JPS6140029Y2 - - Google Patents
Info
- Publication number
- JPS6140029Y2 JPS6140029Y2 JP2836280U JP2836280U JPS6140029Y2 JP S6140029 Y2 JPS6140029 Y2 JP S6140029Y2 JP 2836280 U JP2836280 U JP 2836280U JP 2836280 U JP2836280 U JP 2836280U JP S6140029 Y2 JPS6140029 Y2 JP S6140029Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- fixed contact
- synthetic resin
- conductive
- conductive band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 6
- 239000000057 synthetic resin Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Of Switches (AREA)
- Contacts (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2836280U JPS6140029Y2 (zh) | 1980-03-05 | 1980-03-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2836280U JPS6140029Y2 (zh) | 1980-03-05 | 1980-03-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56130218U JPS56130218U (zh) | 1981-10-03 |
| JPS6140029Y2 true JPS6140029Y2 (zh) | 1986-11-15 |
Family
ID=29624286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2836280U Expired JPS6140029Y2 (zh) | 1980-03-05 | 1980-03-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6140029Y2 (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004095242A (ja) * | 2002-08-30 | 2004-03-25 | Tsubame Musen Kk | ロータリーエンコーダ及びその基板製造方法 |
| JP4283012B2 (ja) * | 2003-03-14 | 2009-06-24 | パナソニック株式会社 | サーマルプロテクタ |
| JP2008300039A (ja) * | 2007-05-29 | 2008-12-11 | Nitta Ind Corp | スリップリング及びスリップリングの製造方法 |
| TWI671776B (zh) * | 2017-06-08 | 2019-09-11 | 日商阿爾卑斯阿爾派股份有限公司 | 切換裝置 |
| JP7010468B2 (ja) * | 2017-12-25 | 2022-01-26 | 帝国通信工業株式会社 | スイッチ基板 |
-
1980
- 1980-03-05 JP JP2836280U patent/JPS6140029Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56130218U (zh) | 1981-10-03 |
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