JPS61208296A - Electronic equipment box body - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field of invention] The present invention relates to an electronic device housing.

[Technical background of the invention and its problems]

Recently, the heat generation density of electronic elements such as ICs, LSIs, and even power transistors has been increasing, and it has become important to take measures to cool electronic equipment housings in which they are mounted. However, it has become a problem that electronic devices cause unnecessary electromagnetic waves to interfere with other devices, and for example, it is necessary to protect power supplies from electromagnetic waves. This situation is extremely difficult to deal with since it goes against cooling measures.

Conventionally, electronic devices were housed together with the board in a small internal casing, which was then housed in a larger external casing, and the minimum necessary ventilation holes were provided in the internal and external casings in order to block electromagnetic waves. In this case, air is taken in from the outside by a fan to forcibly cool the electronic elements inside the internal case, but since the ventilation openings are small, the fluid resistance is too large and exceeds the capacity of the small fan, making it impossible to achieve good cooling. Therefore, a large fan would be required, resulting in the problem of increasing the size of the entire device.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an electronic device housing that can efficiently cool electronic elements housed within the internal housing using a small fan.

[Summary of the invention]

A hollow part is provided in the surrounding plate of the internal casing, and the top plate and side plate.

Rub so that the bottom plates share a single space. A refrigerant such as water or Freon is sealed inside. Then, the inner surface of the bottom plate is shaped like a substrate, and electronic elements are bonded to that surface. Furthermore, fins are provided on the outside of the housing.

"Effects of the Invention" Since the internal casing is formed airtight and serves as a gravity-type heat pipe, the heat generated by the electronic elements absorbed by the substrate surface of the bottom plate is quickly transferred to the side and top surfaces. There is almost no thermal resistance, and since the outer circumferential surface of the internal case is cooled with cooling air by the fan, the cooling area can be extremely large, including the fin area, and the cooling effect is extremely good.For this reason, it is recommended to use a small fan for cooling. This makes it possible to downsize the entire device.Also, the internal casing structure is sealed and uses a gravity heat pipe, so its reliability is high and stable operation can be achieved.

Furthermore, since there is no need to provide an air vent in the internal casing, electromagnetic waves can be better blocked.

[Embodiment of the Invention] FIGS. 1 and 2 show an embodiment of the present invention. FIG. 1 schematically shows an electronic device housing, in which an internal housing 1 is housed in an external housing 2. Indicates the state in which FIG. 2 shows a cross-sectional view of the internal housing 1. FIG.

In the figure, reference numeral 1 denotes a sealed casing housed within an external casing 2, in which a heat source such as an electronic element 6 and a source of unnecessary electromagnetic waves are housed. The electronic device 6 and the like are placed in an airtight enclosure 9 provided with a space 7 between them and the internal casing 1 as necessary, and attached to the substrate 12, and are secured to the internal casing 1 by a support 10. Attached to the inner bottom surface. A coolant 8 such as water or Freon is sealed inside the internal housing 1 to a depth where heat from the electronic elements 6 can be transferred.

Note that reference numeral 5 indicates a heat radiation fin formed on the upper and outer surface of the internal housing 1. An internal casing 1 containing electronic elements 6 and the like is attached to the bottom surface of an external casing 2 by support legs 11.

Inlet vents 4 for taking in cooling air A are diagonally opened in opposing side walls of the external casing 2, and a fan 3 for discharging the cooling air to the outside of the external casing 2 is attached.

With this configuration, the heat generated by the electronic element 6 causes the refrigerant 8 sealed in the space 7 of the internal housing 1 to evaporate and rise, condense on the top or side surfaces, and descend. This forms a so-called heat pipe.

At that time, the internal housing 1 has a uniform temperature distribution and is efficiently cooled by the air sucked in by the fan 3 from the inlet vent 4. In this case, the fins 5 can expand the cooling area. As a result, the electronic element 6, which generates heat in a small area, is cooled by the large area of the internal housing 1, and the internal housing 1 acts as a first shield against electromagnetic waves, and the external housing 2 acts as a second shield. It works effectively against electromagnetic interference and achieves good cooling. It goes without saying that the fins 5 are not limited to the upper surface.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a sectional view of the internal casing. DESCRIPTION OF SYMBOLS 1... Internal housing, 2... External housing, 5... Fin, 6... Electronic element, 8... Refrigerant. Figure 2

Claims (2)

[Claims] (1) In an electronic device housing in which an electronic element serving as an electromagnetic wave source and a heat generation source is housed in an internal housing, and the internal housing is housed in an external housing having a cooling fan, the internal housing is sealed; An electronic device housing characterized in that a refrigerant is sealed in the internal housing. (2) The electronic device casing according to claim 1, characterized in that a fin is provided on the outer surface of the internal casing.