JPS6145388B2 - - Google Patents
Info
- Publication number
- JPS6145388B2 JPS6145388B2 JP16566782A JP16566782A JPS6145388B2 JP S6145388 B2 JPS6145388 B2 JP S6145388B2 JP 16566782 A JP16566782 A JP 16566782A JP 16566782 A JP16566782 A JP 16566782A JP S6145388 B2 JPS6145388 B2 JP S6145388B2
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- wiring
- cutting
- ion implantation
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57165667A JPS5955061A (ja) | 1982-09-22 | 1982-09-22 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57165667A JPS5955061A (ja) | 1982-09-22 | 1982-09-22 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5955061A JPS5955061A (ja) | 1984-03-29 |
| JPS6145388B2 true JPS6145388B2 (enrdf_load_stackoverflow) | 1986-10-07 |
Family
ID=15816724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57165667A Granted JPS5955061A (ja) | 1982-09-22 | 1982-09-22 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5955061A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10344391A1 (de) * | 2003-09-25 | 2005-05-12 | Infineon Technologies Ag | Anordnung zur Verbindung in integrierten MOS-Strukturen |
| KR100979367B1 (ko) | 2008-03-19 | 2010-08-31 | 주식회사 하이닉스반도체 | 반도체 소자의 퓨즈 형성 방법 |
-
1982
- 1982-09-22 JP JP57165667A patent/JPS5955061A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5955061A (ja) | 1984-03-29 |
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