JPH05283480A - Connecting method for electronic circuit component - Google Patents

Abstract

PURPOSE:To provide the title connecting method in low connection resistance and large rupture strength within the facedown bonding step wherein a conductive resin-made bump electrode terminal is provided on an electronic circuit component chip to be fitted to a wiring substrate having a conductive resin-made terminal. CONSTITUTION:Within the title connecting method between both electrode terminals by heating and pressurizing an electrode terminal 5 comprising a conductive resin composition on a wiring substrate 9 and a conductive resin made bump electrode terminal 3 formed on an electronic circuit component chip after making an alignment, the binder materials of the conductive resin composition of both electrode terminals 5, 3 are composed of a thermoplastic resin or thermosetting resin in half-set state. Through these procedures, the electrode terminal on a wiring substrate and a bump electrode terminal are composed of the conductive resin composition in the same system so that a homogenous junction part may be formed after the bonding step thereby enabling the reduction of connection resistance and the increase in breaking strength to be attained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of connecting electronic circuit parts, and more particularly to a method of connecting electronic circuit parts having protruding electrode terminals to a wiring board.

[0002]

2. Description of the Related Art A method of connecting a chip-shaped integrated circuit and similar electronic circuit components to a wiring board is roughly classified into wire bonding technology and wireless bonding technology.
In recent years, the latter has been adopted more often due to the necessity of high-density or thin mounting. There is a face-down bonding method as a technique representative of the latter, but the following method is generally adopted. That is, metal bump electrode terminals are provided on the electrode pads of a chip-shaped electronic circuit component (hereinafter referred to as a chip) (in some cases, a metal core is covered with solder, or in some cases, it is composed of only solder), After alignment with the electrode terminals, they are joined by thermocompression bonding or soldering, or they are joined through a conductive adhesive or an anisotropic conductive film. In this case, ceramics, glass, epoxy resin containing glass cloth, etc. are usually used as the base material of the wiring board.

In all of these methods, a protruding electrode terminal made of metal is used on the surface of the chip, but there is a drawback that the manufacturing process of the protruding electrode is complicated and expensive, and a method using an inexpensive protruding electrode terminal made of a conductive resin is used. Has also been done. The case of using a protruding electrode terminal made of a conductive resin will be described below with reference to the drawings.

In FIG. 4, a protruding electrode terminal 13 made of a conductive resin is provided on the electrode pad 12 of the chip 11, and the protruding electrode terminal 13 is aligned with the electrode terminal 15 of the wiring board 16 and the protruding electrode terminal 13 is used as the electrode terminal 1.
5 is a method of thermocompression bonding. The protruding electrode terminal 13 is
A thermosetting resin such as an epoxy resin is used as a binder, and curing has already been completed. In FIG. 5, the electrode pad 12 of the chip 11 and the electrode terminal 15 of the wiring board 16 are bonded onto the electrode terminal 15 of the wiring board 16 with a thermosetting conductive adhesive 14 printed in a protruding shape, and heat-cured. Is a method of completing the connection. In these methods, an inexpensive resin is usually used as the base material of the wiring board, but ceramics or glass may be used in some cases. For the electrode terminals of the wiring board, a metal, a cured thermosetting or thermoplastic resin, or a thick film conductor is used.

[0005]

In the above-mentioned conventional connection method, when a metal electrode is used as the protruding electrode terminal on the chip, the manufacturing process of the protruding electrode becomes complicated,
There was also the drawback of being expensive. Further, in the method of using the projection electrode terminal made of an inexpensive conductive resin instead of the projection electrode terminal made of metal, when the electrode terminal of the wiring board is a metal or a thick film conductor, the connecting portion is made of a different material. Therefore, the connection resistance at the connection surface may increase due to surface alteration or uneven distribution of the insulating material at the interface, or the bonding surface may break due to mechanical stress caused by the difference in thermal expansion coefficient between the chip and the wiring board. There was a need for proper material combinations and careful process control. Also, when the electrode terminals of the wiring board are made of a conductive resin that has been completely cured, a thermosetting resin is usually used as a binder, but an insulating film of resin is formed on the surface during curing when forming the electrode terminals. Since the thermocompression bonding is difficult, the connection resistance is increased and the breaking strength is also problematic.

In view of this, the present invention provides a connection method in which the connection resistance is small and the breaking strength is large when connecting the protruding electrode terminal of the conductive resin chip to the electrode terminal of the conductive resin wiring board. The purpose is to do.

[0007]

In order to achieve the above object, in the present invention, a wiring circuit having a conductive resin electrode terminal made of a conductive powder and a thermoplastic resin, a conductive powder and a thermoplastic resin are provided. A method of connecting an electronic circuit component in which a conductive resin-made protruding electrode terminal made of a resin and an electronic circuit component formed by fusion and bonding the electrode terminal and the protruding electrode terminal by heating and pressing after alignment are provided. provide. Furthermore, the present invention provides a method for connecting an electronic circuit component, wherein the conductive resin electrode terminal is formed on a wiring board having a thermoplastic resin as a base material.

Further, according to the present invention, there is provided a wiring circuit having a semi-cured conductive resin electrode terminal formed of a conductive powder and a thermosetting resin, and a semi-cured state composed of a conductive powder and a thermosetting resin. Provided is a method for connecting an electronic circuit component, in which the electrode terminal and the protruding electrode terminal are fused and joined by aligning and heating the electronic circuit component on which the conductive resin protruding electrode terminal is formed.

[0009]

[Function] Both the electrode terminals of the wiring board and the protruding electrode terminals of the chip are made of a conductive resin composition containing a thermoplastic resin as a binder, or a conductive material containing a semi-cured thermosetting resin as a binder. Made of a conductive resin composition, and after alignment, both electrode terminals are homogeneously fused by heating and pressurizing to the extent that the resin fuses or crosslinks, and then the resin portion is integrated when cooled, and in particular the conductive particles contained are in good contact. Keep the state.

[0010]

Embodiments of the present invention will be described below with reference to FIGS. FIG. 1 shows a state in which the connection has been completed, in which the electrode pad 2 of the chip 1 made of an integrated circuit has the substrate 9
Are integrally connected to the electrode terminals 5 of the wiring circuit 4 provided on the surface of the. In the case of this embodiment, the wiring circuit 4 and the electrode terminal 5 are continuously formed of the same material. The protective resin 8 is obtained by coating the periphery of the chip 1 with an epoxy resin or the like for the purpose of improving the holding force of the chip 1 and the environmental resistance, but it may not be used.

Next, the connection process according to one embodiment of the present invention will be described with reference to FIGS. FIG. 2 shows a method of forming the bump electrode, in which the conductive resin composition is supplied onto the electrode pad 2 of the chip 1 by the screen printing method.
By heating and drying in this state and then cooling, the protruding electrode terminal 3 made of the conductive resin composition is completed. Although only a single chip is shown in FIG. 2, it is needless to say that the conductive resin composition may be simultaneously printed on a plurality of chips in a wafer state and then divided into a single chip. A dispenser method may be used instead of screen printing. The conductive resin composition is, for example, a mixture of silver powder (particle size of about 1 μm) as the conductive powder, vinyl chloride as the thermoplastic resin binder and cyclohexanone as the solvent. As the conductive powder used in the conductive resin composition, there are silver, gold, copper, nickel, tungsten, molybdenum, platinum, aluminum, tin, etc., and semiconductive materials such as carbon, silicon carbide, vanadium pentoxide, etc. It may be sex. As the thermoplastic resin, polyetherimide, polysulfone, or the like can be used depending on the heat resistance of the wiring board base material.

Next, as shown in FIG. 3, a wiring circuit 4 made of a conductive resin composition having the same composition as the protruding electrode terminals 3 of the chip 1 is formed on the surface of the polycarbonate resin film substrate.
And the electrode terminal 5 is integrally formed to provide the wiring board 9. Thereafter, the chip 1 is placed on the wiring board 9 so as to face each other, and the chip 1 is aligned with the electrode terminal 5 of the wiring board 9 by a bonder having a pickup head 6 having a positioning function and a heating and pressing function, and heating and pressing are performed. (Hereinafter referred to as bonding). The necessary pressing force and heating temperature may be such that the protruding electrode terminals 3 and the electrode terminals 5 of the wiring board 9 are fused, and the bonding can be completed by cooling thereafter. When the bonding material of the protruding electrode terminals 3 and the electrode terminals 5 of the wiring board 9 was vinyl chloride resin, a sufficiently good connection was obtained at 165 ° C.

By performing the bonding as described above, both the protruding electrode terminals 3 of the chip 1 and the electrode terminals 5 of the wiring board 9 are formed of a conductive resin having a thermoplastic resin as a binder, and therefore, are homogeneous. And a strong bond is made.

Further, in the above embodiment, since the polycarbonate resin film which is the thermoplastic resin is used as the wiring board, the wiring board 9, the wiring circuit 4 and the electrode terminals 5 are used.
During that time, heat fusion is performed and strong integration is performed.

Here, the electrode terminal 5 of the wiring board 9 and the chip 1
The thermoplastic resins used for the protruding electrode terminals 3 are preferably the same, but they are not necessarily the same, and different combinations may be used as long as they have substantially the same plasticity. Further, the compounding ratio of the conductive powder, the binder, and the solvent may be changed so as to be suitable for printing on the chip and the wiring board. However, in the above examples, the content of silver is preferably around 90% by weight of solid matter from the viewpoint of conductivity.

In the above embodiment, the conductive resin composition was heated and dried after printing. However, immediately after the conductive resin composition was supplied to a predetermined position, bonding was performed in a state of containing a solvent, and after bonding, It can also be joined by heating.

Further, in the above-mentioned embodiment, the thermoplastic resin is used as an example of the binder of the conductive resin composition, but the present invention is not limited to this and can be applied to a thermosetting resin. You can In the case of a thermosetting resin, it is difficult to heat-fuse a resin that has been cured by heating. Therefore, a good connection can be obtained by bonding in a semi-cured state before the crosslinking of the polymer proceeds. That is, it is advisable to dry the conductive resin composition to such an extent that the solvent is evaporated after printing and to cure it by heating after bonding. The base material of the wiring board is preferably a resin having characteristics similar to those of the conductive resin composition, but may be ceramics, glass, or metal that has been subjected to an insulation treatment.

[0018]

As described above, according to the present invention,
Since the electrode terminals on the wiring board and the protruding electrode terminals on the chip are made of the same type of conductive resin composition, a uniform joint is formed after bonding, and the connection resistance is reduced and the breaking strength is improved. be able to. In addition, if a thermoplastic resin is used as the binder of the conductive resin composition and the base material of the wiring board, a good connection can be formed between the thermoplastic resin board having relatively poor heat resistance and the chip. ..

[Brief description of drawings]

FIG. 1 is a sectional view showing a state of being connected by a connecting method according to an embodiment of the present invention.

FIG. 2 is a sectional view of an integrated circuit chip used in an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a bonding state of the example of the present invention.

FIG. 4 is a cross-sectional view showing a connection state according to a conventional technique.

FIG. 5 is a cross-sectional view showing another connection state according to the conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Chip 3 ... Projection electrode terminal 4 ... Wiring circuit 5 ... Electrode terminal 9 ... Wiring board

Claims (3)

[Claims] 1. A wiring circuit in which conductive resin electrode terminals made of conductive powder and a thermoplastic resin are formed, and an electronic circuit in which conductive resin protrusion electrode terminals made of conductive powder and a thermoplastic resin are formed. A method for connecting electronic circuit components, characterized in that the electrode terminals and the protruding electrode terminals are fused and joined by aligning and heating the components with each other. 2. The method of connecting electronic circuit components according to claim 1, wherein the wiring circuit is formed on a wiring board having a thermoplastic resin as a base material. 3. A wiring circuit having semi-cured conductive resin electrode terminals formed of conductive powder and thermosetting resin,
The semi-hardened conductive resin made of conductive powder and thermosetting resin and the electronic circuit component on which the protruding electrode terminal is formed are aligned and heated and pressed to fuse the electrode terminal and the protruding electrode terminal. A method of connecting electronic circuit parts, characterized by joining together.