high heat generating element and the low heat generating element. be.

[Embodiment of the Invention] Hereinafter, an embodiment of the present invention will be described with reference to FIG. 1, in which the same parts as in FIG. 5 are denoted by the same symbols.

Figure 1 is an internal perspective view with the front door omitted;
2 is a high heat generating element that is attached directly to the cooling fin II, 3 is a low heat generating element that is attached to the inside of the back plate of the casing, and 5 is a heat insulating material. This is a heat insulating board. When arranged as shown in FIG. 1, the high heat generating element 2 is surrounded by the heat insulating plate 5 and the front, rear and top plates of the casing and is thermally isolated.

With this configuration, the heat of the high heating element 2 does not flow into the low heating element 3, so that the temperature of the low heating element 3 can be set to a desired temperature without being increased by the heat of the high heating element 2. .

FIG. 2 is a perspective view showing another embodiment of the present invention.
is attached to the cooling fin by surrounding the high heating element 2 with a heat insulating plate 5. 'In Figures 1 and 2, we used some plates of the casing to thermally protect the high heat generating element 2, but without using the plates of the casing, we By surrounding it with a heat insulating plate 5, even better heat shielding can be achieved.

3 and 4 are perspective views showing still other embodiments of the present invention. With this Iζ configuration, the heat inside the housing can be radiated to the outside via the heat exchanger 4, and the cooling effect is further improved.

〔Effect of the invention〕

As explained above, according to the present invention, by thermally blocking the high-heating element and the low-heating element, the cooling fins that constitute a part of the housing can be made smaller, thereby reducing the size of the housing. The effect of weight reduction and cost reduction can be obtained.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a hermetic cooling device showing one embodiment of the present invention, FIGS. 2 to 4 are perspective views of a hermetic cooling device showing other different embodiments of the invention, and FIG. The figure is a perspective view of a conventional hermetic cooling device. 1... Cooling fin 2... High heating element 3... Low heating element 4... Heat exchanger 5... Heat insulating board.

Claims (3)

[Claims] (1) At least one surface other than the top surface of the casing is composed of cooling fins, a high heat generating element is attached to the inner surface of the casing of the cooling fin, and a low heat generating element is placed at an appropriate position within the casing. What is claimed is: 1. A closed cooling device comprising: a heat insulating plate surrounding the high heat generating element to thermally shield the high heat generating element and the low heat generating element. (2) The hermetic cooling device according to claim 1, wherein a plate forming a housing is used as a part of the heat insulating plate. (3) At least one surface other than the top surface of the casing is constituted by cooling fins, a high heat generating element is attached to the inner surface of the casing of the cooling fin, and a low heat generating element is placed at an appropriate position within the casing. A closed type cooling device, characterized in that the high heat generating element is surrounded by a heat insulating plate for thermally shielding the high heat generating element and the low heat generating element, and a heat exchanger is provided on the upper surface of the housing. Cooling system.