JPS6146052B2 - - Google Patents
Info
- Publication number
- JPS6146052B2 JPS6146052B2 JP55166674A JP16667480A JPS6146052B2 JP S6146052 B2 JPS6146052 B2 JP S6146052B2 JP 55166674 A JP55166674 A JP 55166674A JP 16667480 A JP16667480 A JP 16667480A JP S6146052 B2 JPS6146052 B2 JP S6146052B2
- Authority
- JP
- Japan
- Prior art keywords
- arm
- capillary
- cam
- base plate
- capillary arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55166674A JPS5791529A (en) | 1980-11-28 | 1980-11-28 | Cam type wire bonding head with capillary arm jumping preventing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55166674A JPS5791529A (en) | 1980-11-28 | 1980-11-28 | Cam type wire bonding head with capillary arm jumping preventing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5791529A JPS5791529A (en) | 1982-06-07 |
| JPS6146052B2 true JPS6146052B2 (cg-RX-API-DMAC7.html) | 1986-10-11 |
Family
ID=15835614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55166674A Granted JPS5791529A (en) | 1980-11-28 | 1980-11-28 | Cam type wire bonding head with capillary arm jumping preventing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5791529A (cg-RX-API-DMAC7.html) |
-
1980
- 1980-11-28 JP JP55166674A patent/JPS5791529A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5791529A (en) | 1982-06-07 |