JPS6146051B2 - - Google Patents

Info

Publication number
JPS6146051B2
JPS6146051B2 JP56119894A JP11989481A JPS6146051B2 JP S6146051 B2 JPS6146051 B2 JP S6146051B2 JP 56119894 A JP56119894 A JP 56119894A JP 11989481 A JP11989481 A JP 11989481A JP S6146051 B2 JPS6146051 B2 JP S6146051B2
Authority
JP
Japan
Prior art keywords
resin
mold
pellets
comb
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56119894A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5821344A (ja
Inventor
Hisakazu Omoto
Akira Kamikubo
Akira Kawabata
Yasuo Taki
Katsuyuki Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11989481A priority Critical patent/JPS5821344A/ja
Publication of JPS5821344A publication Critical patent/JPS5821344A/ja
Publication of JPS6146051B2 publication Critical patent/JPS6146051B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/251—Particles, powder or granules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP11989481A 1981-07-29 1981-07-29 樹脂ペレツト供給装置 Granted JPS5821344A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11989481A JPS5821344A (ja) 1981-07-29 1981-07-29 樹脂ペレツト供給装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11989481A JPS5821344A (ja) 1981-07-29 1981-07-29 樹脂ペレツト供給装置

Publications (2)

Publication Number Publication Date
JPS5821344A JPS5821344A (ja) 1983-02-08
JPS6146051B2 true JPS6146051B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-10-11

Family

ID=14772853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11989481A Granted JPS5821344A (ja) 1981-07-29 1981-07-29 樹脂ペレツト供給装置

Country Status (1)

Country Link
JP (1) JPS5821344A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099535U (ja) * 1983-12-13 1985-07-06 長田　道男 半導体リ−ドフレ−ムと樹脂タブレツトの同時搬送供給装置
US4575328A (en) * 1984-03-06 1986-03-11 Asm Fico Tooling, B.V. Automatic continuously cycleable molding apparatus
JPS6133251U (ja) * 1984-07-30 1986-02-28 ジューキ株式会社 磁気記録媒体再生装置の媒体装着機構
JPS62260154A (ja) * 1986-05-06 1987-11-12 Mitsubishi Electric Corp 露光装置におけるアライメント方法
DE202021101012U1 (de) * 2021-03-01 2022-03-01 Wickert Maschinenbau GmbH Vorrichtung zum Einlegen von vorgefertigten Teilen in ein Formwerkzeug einer Presse sowie Presse mit einer solchen Vorrichtung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4517377Y1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1966-05-30 1970-07-17
JPS5037400U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-07-26 1975-04-18
JPS5132208U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1974-08-31 1976-03-09
JPS5330228A (en) * 1976-09-02 1978-03-22 Canon Inc Recording unit
JPS5492059A (en) * 1977-12-29 1979-07-20 Fujitsu Ltd Multi-pot mold device
JPS5546678U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1978-09-21 1980-03-27
JPS5611236A (en) * 1979-07-10 1981-02-04 Towa Seimitsu Kogyo Kk Method and metallic mold for plastic molding
JPS57123222U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1981-01-26 1982-07-31

Also Published As

Publication number Publication date
JPS5821344A (ja) 1983-02-08

Similar Documents

Publication Publication Date Title
KR100429046B1 (ko) 에폭시수지로캡슐화된반도체장치의제조방법
US4915607A (en) Lead frame assembly for an integrated circuit molding system
US4812114A (en) New IC molding process
JPS5952842A (ja) 電子部品をプラスチツク材へ封入する方法および装置
JPS6146051B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2004235530A (ja) 封止成形装置及びそれを用いた封止成形体の製造方法
JPS6354218B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2567603B2 (ja) 連続自動樹脂封止方法
JPS615909A (ja) 熱硬化性樹脂成形品の製造方法，成形金型および製造設備
JPS6146050B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH09506567A (ja) 物品を囲う方法及び設備
EP1259981B1 (en) Device and method for encapsulating electronic components mounted on a carrier
JPH08279525A (ja) 半導体モールド装置
JPS59172241A (ja) 半導体樹脂封止装置
JPS61214439A (ja) 半導体製造装置
JPH0537474Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3192957B2 (ja) 半導体封止方法
JPS62169335A (ja) 樹脂封止型半導体装置の製造装置
JPH0546897Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0645385A (ja) 半導体素子封止用樹脂封止装置
JPS6235814A (ja) 成形装置
JPH0671685A (ja) 樹脂成形装置
JPH04246516A (ja) 電子部品の樹脂モールド装置
JPH04353410A (ja) 自動トランスファ成形機
JPS63130316A (ja) 成形装置