JPS5874346U - 集積回路モジユ−ル - Google Patents

集積回路モジユ−ル

Info

Publication number
JPS5874346U
JPS5874346U JP1981169488U JP16948881U JPS5874346U JP S5874346 U JPS5874346 U JP S5874346U JP 1981169488 U JP1981169488 U JP 1981169488U JP 16948881 U JP16948881 U JP 16948881U JP S5874346 U JPS5874346 U JP S5874346U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit module
wiring layer
opening
support substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981169488U
Other languages
English (en)
Other versions
JPS6141238Y2 (ja
Inventor
上川井　良太郎
伊藤　親市
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP1981169488U priority Critical patent/JPS5874346U/ja
Publication of JPS5874346U publication Critical patent/JPS5874346U/ja
Application granted granted Critical
Publication of JPS6141238Y2 publication Critical patent/JPS6141238Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図および第２図はそれぞれ従来の集積回路モジュー
ルの一例を示す図、第３図は本考案の一実施例の構成を
示す図である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 支持基板と、上記支持基板上に設けられた配線層と、上
    記配線層上に設けられ、所定箇所に開口を有する多層配
    線基板と、上記開口内に配置された集積回路チップとを
    具備し、上記集積回路チップを、上記配線層を介して上
    記多層配線基板に電′気的圏接続したことを特徴とする
    集積回路モジュール。
JP1981169488U 1981-11-16 1981-11-16 集積回路モジユ−ル Granted JPS5874346U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981169488U JPS5874346U (ja) 1981-11-16 1981-11-16 集積回路モジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981169488U JPS5874346U (ja) 1981-11-16 1981-11-16 集積回路モジユ−ル

Publications (2)

Publication Number Publication Date
JPS5874346U true JPS5874346U (ja) 1983-05-19
JPS6141238Y2 JPS6141238Y2 (ja) 1986-11-25

Family

ID=29961476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981169488U Granted JPS5874346U (ja) 1981-11-16 1981-11-16 集積回路モジユ−ル

Country Status (1)

Country Link
JP (1) JPS5874346U (ja)

Also Published As

Publication number Publication date
JPS6141238Y2 (ja) 1986-11-25

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