JPS6143726Y2 - - Google Patents

Info

Publication number

JPS6143726Y2

JPS6143726Y2 JP1214578U JP1214578U JPS6143726Y2 JP S6143726 Y2 JPS6143726 Y2 JP S6143726Y2 JP 1214578 U JP1214578 U JP 1214578U JP 1214578 U JP1214578 U JP 1214578U JP S6143726 Y2 JPS6143726 Y2 JP S6143726Y2

Authority

JP

Japan

Prior art keywords

heat

lid material

resistant resin

melt adhesive

resin

Prior art date

1978-02-02

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 239000000463 material Substances 0.000 claims description 15
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
• 229910052782 aluminium Inorganic materials 0.000 claims description 9
• 239000010410 layer Substances 0.000 claims description 8
• 238000000576 coating method Methods 0.000 claims description 7
• 239000011248 coating agent Substances 0.000 claims description 6
• 229920006015 heat resistant resin Polymers 0.000 claims description 6
• -1 polypropylene Polymers 0.000 claims description 4
• 239000004743 Polypropylene Substances 0.000 claims description 3
• 229920001155 polypropylene Polymers 0.000 claims description 3
• 229920003002 synthetic resin Polymers 0.000 claims description 2
• 239000000057 synthetic resin Substances 0.000 claims description 2
• 239000012790 adhesive layer Substances 0.000 claims 1
• 239000005038 ethylene vinyl acetate Substances 0.000 claims 1
• 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims 1
• 239000011888 foil Substances 0.000 description 5
• 238000007789 sealing Methods 0.000 description 5
• 239000004922 lacquer Substances 0.000 description 4
• 238000012856 packing Methods 0.000 description 4
• 239000004831 Hot glue Substances 0.000 description 3
• 230000001788 irregular Effects 0.000 description 3
• 238000004519 manufacturing process Methods 0.000 description 3
• 239000004698 Polyethylene Substances 0.000 description 2
• 238000010438 heat treatment Methods 0.000 description 2
• 229920000573 polyethylene Polymers 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 239000011347 resin Substances 0.000 description 2
• 239000004925 Acrylic resin Substances 0.000 description 1
• 229920000178 Acrylic resin Polymers 0.000 description 1
• VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
• JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
• 239000005977 Ethylene Substances 0.000 description 1
• 239000000020 Nitrocellulose Substances 0.000 description 1
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 229920001577 copolymer Polymers 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 238000003475 lamination Methods 0.000 description 1
• 239000002932 luster Substances 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 229920001220 nitrocellulos Polymers 0.000 description 1
• 238000004806 packaging method and process Methods 0.000 description 1
• 238000010422 painting Methods 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1