JPS6147182B2 - - Google Patents
Info
- Publication number
- JPS6147182B2 JPS6147182B2 JP13515979A JP13515979A JPS6147182B2 JP S6147182 B2 JPS6147182 B2 JP S6147182B2 JP 13515979 A JP13515979 A JP 13515979A JP 13515979 A JP13515979 A JP 13515979A JP S6147182 B2 JPS6147182 B2 JP S6147182B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- plating
- ink
- weight
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 35
- 239000003822 epoxy resin Substances 0.000 claims description 28
- 229920000647 polyepoxide Polymers 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 239000003063 flame retardant Substances 0.000 claims description 13
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 5
- 239000000976 ink Substances 0.000 description 40
- 238000012360 testing method Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000000654 additive Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- 239000000080 wetting agent Substances 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- FSYKKLYZXJSNPZ-UHFFFAOYSA-N N-methylaminoacetic acid Natural products C[NH2+]CC([O-])=O FSYKKLYZXJSNPZ-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 108010077895 Sarcosine Proteins 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical class C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- JZULKTSSLJNBQJ-UHFFFAOYSA-N chromium;sulfuric acid Chemical group [Cr].OS(O)(=O)=O JZULKTSSLJNBQJ-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229940049964 oleate Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229940043230 sarcosine Drugs 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Methods (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13515979A JPS5659881A (en) | 1979-10-22 | 1979-10-22 | Flame-retardant resist ink composition for electroless copper plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13515979A JPS5659881A (en) | 1979-10-22 | 1979-10-22 | Flame-retardant resist ink composition for electroless copper plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5659881A JPS5659881A (en) | 1981-05-23 |
| JPS6147182B2 true JPS6147182B2 (enrdf_load_stackoverflow) | 1986-10-17 |
Family
ID=15145191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13515979A Granted JPS5659881A (en) | 1979-10-22 | 1979-10-22 | Flame-retardant resist ink composition for electroless copper plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5659881A (enrdf_load_stackoverflow) |
-
1979
- 1979-10-22 JP JP13515979A patent/JPS5659881A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5659881A (en) | 1981-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0343294B2 (enrdf_load_stackoverflow) | ||
| US4460718A (en) | Epoxy resin composition | |
| DE112005002748T5 (de) | Mit Adhäsionshilfsmittel ausgestattete Metallfolie und Leiterplatte, bei der diese verwendet wird | |
| US4555532A (en) | Epoxy resin composition | |
| US5061744A (en) | Resist ink composition | |
| JPS6147182B2 (enrdf_load_stackoverflow) | ||
| JPH0125790B2 (enrdf_load_stackoverflow) | ||
| KR20030061445A (ko) | 적층판 또는 프리프레그용 바니시, 이 바니시로부터얻어지는 적층판 또는 프리프레그 및 이 적층판 또는프리프레그를 사용한 프린트 배선판 | |
| JPS62273221A (ja) | 無電解メツキ用光硬化型レジスト樹脂組成物 | |
| JPS603113B2 (ja) | 印刷・コ−テイングインキ用エポキシ樹脂ワニス | |
| JPS58176254A (ja) | 耐めつき性ソルダ−レジストインク組成物 | |
| JP2894460B2 (ja) | ソルダーレジストインキ組成物及びその硬化物 | |
| JPH05156128A (ja) | 高絶縁性ソルダーレジスト組成物 | |
| JP2005082742A (ja) | 熱硬化性樹脂組成物、多層プリント配線板および感熱性ドライフィルム | |
| JPH05171083A (ja) | 化学メッキ用レジスト樹脂組成物 | |
| JPS60123572A (ja) | 一液性エポキシ樹脂インキ組成物 | |
| JPH08104737A (ja) | エポキシ樹脂組成物及びそれを用いたプリプレグ | |
| JPS6310726B2 (enrdf_load_stackoverflow) | ||
| JPH02272075A (ja) | アディティブ印刷配線板用接着剤組成物 | |
| US20240425730A1 (en) | Resin composition and application thereof | |
| JPH0128513B2 (enrdf_load_stackoverflow) | ||
| JPH01209442A (ja) | 化学めっき用光硬化型レジスト樹脂組成物 | |
| JPS61213278A (ja) | アデイテイブ化学メツキ用接着剤 | |
| JPS6112772A (ja) | エポキシ樹脂インキ組成物 | |
| JPH0216935B2 (enrdf_load_stackoverflow) |