JPS6136942A - Apparatus for electronic part - Google Patents

Abstract

PURPOSE:To conduct electrical and mechanical joining between a chip-shaped electronic part and a conductive pattern on a film carrier collectively and simply by joining the conductive pattern, the electronic part and a protective plate by a conductive anisotropic adhesive body. CONSTITUTION:A chip part 10 is loaded onto a cradle 30 functioning as a hot plate in combination. A conductive anisotropic adhesive body 28 is positioned onto the part 10, and conductive patterns 22-24 for a film 19a are positioned so as to be brought onto electrodes 13-15 for the part 10. An insulating protective plte 29 is positioned onto the conductive patterns 22-24, and the part 10, the conductive patterns 22-24 and the protective plate 29 are joined by the conductive anisotropic adhesive body 28 by a contact-bonding jig 31 conducting an ultrasonic vibration and the cradle 30. Consequently, the electrodes 13-15 and the conductive patterns 22-24 are joined electrically by solder grains 28a in the adhesive body 28. Since the adhesive body 28 has insulating properties in the surface direction, the electrodes are not short-circuited. Accordingly, the electrical and mechanical joining of the part 10 and the conductive patterns 22-24 is conducted collectively and simply.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component device in which an electrode of an electronic component, such as an IC chip component, and a predetermined conductive turn are electrically connected.

BACKGROUND TECHNOLOGY AND PROBLEMS Conventionally, in electronic component devices in which electrodes of IC chip components are electrically connected to predetermined conductive patterns that serve as lead wires, electrical connections are made using so-called wire bonding using, for example, gold wire. As shown in Figure 1, electrical connection was made between the conductive pattern and the electrode of the electronic component. In Figure 1, (1) and (2) are formed of copper foil, and it is necessary to make the desired electrical connection. A conductive pattern serving as a suitable lead wire is shown, and the conductive patterns (1) and (2) are formed on the substrates (3) and (4) in a predetermined turn. Further, (5) indicates an IC chip component, and this IC chip component (5) has an electrode (6) at a predetermined position.
) and (7) are arranged, gold wire (8) and (9)
The conductive grooves (1) and (2) are electrically connected to the electrodes (6) and (7), and predetermined wiring for the IC chip component (5) is completed.

By the way, the square end faces of the electrodes (6) and (7) that are directly connected to the electrical connection by soldering the gold wires (8) and (9) need to have a predetermined width of 100 μm x 100 μm.
Wire bonding can be used for areas as large as 1.5 m.

However, with the miniaturization of IC chip components (5), if the end face width of the electrode (6) is reduced to about 40 μm x 40 μm, for example, will it become a wire cod? In the case of bonding, the possibility of short circuiting between the electrodes becomes large, and a good electrical connection cannot be achieved, which is disadvantageous. Further, when the wire using gold wire is bonded, the manufacturing cost of the electronic component device increases because the gold wire itself is expensive. In addition, the bonding speed with wire ending requires 0.2 seconds for soldering one gold wire, so if wire ending with K is used for items with a large number of electrodes, it will take a lot of manufacturing time. It also had the disadvantage of decreasing productivity.

Further, FIG. 2 shows a conventional example of an electronic component device obtained by making desired electrical connections by thermo-ultrasonic pressure bonding (TAB method). In FIG. 2, parts corresponding to those in FIG. 1 are designated by the same reference numerals, and detailed explanation thereof will be omitted.

In this conventional example, bumps (8) and (9) made of solder or gold are connected to electrodes (6) (7) of an IC chip component (5).
Conductive turns (3) and (4) are formed to correspond to the conductive turns (3) and (4), and then the electrodes (6) and (7) are connected to the conductive mother turns (3).
and (4) are crimped with bumps (8) and (9) interposed therebetween to establish a predetermined conductivity and mechanically fix the IC chip component (5) to obtain an electronic component device. Figure 3 also shows bumps 01 and 0]) conductive through turns (3) and (
4) Another example of obtaining a shimiko component device by TAB method will be shown.

To obtain an electronic component device using this TAB method, the cost is reduced as no wire is required, but bumps o1 and (11
) is expensive to form. In addition, there is a high possibility that adjacent electrodes or conductive patterns may be short-circuited due to leakage of solder forming conductive lines (bumps αQ and 0 when the distance between turns or between electrodes becomes narrower). This has the disadvantage that it is not suitable for miniaturization of component devices. In addition, in the process of forming bumps on the electrodes (6) and (7) of the IC chip component (5), it is difficult to make the heights of the bumps 00 and θ with high accuracy, so it is difficult to The disadvantage was that the electrical connection was unreliable.

Purpose of the Invention The present invention has been made in view of the above-mentioned points, and provides an electronic component in which the necessary electrical connection of the electrodes of the electronic component and the mechanical connection of the electronic component can be easily achieved all at once without any troublesome steps. The purpose is to provide equipment.

Summary of the Invention The electronic component device of the present invention is an electronic component device in which a chip-shaped electronic component is mounted on a film carrier, in which a conductive pattern on the film carrier and an electrode on the chip-shaped electronic component are formed of a conductive anisotropic adhesive. In addition to electrically and mechanically bonding, a protective plate is bonded to the opposite side of the conductive pattern to the electronic component. According to the present invention, the necessary electrical connection with the pad portion of the electronic component and the mechanical bonding of the electronic component can be easily and satisfactorily performed at once without any troublesome steps.

Embodiment υ An embodiment of the electronic component device of the present invention will be described with reference to FIGS. 4 to 6 Shimodate.

In FIG. 4, 00 indicates an IC chip component, and this I
The C chip component θ1 has an external aluminum electrode α1)02θ304 with a square end face of 100 μm x 100 μm.
α → αQ0η0 camphor is provided. In addition, field a indicates the film carrier as a whole, and this film carrier is, for example, a 130 μm thick film made of polyimide (
19a) with a thickness of 1 which forms the predetermined line of the lead wire.
Conductive N” turn (E) (C) (A) (21 (C) (C) (C)) made of tinned copper with a width of 8μm and a width of 70μm.
are arranged. Here, even if the area of the end face of electrode (11) to 0 is small, the width near the tip of the pattern is
) to 0&, the pattern width is narrowed in a predetermined section, for example, so that it can be applied to electrodes of any small area. In addition, a conductive anisotropic adhesive (c) is interposed between the conductive pattern (1) and the electrode (1) to establish electrical connection between the corresponding conductive pattern and the electrode. ing.

This electrically conductive anisotropic adhesive (c) has electrical conductivity in the direction perpendicular to the intervening surface and electrically connects the corresponding electrode 0]) to the end of the conductive pattern (e) to In addition, the intervening surface has insulating properties in the plane direction and conductive anisotropy to prevent short-circuits between adjacent conductive patterns or between adjacent electrodes.

The formation of this conductive anisotropic adhesive body (c) will be described in detail with reference to FIG. 6.

To form the conductive anisotropic adhesive body (28), first, an insulating resin liquid having the following composition is prepared.

In an insulating resin liquid having this composition, 10 parts by volume of low melting point solder metal particles -R28a) are dispersed per 100 parts by volume of the solid content of this liquid. The metal particles (28a) are solder metal particles having an average particle size of 20 μm and having a melting point of 140° C., to which Pb-8Ω alloy KSb and Bi are added. An adhesive paint in which low melting point solder metal particles (28a) are dispersed in an insulating resin liquid is applied to a release sheet (not shown) using a coater, for example, so that the thickness after drying is 40 μm to make it conductive. An anisotropic adhesive body is obtained.

Further, the fence represents a protective plate made of glass, for example, and this protective plate is formed with a thickness of 0.35 m on the side of the conductive pattern (C) and the upper and lower surfaces of the fence where electronic components are not connected. In this example, the size of the glass plate (c) is made into a square shape of 100 μm×100 μm, corresponding to the size of the chip-shaped electronic component.

Next, a method of manufacturing an embodiment of the electronic component device of the present invention will be explained.

As shown in Figure 5, 1. First of all, the cradle (
Prepare 1). Place the IC chip component α on this pedestal (A).
1 is loaded with the electrodes α1) to 0 facing upward. Then, place the conductive anisotropic adhesive on top of it! ,film(
The predetermined conductive patterns (19m) to (19m) are positioned so that they are directly above the electrodes αη to 08 of the IC chip component to be electrically connected.

In addition, the wire indicates a protective plate made of an insulating material bonded from the opposite side of the conductive/mother-turn electronic component α1, and this protective plate is made of, for example, a glass IC chip component (100 μm x 100 μm square corresponding to the size of 10). form into a shape.

A crimping jig 0 that also serves as an ultrasonic vibration generator that applies ultrasonic vibrations of, for example, 2000 Hz from above this glass plate (c)
1) Crimp firmly.

Here, as the conditions for heating and pressurizing with the manufacturing equipment of these electronic component devices, for example, the temperature of the pedestal (G) is 200 to 200℃.
The temperature can be set at 300° C., the pressure using the jig 01) is 0.1 ψ, the frequency of ultrasonic imaging is 2000 Hz, and the heat and pressure bonding time is 0.1 to 20 seconds.

When heated and pressed under these conditions, a conductive anisotropic adhesive (
c) The insulating adhesive inside becomes fluid due to heating, and much of the insulating adhesive interposed between the conductive patterns and the corresponding electrodes is pushed out to the side, causing the conductive patterns and electrodes to become fluid. The solder particles (28a) were melted and crushed by the heating and pressurization between them, and the corresponding conductive pattern and the electrode were soldered to electrically connect them and obtain good conduction resistance. In addition, the insulating adhesive extruded from between the conductive pattern and the electrode that makes the electrical connection wraps the conductive metal particles well, and is present in large quantities between the adjacent conductive patterns and between the adjacent electrodes. As a result, insulation was maintained and the two were firmly attached.

Such a flow phenomenon occurs effectively during heat and pressure bonding of the conductive anisotropic adhesive, and the conduction resistance is reduced to 0.1Ωυ or less, and the insulation resistance is reduced to 1.
K should be 07Ω or more, preferably 109Ω, and M, F, 1. (melt flow
index) is 0.001 or more preferably 0.00
5v higher. This M, F, 1. is ASTM.

2160 at a predetermined compression temperature using equipment specified in DI 238 method A or JIS 7210 method A.
．． It shows the number of grams of resin that flows out from the orifice in 10 minutes when a load of 1.1 lit is applied. Also,
The thickness of the electrically conductive anisotropic adhesive (c) is 10 to 300%, preferably 30 to 200%, of the volume of the space created between each connection part, and the thickness is preferably 5 to 200 μm.

As described above, according to this embodiment, I
All surfaces of the C-chip component α1 containing electrodes C11) to (18) are electrically and mechanically bonded together using a conductive anisotropic adhesive, making it easy to achieve highly reliable miniaturization without any troublesome processes. A suitable electronic component device can be obtained.

Further, the glass plate 4 has the advantage that the connection portion can be protected by the conductive anisotropic adhesive and the adhesive strength can be increased. In addition, we also offer glass plate ducts and RC chip parts (
Since the pedestal (7) and the jig 01) are in contact with the pedestal 10 during the heat and pressure bonding, the adhesive does not adhere to the pressure bonding device even when bonding is performed continuously, which is advantageous for mass production.

It is also possible to improve heat dissipation and moisture resistance by selecting the material of the protective plate. Furthermore, it is possible to obtain an electronic component device only by heat compression bonding without applying ultrasonic vibration.

Note that the present invention is not limited to the above-described embodiments, and it goes without saying that various other configurations may be adopted without departing from the gist of the present invention.

Effects of the Invention The electronic component device of the present invention is an electronic component device in which a chip-shaped electronic component is mounted on a film carrier, in which the conductive pattern on the film carrier and the electrode of the chip-shaped electronic component are formed by a conductive anisotropic adhesive. , which is electrically and mechanically bonded and a pressure protection plate on the opposite side of the electronic component of the conductive pattern is bonded.Since it can be bonded all at once using a conductive anisotropic adhesive, it is easy and highly reliable without any troublesome processes. There is an advantage that an electronic component device suitable for miniaturization can be obtained. Further, the protective plate has the advantage of increasing adhesive strength and protecting the joint. Further, even if the adhesive is bonded continuously, the adhesive will not adhere during heat-pressing, making it suitable for mass production.

[Brief explanation of the drawing]

1, 2 and 3 are diagrams showing an example of a conventional electronic component device, FIGS. 4 and 5 are diagrams showing an example of an electronic component device of the present invention, and FIG. 6 is a diagram showing an example of a conventional electronic component device, respectively. FIG. 5 is a diagram showing an example of a main part of the example shown in FIG. 4; 01 is an rc chip component, ◇1) to 01lIl are electrodes, 0 is a film carrier, (19m) is a film, - to (goods) are conductive patterns, and (c) is a glass plate.・“[・1y −')n't

Claims (1)

[Claims] In an electronic component device in which a chip-shaped electronic component is mounted on a film carrier, the conductive pattern on the film carrier and the electrode of the chip-shaped electronic component are electrically and mechanically bonded by a conductive anisotropic adhesive. An electronic component device characterized in that a protective plate is bonded to a side of the conductive pattern opposite to the electronic component.