JPH01270301A - Small-sized thermosensitive resistor and manufacture thereof - Google Patents
Small-sized thermosensitive resistor and manufacture thereofInfo
- Publication number
- JPH01270301A JPH01270301A JP63099707A JP9970788A JPH01270301A JP H01270301 A JPH01270301 A JP H01270301A JP 63099707 A JP63099707 A JP 63099707A JP 9970788 A JP9970788 A JP 9970788A JP H01270301 A JPH01270301 A JP H01270301A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electrodes
- divided
- film
- unit piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000007639 printing Methods 0.000 claims abstract description 13
- 230000001681 protective effect Effects 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000010304 firing Methods 0.000 claims description 8
- 239000003973 paint Substances 0.000 claims description 7
- 229910044991 metal oxide Inorganic materials 0.000 claims description 6
- 150000004706 metal oxides Chemical class 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract 2
- 238000005245 sintering Methods 0.000 abstract 1
- 238000009751 slip forming Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、ＩＣ等の温度補償、漏洩測定回路、制御回路
等に用いられるサーミスタ特性を有するチップ状の小型
感温抵抗器並にその製造方法に関する。[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention provides a small chip-shaped temperature-sensitive resistor having thermistor characteristics used for temperature compensation of ICs, leakage measurement circuits, control circuits, etc. Concerning tableware and its manufacturing method.
（従来の技術）
近年、電子部品は、小型、軽量化を目的として種々の製
品がチップ化されている。その中で感温抵抗器であるサ
ーミスタもサーミスタ特性を有する金属酸化物例えば（
ＳｉＣ） 、（Ｆ１３２０４ ＋ＨｎＣｒ０４ ）、（
Ｈｇ／’Ｊ！ｚ０４） 、または（ＣＯ２０３＋Ｎｉ０
−＋ＨｎＣ０４）等を焼結してチップ化したものが用い
られている。(Prior Art) In recent years, various electronic components have been made into chips for the purpose of making them smaller and lighter. Among them, the thermistor, which is a temperature-sensitive resistor, is also a metal oxide with thermistor characteristics, such as (
SiC), (F13204 +HnCr04), (
Hg/'J! z04) or (CO203+Ni0
-+HnC04) etc. are sintered into chips.
（発明が解決しようとする課題）
しかしながら上述の如き従来のチップ状ナーミスタには
次のような問題点がある。(Problems to be Solved by the Invention) However, the conventional chip-shaped nermistor as described above has the following problems.
（１） 金属酸化物の焼結体であるため、素子自体が
もろく、基板搭載後に電極の剥離、素子の割れが発生し
易い。(1) Since it is a sintered body of metal oxide, the element itself is fragile, and electrodes are likely to peel off and the element may crack after being mounted on a substrate.
（２）外装してないため耐湿特性が悪い。(2) Moisture resistance is poor because it is not packaged.
（３） 電極の形状によっては、基板搭載時にワイヤ
ボンディングなどの特殊な技術を必要とする。(3) Depending on the shape of the electrode, special techniques such as wire bonding may be required when mounting the electrode on the board.
本発明の目的は上述のような問題点に鑑み、堅牢で耐湿
特性が良い、天吊生産に適した小型感温抵抗器並にその
製造方法を提供するものである。SUMMARY OF THE INVENTION In view of the above-mentioned problems, an object of the present invention is to provide a compact temperature-sensitive resistor that is robust, has good moisture resistance, and is suitable for ceiling-mounted production, as well as a method for manufacturing the same.
（課題を解決するための手段）
本発明の小型感温抵抗器は、チップ基体と、このチップ
基体上に相対して離間形成された第１および第２の電極
と、前記チップ基体上に形成され一端を前記第１の電極
上に重ね合わされたサーミスタ特性を有する抵抗皮膜と
、一端を前記第２の電極上に重ね合わされ、他端を前記
抵抗皮膜上に重ね合わされた第３の電極と、前記第１お
よび第２の電極に跨って前記抵抗皮膜と第３の電極とを
被覆した保護膜と、前記チップ基体の両端面から裏面の
両端近くに形成され前記第１および第２の電極に接続さ
れた端面電極とよりなるものである。(Means for Solving the Problems) A small temperature-sensitive resistor of the present invention includes a chip base, first and second electrodes formed on the chip base and spaced apart from each other, and a first electrode and a second electrode formed on the chip base. a resistive film having thermistor characteristics, one end of which is superimposed on the first electrode, and a third electrode that has one end superimposed on the second electrode and the other end superimposed on the resistive film; a protective film extending over the first and second electrodes and covering the resistive film and the third electrode; and a protective film formed near both ends of the back surface from both end surfaces of the chip base and covering the first and second electrodes. It consists of connected end face electrodes.
本発明の小型感温抵抗器のｆＪ造方法は、絶縁基板の表
面に分割される各単位片毎に第１および第２の電極を相
対して離間形成し、次に夫々の単位片の表面に形成され
一端を第１の電極上に重ね合わせてサーミスタ特性を有
する金属酸化物を含む塗料を印刷して焼成して抵抗皮膜
を形成し、次に第２の電極上から抵抗皮膜上にかけて第
３の電極を印刷して焼成し、次に第１の電極上に抵抗皮
膜を介して形成された第３の電極の長さを切溝によって
切断することにより抵抗値を調整し、次に第１および第
２の電極に跨って前記抵抗皮膜および第３の電極を被覆
する耐熱合成樹脂製保護膜を形成し、次に絶縁基板を各
単位片の長さ方向が巾方向となるように分割して短冊様
分割体を形成し、次に短冊様分割体の巾方向の両側面に
前記第１および第２の電極と接続させて夫々連続した端
面電極を形成し、次に短冊様分割体を各単位片毎に分割
するものである。The fJ manufacturing method of a small temperature-sensitive resistor of the present invention involves forming first and second electrodes facing each other and spaced apart for each unit piece divided on the surface of an insulating substrate, and then A resistive film is formed by printing and baking a paint containing a metal oxide having thermistor characteristics with one end overlaid on the first electrode, and then a resistive film is formed from the second electrode onto the resistive film. The third electrode is printed and fired, and then the resistance value is adjusted by cutting the length of the third electrode formed on the first electrode through the resistive film with a groove. A heat-resistant synthetic resin protective film is formed spanning the first and second electrodes to cover the resistive film and the third electrode, and then the insulating substrate is divided into pieces such that the length direction of each unit piece is the width direction. to form a strip-like divided body, then connect the first and second electrodes on both sides of the strip-like divided body in the width direction to form continuous end face electrodes, and then form a strip-like divided body. is divided into each unit piece.
（作用）
本発明の小型感温抵抗器は、プリント基板に搭載して端
面電極を回路にハンダ付ＧＪすることによりＩＣの温度
補償、温度測定回路、制御回路等に用いられる。この際
、サーミスタ特性を有する抵抗皮膜はチップ基体上に一
体に形成されかつ上面を保護膜で被覆されているから堅
牢であるとともに耐湿性もある。(Function) The small temperature-sensitive resistor of the present invention is used for IC temperature compensation, temperature measurement circuits, control circuits, etc. by mounting it on a printed circuit board and soldering the end electrode to the circuit. At this time, since the resistance film having thermistor characteristics is integrally formed on the chip base and the upper surface is covered with a protective film, it is robust and moisture resistant.
また抵抗皮膜は第１、第２および第３の電極で端面電極
と接続されているからプリント基板上に搭載してハンダ
リフローやハンダフロー等により接続ができる。Furthermore, since the resistive film is connected to the end surface electrode through the first, second, and third electrodes, it can be mounted on a printed circuit board and connected by solder reflow, solder flow, or the like.
また本発明の小型感温抵抗器の製造方法は、絶縁基板の
表面に多数の第１、第２の電極を印刷し、基板の裏面に
多数の裏面電極を印刷によって形成し、多数の電極の形
成が印刷によって一挙に行われ、また焼成は表裏同時に
行われる。Further, the method for manufacturing a small temperature-sensitive resistor of the present invention includes printing a large number of first and second electrodes on the surface of an insulating substrate, forming a large number of back electrodes on the back surface of the substrate, and forming a large number of electrodes on the back surface of the substrate by printing. Formation is performed all at once by printing, and firing is performed simultaneously on both sides.
また、多数の抵抗皮膜、第３の電極も夫々印刷、焼成に
よって一挙に形成される。さらに端面電極は細長い短冊
様分割体の長さ方向に連続して形成される。そして絶縁
基板を先ず分割溝から短冊様に分割し、さらに短冊様分
割体を分割溝から分割することにより多数のチップ基体
に分割された製品を得ることができる。Further, a large number of resistive films and a third electrode are also formed at once by printing and firing, respectively. Furthermore, the end face electrodes are formed continuously in the length direction of the elongated strip-like divided body. By first dividing the insulating substrate into strips from the dividing grooves, and then dividing the strip-like divided bodies from the dividing grooves, a product divided into a large number of chip substrates can be obtained.
また、サーミスタ特性を有する抵抗皮膜の形成は、サー
ミスタ特性を有する金属酸化物を含む塗料を塗布して焼
成することにより形成される。Further, the resistance film having thermistor characteristics is formed by applying a paint containing a metal oxide having thermistor characteristics and baking it.
また抵抗皮膜の抵抗値の調整は第１の電極上に抵抗皮膜
を介して形成された第３の電極を可潜で切断することに
よって簡単に行われる。Further, the resistance value of the resistive film can be easily adjusted by submersibly cutting the third electrode formed on the first electrode via the resistive film.
（実施例）
本発明の小型感温抵抗器の一実施例を第１図によって説
明する。(Example) An example of the small temperature-sensitive resistor of the present invention will be described with reference to FIG.
１はアルミナ焼結体よりなる電気絶縁性チップ基体であ
り、このチップ基体１の上面の長さ方向の両端に例えば
ＡＱ−Ｐｄ−ガラスのメタルグレーズよりなる第１およ
び第２の電極２．３が離間して相対して形成され、第１
の電極２は第２の電極３に向って長さ方向に延長されて
延長部４が形成されている。さらに第１、第２の電極２
，３間のチップ基体１の上面にはサーミスタ特性を有す
る金ａｍ化物（例えばＣ０２Ｑ３ ＋ＮｉＯ＋ＨｎｚＯ
３）を含む塗料よりなる抵抗皮膜５が形成され、この抵
抗器ｌ！１５は、チップ基体１の上面から第１の電極２
の抵抗皮膜５上には例えばＡｔ；１−Ｐｄ−ガラスのメ
タルグレーズよりなる第３の電極６が形成され、この第
３の電極６の一端は前記第２の電極３の上面に接続され
ている。そして、第１の電極２上に抵抗器ｌｌＡ３を介
して手ね合わされた第３の電極６を適宜の長さで切断す
るように切溝７を入れることにより抵抗値が調整されて
いる。さらに、前記抵抗皮膜５と第３の電極６を？！！
！覆して耐熱性エポキシ樹脂よりなる保、１１１１８が
形成されこの保１１２８の両端は前記第１および第２の
電極２，３の端部を残して上面を覆っている。またチッ
プ基体１の良さ方向の両端面には夫々端面電極９，１０
が形成されて第１および第２の電極２，３とＪｅ続され
るとともにチップ基体１の裏面両端位置に形成された裏
面電極１１．１２とも接続されている。さらに−面電極
９，１０、裏面電極１１．１２の外側にはハンダ電極１
３、１４が形成されている。Reference numeral 1 denotes an electrically insulating chip base made of an alumina sintered body, and first and second electrodes 2.3 made of a metal glaze of AQ-Pd-glass, for example, are provided at both lengthwise ends of the top surface of the chip base 1. are formed facing each other at a distance, and the first
The electrode 2 is extended in the length direction toward the second electrode 3 to form an extension 4. Furthermore, the first and second electrodes 2
, 3 is coated with gold-amide having thermistor characteristics (for example, C02Q3 +NiO+HnzO).
A resistive film 5 made of a paint containing 3) is formed, and this resistor l! 15 indicates the first electrode 2 from the top surface of the chip base 1.
A third electrode 6 made of, for example, a metal glaze of At;1-Pd-glass is formed on the resistive film 5, and one end of the third electrode 6 is connected to the upper surface of the second electrode 3. There is. Then, the resistance value is adjusted by cutting a groove 7 on the first electrode 2 so as to cut the third electrode 6, which is hand-coupled via the resistor llA3, to an appropriate length. Furthermore, the resistance film 5 and the third electrode 6? ! !
! A cover 11118 made of a heat-resistant epoxy resin is formed on top of the cover, and both ends of the cover 1128 cover the upper surface of the first and second electrodes 2 and 3 except for their ends. Further, end surface electrodes 9 and 10 are provided on both end surfaces of the chip substrate 1 in the longitudinal direction, respectively.
are formed and connected to the first and second electrodes 2 and 3, and are also connected to back electrodes 11 and 12 formed at both ends of the back surface of the chip base 1. Furthermore, solder electrodes 1 are placed on the outside of the negative side electrodes 9 and 10 and the back side electrodes 11 and 12.
3 and 14 are formed.
この実施例の抵抗器の使用に際してはプリント基板に搭
載しハンダリフロー、ハンダ７０−等の手段でハンダ電
極１３．１４を接続することによりサーミスタ作用をさ
せる。この際サーミスタ作用をする抵抗皮膜５はチップ
基体１に保持され保護膜８に被覆されて損傷を防止され
る。When the resistor of this embodiment is used, it is mounted on a printed circuit board and connected to solder electrodes 13 and 14 by means of solder reflow, solder 70-, etc., so that it functions as a thermistor. At this time, the resistance film 5 which acts as a thermistor is held on the chip base 1 and covered with the protective film 8 to prevent damage.
次に本発明の小型感温抵抗器の製造方法を第２図ないし
第１０図によって説明する。Next, a method for manufacturing a small temperature-sensitive resistor according to the present invention will be explained with reference to FIGS. 2 to 10.
１ａはアルミナ焼結体よりなる基板で、各チップ基体１
毎に分割されるように表面に分割溝１５が縦横に形成さ
れている。1a is a substrate made of alumina sintered body, and each chip substrate 1
Dividing grooves 15 are formed vertically and horizontally on the surface so as to be divided into sections.
（１）先ず基板１ａの裏面の各チップ基体１毎に分割溝
１５によって区画された単位片１ｂ毎にＱざ方向の両端
にＡ（１−Ｐｄ−ガラスのメタルグレーズよりなる一対
の裏面電極１１．１２を印刷し、さらに基板１ａの表面
に分割溝１５で縦横に区分された各単位片１ｂ毎に第１
および第２の電極２．３を＾に１−Ｐｄ−ガラスメタル
グレーズにより印刷し、第１の電極２は第２の電極３に
向って延長させ延長部４を形成し、表裏を同時に８５０
°で焼成し表裏面に電極２，３１１、４２を形成する（
第２図、第３図）。(1) First, a pair of back electrodes 11 made of a metal glaze of A (1-Pd-glass) are placed on both ends of the .12 is printed, and furthermore, the first
and a second electrode 2.3 is printed on the substrate with 1-Pd-glass metal glaze, the first electrode 2 is extended toward the second electrode 3 to form an extension 4, and the front and back sides are simultaneously printed with 850
The electrodes 2, 311, and 42 are formed on the front and back surfaces by firing at
Figures 2 and 3).
（２）次に各単位片１ｂ毎に表面から第１の電極２の延
長部４の上面にかけてサーミスタ特性を有する粒径数置
程度の金属酸化物粉体（ＣＯ２０３トＮｉＯ＋Ｈｒ＋ｚ
Ｏａ）とガラスフリットと有機質ビヒクルよりなる塗料
を印刷し８５０℃で焼成づることによりサーミスタ特性
を有する抵抗器ｌ！４５を形成する（第４図）。(2) Next, for each unit piece 1b, from the surface to the upper surface of the extension part 4 of the first electrode 2, a metal oxide powder (CO203, NiO+Hr+z
A resistor with thermistor characteristics is produced by printing a paint consisting of Oa), glass frit, and an organic vehicle and firing it at 850°C. 45 (Figure 4).
（３） 次に、各単位片１ｂ毎に第２の電極３上から
、第１の電極２上の抵抗皮膜５上にＡ（１−Ｐｄ−ガラ
スのメタルグレーズよりなる第３の電極６を印刷して８
５０℃で焼成する（第５図）。尚、第３の電極６として
Ａ（］を用いてもよい。(3) Next, for each unit piece 1b, a third electrode 6 made of a metal glaze of A(1-Pd-glass) is placed on the resistive film 5 on the first electrode 2 from above the second electrode 3. Print 8
Calculate at 50°C (Figure 5). Note that A( ) may be used as the third electrode 6.
（４）次に第３の電極６をレーザー光により抵抗皮膜５
上で切断しその切溝７位置によって抵抗値を調整する（
第６図）。切断の方法はレーザー光による他、サンドブ
ラスト法や電極６を予めくし形に形成しておき、くし形
の連続部を適当位四で切断してもよい。(4) Next, the third electrode 6 is coated with the resistive film 5 using a laser beam.
Cut at the top and adjust the resistance value depending on the 7 positions of the kerf (
Figure 6). The cutting method may be by using a laser beam, or by sandblasting, or by forming the electrode 6 in a comb shape in advance and cutting the continuous part of the comb shape at an appropriate position.
また、切断に先立って第３の電極６と抵抗皮膜５は予め
カバーガラスで被覆する場合もある。Further, the third electrode 6 and the resistive film 5 may be covered with a cover glass in advance before cutting.
（５） 次に第１および第２の電極２，３に跨っで第
３の電極６とこの電ｔｌ ６から露出した抵抗皮膜５の
一部を被覆するように耐熱性エポキシ樹脂よりなる保護
膜８を印刷形成し、１３０℃で樹脂を硬化させる（第７
図）。(5) Next, a protective film made of heat-resistant epoxy resin is applied over the first and second electrodes 2 and 3 to cover the third electrode 6 and a part of the resistive film 5 exposed from the electrode 6. 8 is printed and the resin is cured at 130°C (7th
figure).
（６） 次に各単位片１ｂの長さ方向を巾方向として
分割溝１５から基板１ａを分割して短冊様分割体１Ｃを
得る（第８図）。(6) Next, the substrate 1a is divided from the dividing groove 15 with the length direction of each unit piece 1b as the width direction to obtain strip-like divided bodies 1C (FIG. 8).
（７） 次に分割体１Ｃの巾方向の両側に連続した端
面電極１１．１２を形成し、電極２と裏面電極１１、電
極３と裏面電極１２を夫々接続させる。端面電極１１゜
１２の形成は、Ｎｉ−Ｃｏの眞空蒸肴、Ａ （１−Ｐ
ｄ−ガラスメタルグレーズの塗布、焼成、Ａ（＋を分散
させたエポキシ樹脂塗料の塗布、便化などの方法によっ
て形成される（第９図）。(7) Next, continuous end electrodes 11 and 12 are formed on both sides of the divided body 1C in the width direction, and the electrode 2 and the back electrode 11 are connected, and the electrode 3 and the back electrode 12 are connected, respectively. The end electrodes 11 and 12 are formed using Ni-Co vacuum steaming, A (1-P
It is formed by methods such as coating a d-glass metal glaze, baking, coating an epoxy resin paint in which A(+ is dispersed), and facilitation (Fig. 9).
（８） 次に短冊様分割体１Ｃを分割溝１５から分割
してサーミスタ特性を有するチップ基体１を得る（第１
０図）。このチップ基体１の両端の端面電４１１１、１
２にさらにハンダ電極１３．１４を積層する。(8) Next, the strip-like divided body 1C is divided from the dividing groove 15 to obtain the chip base 1 having thermistor characteristics (first
Figure 0). Edge surface electrodes 4111, 1 at both ends of this chip base 1
Further, solder electrodes 13 and 14 are laminated on 2.
以上のようにして第１図に示す小型感温抵抗器が得られ
る。In the manner described above, the small temperature-sensitive resistor shown in FIG. 1 is obtained.
〔発明の効果〕
本発明によれば、サーミスタ特性を有する抵抗皮膜がチ
ップ基体上に形成され、さらに保護膜で被覆されている
から、抵抗皮膜が堅牢でかつ耐湿性が保持される。また
抵抗皮膜にはチップ基体に形成された電極が接続されて
いるから、プリント基板への搭載も容易である。[Effects of the Invention] According to the present invention, since a resistive film having thermistor characteristics is formed on a chip substrate and further covered with a protective film, the resistive film is robust and retains moisture resistance. Furthermore, since the resistive film is connected to the electrode formed on the chip base, it can be easily mounted on a printed circuit board.
また製作に際しては、分割可能な絶縁基板への電極の印
刷と焼成、サーミスタ特性を有する塗料の印刷と焼成、
保護膜の印刷と硬化によってチップ片の大量生産が可能
になる。In addition, during production, printing and firing of electrodes on a divisible insulating substrate, printing and firing of paint with thermistor characteristics,
Printing and curing of the protective film enables mass production of chip pieces.
さらに、抵抗値の￥ｌＪ整は、第１の電極上に抵抗皮膜
を介して重ね合わせ第２の電極と接続した第３の電極を
抵抗皮膜上で切断することにより容易に行なうことがで
きる。Further, the resistance value can be easily adjusted by cutting the third electrode, which is superimposed on the first electrode via the resistive film and connected to the second electrode, on the resistive film.
第１図は本発明の小型感温抵抗器の根石側面図、第２図
ないし第１０図は同上製造口［程説明図である。
１・・チップ基体、１ａ・・基板、１ｂ・・単位片、１
Ｃ・・短冊様分割体、２．３．６，９．１０・・電極、
４・・延長部、５・・抵抗皮膜、８・・保護膜、１５・
・分割溝。FIG. 1 is a side view of the base of a small temperature-sensitive resistor according to the present invention, and FIGS. 2 to 10 are explanatory views of the manufacturing port of the same. 1...Chip base, 1a...Substrate, 1b...Unit piece, 1
C... Strip-like segmented body, 2.3.6, 9.10... Electrode,
4. Extension part, 5. Resistance film, 8. Protective film, 15.
・Dividing groove.
Claims (2)
形成された第１および第２の電極と、前記チップ基体上
に形成され一端を前記第１の電極上に重ね合わされたサ
ーミスタ特性を有する抵抗皮膜と、一端を前記第２の電
極上に重ね合わされ、他端を前記抵抗皮膜上に重ね合わ
された第３の電極と、前記第１および第２の電極に跨つ
て前記抵抗皮膜と第３の電極とを被覆した保護膜と、前
記チップ基体の両端面から裏面の両端近くに形成され前
記第１および第２の電極に接続された端面電極とよりな
ることを特徴とする小型感温抵抗器。(1) The characteristics of a thermistor formed on a chip base, first and second electrodes formed on the chip base and spaced apart from each other, and the thermistor formed on the chip base with one end superposed on the first electrode. a third electrode having one end superimposed on the second electrode and the other end superimposed on the resistive film; 3, and end surface electrodes formed near both ends of the back surface from both end surfaces of the chip base and connected to the first and second electrodes. Resistor.
よび第２の電極を相対して離間形成し、次に夫々の単位
片の表面に形成され一端を第１の電極上に重ね合わせて
サーミスタ特性を有する金属酸化物を含む塗料を印刷し
て焼成して抵抗皮膜を形成し、 次に第２の電極上から抵抗皮膜上にかけて第３の電極を
印刷して焼成し、 次に第１の電極上に抵抗皮膜を介して形成された第３の
電極の長さを切溝によって切断することにより抵抗値を
調整し、 次に第１および第２の電極に跨つて前記抵抗皮膜および
第３の電極を被覆する耐熱合成樹脂製保護膜を形成し、 次に絶縁基板を各単位片の長さ方向が巾方向となるよう
に分割して短冊様分割体を形成し、次に短冊様分割体の
巾方向の両側面に前記第１および第２の電極と接続させ
て夫々連続した端面電極を形成し、 次に短冊様分割体を各単位片毎に分割することを特徴と
する小型感温抵抗器の製造方法。(2) First and second electrodes are formed facing each other and spaced apart for each unit piece divided on the surface of the insulating substrate, and then formed on the surface of each unit piece with one end placed on the first electrode. A resistive film is formed by printing and firing a paint containing a metal oxide that has thermistor characteristics in an overlapping manner, and then printing and firing a third electrode from above the second electrode to the resistive film, and then The resistance value is adjusted by cutting the length of the third electrode formed on the first electrode through the resistance film with a groove, and then the resistance value is adjusted by cutting the length of the third electrode formed on the first electrode through the resistance film. A heat-resistant synthetic resin protective film is formed to cover the film and the third electrode, and then the insulating substrate is divided so that the length direction of each unit piece is the width direction to form strip-like divided bodies. The strip-like divided body is connected to the first and second electrodes on both sides in the width direction to form continuous end face electrodes, respectively, and then the strip-like divided body is divided into unit pieces. A method for manufacturing a small temperature-sensitive resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63099707A JPH01270301A (en) | 1988-04-22 | 1988-04-22 | Small-sized thermosensitive resistor and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63099707A JPH01270301A (en) | 1988-04-22 | 1988-04-22 | Small-sized thermosensitive resistor and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01270301A true JPH01270301A (en) | 1989-10-27 |
Family
ID=14254538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63099707A Pending JPH01270301A (en) | 1988-04-22 | 1988-04-22 | Small-sized thermosensitive resistor and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01270301A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04273402A (en) * | 1991-02-28 | 1992-09-29 | Taiyo Yuden Co Ltd | Manufacture of resin-sealed thermistor |
| WO1996034260A1 (en) * | 1995-04-28 | 1996-10-31 | Siemens Aktiengesellschaft | Process for producing a temperature sensor and component with temperature-dependent resistance |
| CN103362562A (en) * | 2013-07-30 | 2013-10-23 | 东方电气集团东方汽轮机有限公司 | Final moving blade of feed pump turbine |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57208110A (en) * | 1981-06-17 | 1982-12-21 | Matsushita Electric Ind Co Ltd | Thin film thermistor |
-
1988
- 1988-04-22 JP JP63099707A patent/JPH01270301A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57208110A (en) * | 1981-06-17 | 1982-12-21 | Matsushita Electric Ind Co Ltd | Thin film thermistor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04273402A (en) * | 1991-02-28 | 1992-09-29 | Taiyo Yuden Co Ltd | Manufacture of resin-sealed thermistor |
| WO1996034260A1 (en) * | 1995-04-28 | 1996-10-31 | Siemens Aktiengesellschaft | Process for producing a temperature sensor and component with temperature-dependent resistance |
| CN103362562A (en) * | 2013-07-30 | 2013-10-23 | 东方电气集团东方汽轮机有限公司 | Final moving blade of feed pump turbine |
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