JPS6141238Y2 - - Google Patents
Info
- Publication number
- JPS6141238Y2 JPS6141238Y2 JP1981169488U JP16948881U JPS6141238Y2 JP S6141238 Y2 JPS6141238 Y2 JP S6141238Y2 JP 1981169488 U JP1981169488 U JP 1981169488U JP 16948881 U JP16948881 U JP 16948881U JP S6141238 Y2 JPS6141238 Y2 JP S6141238Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- wiring board
- wiring layer
- circuit chip
- multilayer wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W90/724—
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981169488U JPS5874346U (ja) | 1981-11-16 | 1981-11-16 | 集積回路モジユ−ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981169488U JPS5874346U (ja) | 1981-11-16 | 1981-11-16 | 集積回路モジユ−ル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5874346U JPS5874346U (ja) | 1983-05-19 |
| JPS6141238Y2 true JPS6141238Y2 (cg-RX-API-DMAC10.html) | 1986-11-25 |
Family
ID=29961476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981169488U Granted JPS5874346U (ja) | 1981-11-16 | 1981-11-16 | 集積回路モジユ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5874346U (cg-RX-API-DMAC10.html) |
-
1981
- 1981-11-16 JP JP1981169488U patent/JPS5874346U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5874346U (ja) | 1983-05-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH05183280A (ja) | マルチチップ・モジュール | |
| JPH06252285A (ja) | 回路基板 | |
| JPH0846134A (ja) | 半導体装置 | |
| JPS6141238Y2 (cg-RX-API-DMAC10.html) | ||
| JPH07321423A (ja) | 回路基板 | |
| JPH01132146A (ja) | 半導体装置 | |
| JPH0135484Y2 (cg-RX-API-DMAC10.html) | ||
| JP2605785B2 (ja) | 多層配線基板の冷却構造 | |
| JPH0333071Y2 (cg-RX-API-DMAC10.html) | ||
| JPH0636592Y2 (ja) | 混成集積回路装置 | |
| JP2656120B2 (ja) | 集積回路用パッケージの製造方法 | |
| JPS645895Y2 (cg-RX-API-DMAC10.html) | ||
| JPS5936916Y2 (ja) | 高周波用混成集積回路基板 | |
| JPS60174244U (ja) | 混成集積回路 | |
| JP2526970B2 (ja) | 集積回路パッケ―ジの冷却構造 | |
| JPS58140143A (ja) | 複合型半導体装置 | |
| JP2504262Y2 (ja) | 半導体モジュ―ル | |
| JP2524733Y2 (ja) | 半導体装置 | |
| JPS60206673A (ja) | サ−マルヘツド | |
| JPS587337U (ja) | 混成集積回路装置 | |
| JPH01246857A (ja) | 半導体装置 | |
| JPS6175533A (ja) | 半導体装置 | |
| JPS6130252U (ja) | 半導体装置 | |
| JPS6176998U (cg-RX-API-DMAC10.html) | ||
| JPS62149144A (ja) | 混成集積回路 |