JPS6145464Y2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to a linear temperature sensing element, and more specifically, it is a linear temperature sensing element whose resistance-temperature characteristics have linearity using a thick film thermistor and a thick film resistor. It is related to.

Conventionally, as a linear temperature detection element, the first
As shown, a bead-shaped thermistor 1 and fixed resistors 2, 2' were connected as shown in FIG. However, since it is impossible to modify the resistance value of a bead-type thermistor after sintering, in order to obtain a temperature sensing element with the desired resistance-temperature characteristics, it is necessary to select one from a large number of manufactured ones. It has the disadvantage that the assembly work is complicated and expensive. Recently, a thermistor paste printed and fired on an alumina substrate has been proposed, but since the impedance element is only placed on one side of the alumina substrate, it cannot be made sufficiently compact, and the thermal time constant has to be reduced. Therefore, it had the disadvantage of poor thermal response.

The purpose of this invention is to miniaturize the linear temperature sensing element by arranging a thick film thermistor on one side of an insulating substrate made of an alumina substrate and a thick film resistor on the other side. This makes it possible to improve thermal response, and it is extremely easy to modify and adjust the resistance values of thick film thermistors and thick film resistors.
This provides a linear temperature sensing element that is highly mass-producible, and will become clear from the detailed description below with reference to the drawings.

3A and 3B schematically show one embodiment of the linear temperature detecting element according to the present invention, and FIG.
One side 3a of an insulating substrate 3 made of an alumina substrate or the like is shown in Figure A, and the other side 3b is shown in Figure 3B. The paste is printed and fired to form a lower conductive layer 8, and thermistor paste is screen printed on both ends of the lower conductive layer 8 and fired to form the first and second thick film thermistors 5 and 5'. are formed, respectively, and upper conductive layers 7 and 9 are printed and fired on the upper surfaces of the first and second thick film thermistors 5 and 5', respectively, in an insulated state from the lower conductive layer 8. has been done.

On the other side 3b of the insulating substrate 3, a conductive layer 7',
8' and 9' are formed independently by a screen printing method, the conductive layer 7' is formed on the upper conductive layer 7 on one side 3a, and the conductive layer 8' is formed on the lower conductive layer 7 on one side 3a. In the conductive layer 8, the conductive layer 9' has portions located on the back side corresponding to the upper conductive layer 9 on the one side 3a, and a first thick film is provided between the conductive layers 7' and 8'. A resistor 6 is printed and fired to connect between conductive layers 7' and 8', and also connects conductive layer 7'.
A second thick film resistor 6' is printed and fired between the conductive layers 7' and 9' to connect the conductive layers 7' and 9'.

If the resistance values of the first and second thick film thermistors 5 and 5' formed on the insulating substrate 3 or the first and second thick film resistors 6 and 6' are not within the set range, a laser beam is emitted. Alternatively, the resistance value can be adjusted individually by spraying alumina sand onto the one side 3a of the insulating substrate 3, especially when modifying only the first and second thick film resistors 6 and 6'. The formed first and second thick film thermistors 5 and 5'
It has no effect on Further, it is preferable that the surfaces of the thick film thermistors 5 and 5' be covered with glass 10.

Next, as shown in FIGS. 4 and 5, the insulating substrate 3
The conductive layers 7 and 7', the conductive layers 8 and 8', and the conductive layers 9 and 9' facing each other with the terminals in between are terminal electrodes 12, 13 and 14 such as clip terminals, respectively.
Lead wires 12a and 14a are formed on the terminal electrodes 12 and 14, respectively. Note that the terminal electrodes 12, 13, and 14 are integrally formed with the lead wires 12a, 13a, and 14a.
When using the lead wire 13a, the lead wire 13a may be removed by cutting or the like. Further, by covering both surfaces of the insulating substrate 3 with epoxy resin 15 or glass to block them, a linear temperature detecting element as shown in FIG. 6 is formed. The insulating substrate 3 is a large insulating substrate with a slit 16 formed therein.
However, screen printing performed before this division is performed to form the first and second thick film thermistors 5 and 5' on one side 3a of the insulating substrate 3, and on the other side 3b. It is also possible to simultaneously print the first and second thick film resistors 6 and 6' to be formed from both sides of the insulating substrate 3, respectively. Furthermore, the conductive layers 7, 8, 9, 7', 8', and 9' are not limited to the shape shown, and the conductive layers 7, 8, 9, 7', 8', and 9' are not limited to the shape shown, and
The positions of a and 14a are also not limited to those shown.

Next, a specific example of the linear temperature detection element according to the present invention will be explained. After forming a lower conductive layer 8 on one side 3a of an insulating substrate 3 made of an alumina substrate measuring 48 mm in length and width and 0.64 mm in thickness with slits 16 arranged at 6 mm intervals as shown in FIG. 2%,
First thick film thermistor 5 with thermistor constant 3800±100°K and thermistor constant 6KΩ±2% at 25℃
A second thick film thermistor 5' having a temperature of 3800±100°K is formed, and upper conductive layers 7 and 9 are printed and fired on the upper surfaces of the first and second thick film thermistor 5 and 5', respectively. do. After forming conductive layers 7', 8' and 9' on the other side 3b of the insulating substrate 3,
First thick film resistor 6 of 5.42K±1% and 3.97KΩ±
1% second thick film resistors 6' were respectively formed, and the surfaces of the first and second thick film thermistors 5 and 5' and the first and second thick film resistors 6 and 6' were coated with glass 10. After that, the conductive layers 7 and 7' and the conductive layer 8
and 8' and conductive layers 9 and 9' by soldering and connecting the clip terminals 12, 13 and 14, respectively, and after removing the lead wire 13a of the clip terminal 13, powder coating of epoxy resin 15 is applied. By doing so, a linear temperature sensing element is obtained, and its resistance-temperature characteristics are as shown by the straight line 17 in FIG. It is clear that various resistance-temperature characteristics can be obtained by changing the thermistor constant and resistance value.

The above is the configuration of one implementation of the linear temperature detection element according to the present invention. According to this configuration, a thick film thermistor is formed on one side of the insulating substrate, and a thick film resistor is formed on the other side. Because of this, the size of the insulating substrate can be halved, the temperature detection element can be made smaller, the thermal response can be improved, and the resistance value of the thick film thermistor and thick film resistor can be improved. The resistance value can be corrected and adjusted, the desired resistance-temperature characteristics can be obtained extremely easily, and the conductive layers on the front and back sides of the insulating substrate can be connected extremely easily with terminal electrodes, making it excellent for mass production. A linear temperature detection element with excellent economic efficiency can be obtained.

[Brief explanation of the drawing]

Figure 1 is an external view of a bead-type thermistor and fixed resistor that constitute a conventional temperature detection element, Figure 2 is a temperature detection circuit diagram that is the basis of the present invention, and Figures 3A and B.
3 schematically shows an embodiment of the linear temperature detection element according to the present invention, FIG. 3A is a front view showing one side of the insulating substrate, and FIG. 3B is a front view showing the other side of the insulating substrate. Figure 4 is a front view showing the state in which the front and back conductive layers are connected by terminal electrodes, and Figure 5 is the - of Figure 4.
6 is a front view showing the element shown in FIG. 4 covered with epoxy resin; FIG. 7 is a front view of an insulating substrate with slits; FIG.
The figure is a resistance-temperature characteristic diagram of one embodiment of the linear temperature detection element according to the present invention. In the figure, 3... Insulating substrate, 3a... One side, 3b... Other side, 5, 5'... First and second thick film thermistors, 6, 6'... First and second thick film resistors, 7 ，
8, 9... Conductive layer on one side, 7', 8', 9'... Conductive layer on the other side, 10... Glass, 12, 13, 1
4...Terminal electrode, 12a, 14a...Lead wire, 15
…Epoxy resin.

Claims (1)

[Scope of claims for utility model registration] (1) First and second portions disposed on one side of an insulating substrate
thick film thermistor and the first one arranged on the other side.
and a second thick film resistor, wherein the first and second thick film thermistors and the first and second thick film resistors are connected by conductive layers formed on the front and back surfaces of an insulating substrate, respectively. A linear temperature sensing element characterized by: (2) The linear temperature sensing element according to claim 1, wherein the front and back conductive layers are connected by a terminal electrode.