JPS6135591A - Device for soldering electronic part leads - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an electronic component lead soldering device suitable for automatically soldering the leads of electronic components mounted on a printed wiring board or the like to a wiring pattern. It is.

[Background of the invention]

As a means of connecting electronic components to the wiring pattern of a board such as a printed wiring board, a method is adopted in which the flat part of the lead of the electronic component is placed on the wiring pattern via solder, and the solder is heated and melted to join the two. has been done. In order to automatically perform this method, a soldering device as shown in FIG. 23 has been conventionally employed, but due to dimensional errors in the leads, deformation during the process, etc., contact between the leads and the solder may occur. This problem cannot be corrected by the above-mentioned device, resulting in poor bonding.

In the figure, a substrate 10 is mounted on a table 2 fixed to a pedestal 1 by a positioning bin 9. As shown in FIG. Although not shown, electronic components are mounted on the substrate 10, and the flat portions of their leads are placed on the wiring pattern of the substrate 10 via solder paste.

An optical system 6 and a radiation head 7 are installed on the arm 4 of the robot 3, which is automatically movable in three-dimensional directions, and an optical fiber 5 is connected to the radiation head 7.

The control device 8 transfers and positions the optics and system of the p10bot 3 to the lead position, and irradiates the solder with a radiation beam.
By melting this in a bath, the leads and the wiring pattern are joined. However, in electronic components with many leads, such as integrated circuit elements, dimensional errors between leads,
Due to the deformation, etc., variations occur in the contact state between the flat portion of the lead and the solder paste, and some leads do not come into contact with the solder paste. This results in poor bonding between the leads and the wiring pattern.

In the conventional device having the above configuration, there is no effective means for correcting the above drawback, which has been considered a problem.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and its purpose is to enable reliable soldering without being affected by shape changes such as board reversal and thickness changes, and lead dimensional errors and deformation. Another object of the present invention is to provide a soldering device for electronic component leads that can improve product reliability and yield.

[Summary of the invention]

In order to achieve the above object, the present invention provides a conveying means for horizontally supporting a substrate, carrying it in, stopping at an intermediate position, and carrying it out; a positioning means for positioning and holding the substrate at a predetermined position of the intermediate stop; 9. A suction means having a flat magnet that is freely engaged with the lower surface of the substrate and in close contact with the substrate, and has an impact absorption mechanism that reduces the impact force between the magnet and the substrate; heating means facing each other, disposed above the substrate, movably engaging a lead position mounted on the substrate, and heating and melting solder interposed between the lead and the wiring pattern; The electronic component lead soldering device is characterized in that the positioning means and suction means prevent the board from warping, and the magnet<Xυ lead and the solder are formed in close contact with each other for joining. .

[Embodiments of the invention]

Embodiments of the present invention will be described below based on the drawings.

First, an overview of this embodiment will be explained.

As shown in FIG. 1, a conveying means A is placed on the pedestal 21 to horizontally support the base plate 1of and between the rails 23 and 24 and to convey it by a chain 5253 or the like. Substrate 10
are carried in by conveyance means A, stopped at an intermediate position, soldered together, and then discharged.

At the intermediate position, a positioning means B is provided which horizontally positions the loaded substrate 10 at a predetermined position and also grips the periphery of the substrate 100 to vertically position it relative to a heating means to be described later.

As shown in FIG. 2, a flat magnet 118 that is in close contact with the lower surface of the substrate 10 at the intermediate position is engaged with the substrate 10 in a layered manner, and as the substrate 10 and the magnet 11
A suction means C having a shock absorbing mechanism E for mitigating the impact force with respect to 8 is provided.

As shown in FIGS. 1 and 2, an optical system 122 for heating and melting the solder is disposed above the substrate 10 facing the suction means C.
ft A heating means movably supported in three-dimensional directions is provided.

Next, one embodiment will be described in detail for each of the above means.

First, the conveying means A will be explained.

As shown in FIG. 1, the rail 23 and the rail 24 are arranged in series, and a rail 76 of the positioning means B is interposed between them. Each rail 25 , 24 , 76 is connected to a board 100
It is formed from a pair of rails facing each other and separated by the width dimension. Each rail 25, 24, 76 is formed with a diagonal step 25, 77 (shown in FIGS. 10 and 12) that supports the edge of the board 10. As shown in Figures 4 and 9,
- A lid 26.78 is provided above the steps 25 and 77 to prevent the substrate 10 from floating up.

As shown in FIG. 4, the rails 25 and 24 are placed on a support stand 22 fixed to a pedestal 21, and the board 10 is
support. On the pedestal 21, a rail 29 is formed parallel to the rail 25, 21 through the pedestal 27 and the support 2B (the third
(also shown in the figure), the rail 29 has rollers 3 that clamp it.
0, a slider 31 is movably supported. Fifth
As shown in FIG. 6, a shaft 32 is slidably inserted into the slider 31, a pawl 55 is attached to one end of the shaft 32, and an arm 34 is attached to the other end i11. Note that the claw 33 is arranged at a position where it can engage with the moving side edge of the substrate 10.

As shown in FIG. 4, a piece 41 is supported at a predetermined position on the stand 27 so as to be slidable in the vertical direction, and a groove 4 passing through the board 10 in the transfer direction (hereinafter referred to as the transfer direction) is provided at a predetermined position on the piece 41.
2 is formed. An arm 54 is removably engaged with the groove 42 . A rod 40 of the cylinder 39 is connected to the piece 41. Further, as shown in FIG. 6, the shafts 32 are spaced apart and have locking grooves 35 and 36 formed therein, and a plunger 370 and a ball 38 supported by the slider 31 are connected to the locking grooves 35 and 3.
6. As described above, when the slider 31 moves and the arm 34 is fitted into the groove 42 of the piece 41, the cylinder 39
The piece 41 rises, and the claw 35 of the slider 51 touches the board 1.
0 and is positioned at a position where it engages. Therefore slider 3
1 along the rail 291C, the substrate 10 is sent in the transport direction. At this time, the ball 3B fits into the locking groove 35 (Fig. 6), and +141152 is fixed. Conversely, the slider 51 moves in the opposite direction, the arm 34 and the piece 41 engage again, and by lowering the cylinder 69, the pawl 33 is positioned at a position where the lower surface of the board 10 comes off, and the ball 38
engages with the locking groove 36 and fixes it.

As shown in FIG. 3, the slider 31 is disposed on the rail 23 side and the rail 24 side, and the two are connected by a connecting ring 46, as well as a spring 48, a chain 52, a connecting piece 55, a connecting ring 57, and a connecting piece 55. ．． Chain 53, spring 48
are connected in a ring. Sprocket) sa, 59 is rail 2! l, disposed on both ends of the chain 5
2 and 53 are wound and supported. Further, as shown in FIG. 7, a bearing 56 slidably supports a connecting ring 57. Although not explicitly shown in the drawings, the bearing 56 is fixed to the support 28.

FIG. 5 shows a slider 31, a chain 52, and a connecting ring 4.
Details of the connection with 6 are shown. That is, the shaft 44
, A7 are pivotally supported by bearings 43 (also shown in FIG. 6) formed at both ends of the slider 31.

A connecting piece 45 is pivotally supported on the shaft 44, and a connecting ring 46 is connected to the connecting piece 45. Further, one end of the spring 4B is engaged with the shaft 45, and the other end of the spring 48 is engaged with the bottle 49. The bottle 49 is pivotally supported by a connecting piece 50. A chain 52 is connected to a pin 51 that is pivotally supported by a connecting piece 50. Madaizu 7
As shown in the figure, the chain 52 has a pin 54 and a metal connecting piece 5.
5, and a connecting ring 57 is connected to the connecting piece 55. Note that the third factor is the connecting ring 57, connecting piece 55, and chain 53.
The connection of is also the same as above.

As shown in FIG. 3, the sprocket 59 is connected to a shaft 61 via a bevel gear (not shown), and the shaft 61 is connected to a coupling 6.
The rotation of motor 62 @JJ651C is connected via 4.

With the above configuration, when the motor rotates 62 feet, the chain chains 52 and 53 move, and the slider moves in the transport direction. As a result, the substrate 10 is carried in and carried out.

Next, the positioning means B will be explained.

As shown in Figures 8 and 9 (Figure 8 is similar to Figures 1 and 1).
3), both sides of a frame 65 are fixed to the pedestal 21, and a shaft 67 (formed from three as shown in FIG. 13) is supported and fixed to the bottom of the frame 21. Bearing 66 and cylinder 70 are fixed.

Further, a base 69 is disposed on the upper side facing the bottom surface, and a bearing 68 and a bracket 72 are fixed to the pace 69, which are arranged facing the bearing 66.

The shaft 67 is slidably supported by a bearing 6BK, and is supported by a bracket 7.
2 is connected to a cylinder 70 and a rod 71 (shown in FIG. 9).

A support stand 73 is fixed on the pace 69, and a guide bin 73α is fixed on the upper end side of the support stand 73 as shown in FIG. The guide pin 73α is slidably inserted into a guide collar 76 fixed to the rail 76.

A spring 75 guided by a guide pin 736 is interposed between the guide collar 74 and the support base 73.

- As shown in Figure 9, a bracket 81 is fixed to a stand 80 placed on a pedestal 21, and a guide collar 74 is slidably supported on the bracket 81 (Figure 17). The positioning pins 82 are disposed facing each other at positions where they can fit into positioning holes 79 formed at predetermined positions of the rails 76.

The bracket 81 is arranged to face the rail 76 with a gap in between, and the rail 76 is positioned on the upper surface by the contact between the positioning reference surface 100 provided on the lower surface and the rail 76, and the positioning pin 82 and the positioning hole By fitting with the rail 77, the rail 76 is positioned in a plane.

Next, the main positioning section Btt and the sub-positioning section B for positioning the board 10 on the rail 76 will be explained.

These are arranged on the side adjacent to the rail 24 as shown in FIGS. 1 and 8.

As shown in FIG. 11, the bearing 83 of the main positioning section "IS"
is fixed to the rail 76, and the cylinder 85 is fixed thereto. The shaft 84 is slidably supported by a bearing, and is fixed at its end facing the rail 76 of the plate 87. A positioning pin 88 that is fitted into the reference hole 11α of the substrate 100 is supported on the plate 87.

A cylinder 850 and a rod 86 are connected to the secondary plate 87 and move it up and down. On the other hand, the sub-positioning part B,
+7) The bearing 89 is fixed to the frame 76, and the bearing 93 is moved up and down along the shaft 90 by the rod 92 of the cylinder 91. The shaft 90 and cylinder 91 are fixed to a bearing 89. A shaft 96 is slidably supported by the bearing 9S, a support 97 is fixed to one end thereof, a collar 99 is fixed to the other end,
A spring 95 is provided between the support 97 and the collar 99 and the bearing 93.
．． 94 is interposed. Further, the support 98 supports a positioning pin 98 that fits into the reference hole 11A of the substrate 100.

With the above configuration, when the board 10 is carried onto the rail 76, the positioning pins 88 of the main positioning part Z'u fit into the reference holes 11α of the board 10 to perform positioning.

Next, the reference hole 11AK position/positioning pin 98 is fitted to regulate the inclination of the board 10. The deviation error between the reference holes 11a and 11b is absorbed by the sliding movement of the shaft 96. Also, the difference in stress between the springs 95 and 94 due to the sliding of the shaft 96 is determined by the reference hole 113.
(by removing the positioning pin 98 from the shaft 96)
moves to the stress balance position and is eliminated. Even if the positioning pin 98 is removed from the reference hole 11b after the above-mentioned inclination regulation, the positioning pin 98 remains attached to the board 1 due to the fitting between the positioning pin 88 and the reference hole 11a.
There is no problem since the positioning of o has already been completed. In addition, as shown in FIG. 12, positioning pin 88 (=98)
The outer diameter of the reference hole 11a is larger than the inner diameter d of the reference hole 11a (11), and the fitting part of the positioning pin 8B (9B) is formed in a conical shape, so that the two fit together without any play.
Accurate positioning is performed.

As described above, the board 10 is accurately positioned on the rail 76, and the rail 76 is positioned in the three-dimensional direction with respect to the pedestal 21 and the frame 65.

Next, the suction means C will be explained.

As shown in FIG. 10, the cylinder 107 housed within the bracket 72 is fixed to the base 69, and its rod 107
8 is connected to the base 104. As shown in Figure 9,
One end side of the shaft 10 (S) is fixed to the base 104. As shown in FIG. 13, the shaft 106 is arranged in three triangular positions, and extends downward through the base 69 as shown in FIG. and is slidably supported by a bearing 105 fixed to the frame 65. A bearing 112 is also fixed to the base 104 (
As shown in FIG. 13, the shaft 113 is slidably inserted at six locations. A plate 116 made of a non-magnetic material is fixed to one end of the shaft 113, and a nut 114 to prevent removal is fixed to the other end. A plate 117 made of a magnetic material is fixed on the plate 116, and a flat magnet 118 is adhesively fixed on the plate 117. The magnet 118 is arranged on the lower side facing the substrate 10 at an appropriate distance, and is formed from a magnet having an area approximately equal to that of the substrate 10 .

Next, the shock absorbing mechanism E will be explained.

As shown in FIGS. 9 and 10, the other end side (lower end) of the shaft 106
A reduced stepped portion 119 is formed on the collar 1 to be inserted.
A spring 110 is interposed between the flange 111 fixed to the end of the reduced stepped portion 119 and the reduced stepped portion 119.

Further, a spring 115 guided by a shaft 113 is interposed between the base 104 and the plate 117.

In the above configuration, when the cylinder 107 operates and pushes up the base 104, the magnet 11B and the substrate 1° come into contact. At the same time, the collar 109 hits the frame 65 and the spring 110
Press t'. This reduces the impact force between the magnet 118 and the substrate 10. Also, due to the compression of the spring 115, the substrate 1
Make sure that no more force than necessary acts on 0. magnet 118
Upon contact with the substrate 1o, leads (not shown) of electronic components on the substrate 10 are attracted to the magnet 118.

Next, the heating means will be explained.

As shown in FIGS. 1 and 2, a pair of rails 12'5 are fixed to the pedestal 21 and are arranged in parallel and extending in the direction in which the board 10 is transferred, and a frame 128 is slidably mounted between the rails 125. Supported for free movement. A pair of bearings 129 are mounted on the frame 128 to face each other, and a feed screw 130 is installed between the bearings 129 orthogonally to the transfer direction. The slider 133 is screwed into the feed screw 150 and the screw is fed. A moving table 154 is supported by the slider 133 so as to be movable up and down.

As shown in FIGS. 14 and 3315, the movable base 134IC has a rotary base 157 rotatably supported, and a screw 135 that fits into an elongated hole formed in the rotary base 137.
Fixed. The optical system 122 is fixedly supported on the rotating table 137. One end of the optical fiber 121 is connected to the optical system 122 . Further, as shown in FIG. 16, the optical system 122
A mouth portion 138 of an annular nozzle 139 is disposed at a position facing the lower end surface of the nozzle 139 . Nozzle holes 140 are formed radially in the opening 138, and the nozzle holes 140 communicate with an air source at a pressure a (not shown).

As shown in the second factor of FIG. 1, the other end of the optical fiber 121 is wound into a coil and connected to a laser oscillator 120 fixed to the pedestal 21. Also, the delivery is 1'50, so that night 1
32, and the motor 132 is fixed to a support 151 placed on the frame 128. The feed screw 12 also screws into a nut (not shown) fixed to the frame 128.
5 are supports 124 and 126 mounted on the rail 125;
The motor 127 is connected to the motor 127.

With the above configuration, the motor 127 operates to move the slider 133 in the direction of transport of the substrate 10, and the motor 132 moves the slider 133 in a direction perpendicular thereto.

Further, the optical system 122 can be accurately positioned with respect to the F-board 10 by adjusting the vertical movement of the moving table 134 and the rotation of the rotary table 157, and the optical system 122 can be moved to an arbitrary lead position of the electronic component.

The flux vapor generated by the heating of the solder is blown off by the discharge of compressed air from the nozzle 159, thereby preventing the vapor from adhering to the optical system.

As shown in FIG. 17, the distance between the optical system 122 and the substrate 10, whose upper surface is positioned by the contact between the rail 76 and the positioning reference surface 100 of the bracket 81, is such that the focal point f of the laser beam 141 from the optical system 122 is on the substrate. 10. This is a measure to prevent the board 10 from being burnt out due to vibration or the like.

Next, the operation of this embodiment will be explained.

The IC board 10 on the rail 23 of the transfer means A is carried in and the fourth
When the slider 31 shown in the figure comes to the position where it fits into the groove 42 of the piece 41, the claw 65 moves up into the cylinder 39, and the board 10
and the claw 33 engages. The f-ane 52 and the like move due to the operation of the motor 62 shown in the first factor, and the board 1° is mounted on the rail 76 of the positioning means B.

Here, the operation of the cylinders 85 and 91 shown in FIG.
is inserted, and the substrate 10 is positioned on the rail 76.

At this point, the pawl 33 descends as the cylinder 39 moves backwards, and then returns to its original position when the cylinder 62 is reversed.

FIG. 18(a) shows this state. Next, Figure 18 (A)
As shown in FIG. 2, the cylinder 107 of the attractor rRC is operated to bring the magnet 118 close to the substrate 10. As a result, the 19th
As shown in the figure, the lead 15 of the electronic component 14 mounted on the board 10 is attracted to the magnet 118 side, and the IJ + lead 15 and the solder 13 on the wiring pattern 12 are pressed together. S=
The attractive force acting on the driver 5 is proportional to the square of the distance between the lead 15 and the magnet 118, and as the magnet 118 approaches, it is strongly pressed against the solder 13. The above-mentioned attractive force also acts as a force to pull up the magnet 118. Magnet 118 is connected to substrate 1Q4
/(When approaching, as described above, the splash 1 of the shock absorption mechanism E
10 acts, the pulling force of the magnet 118 is reduced, and its rising speed is also slowed down.

Figure 20 shows this situation, and the horizontal axis shows the lead 15.
The distance l between the magnet 118 and the magnet 118 is displayed, and the counter pressure of the spring, the pulling force F, etc. are displayed on the vertical axis.

The curve α is the pulling force, and the curved edge is the counter pressure due to the spring 11G (
(a force acting in the opposite direction to the pulling force), and curve C is a resultant force that counteracts the force acting in the direction of pulling down the magnet 118.

As described above, the number 15 and the solder 13 are brought into pressure contact, but the impact force between the magnet 118 and the substrate 10 is relaxed. Also spring 1
15 further acts to alleviate the above impact force.

As shown in FIG. 21, a magnet 118 is arranged so that two magnetic poles y and S are located under one electronic component 14 as shown, and a magnetic circuit is formed by passing the entire lead 15 of the electronic component 14 through. Therefore, the lead 15 can be suctioned more reliably.

As shown in factor 22, if the center of the substrate 10 is curved downward like 10i, it will be lifted up by the upper surface of the flat magnet 118 and straightened flat; on the other hand, if it is curved upward like 10b, It is flattened by the attraction force of the magnet 118. Therefore, the warpage of the substrate 10 is also corrected.

When the substrate 10 is positioned and corrected as described above, the cylinder 70 is operated and the base 69 is moved as shown in FIG. 18(C).
is raised, and the rail 76 is positioned horizontally, and the upper surface of the board 10 comes into contact with the bracket 81, and is positioned in the vertical direction (also shown in FIG. 17).

In this state, the laser oscillator 12 [1 of the heating means is activated, and the motors 127 and 132 are activated to move the optical system 122 and irradiate a predetermined position of the lead 15 on the substrate 10 with laser light. Since the leads 15 and the solder 13 are in close contact with each other as described above, they are completely joined.

When all the solder joints on the board 10 are completed, the irradiation is stopped, the board 10 is lowered, and the rail 76 is connected to the rail 23.24.
Position at the same level as Positioning bin 88,
98 from the substrate 10, and the claw 331 of the transfer means A
The board 10 is engaged with the ki plate 10, and the rainbow board 10 is transferred onto the rail 24 by the movement of the chain 53 and the like. At the same time rail 23
A ratio board 10 is mounted on the rail 76. The substrate 10 on the rail 24 is transferred to the next processing side.

Hereafter, the same process is repeated.

As described above, according to this embodiment, the board 10 is set so that the warp is corrected, its upper surface and horizontal position are precisely positioned at the predetermined positions, and the errors in the reference holes 11G and 11h are also corrected. Electronic component 1 on board 10
The leads 15 of No. 4 are pressed against the solder 13. Therefore, accurate and reliable soldering is possible regardless of dimensional errors of the substrate 100, dimensional errors or deformation of the leads 150. By synchronizing the operations of each of the above-mentioned means in the C7 using a control means, automated and unmanned operation becomes possible, resulting in labor savings and improved work efficiency.

〔Effect of the invention〕

As is clear from the above explanation, according to the present invention, it is possible to perform solder joints reliably and with a high degree of sheathing, improve product reliability and yield, and achieve the effects of automation and unmanned operation. .

[Brief explanation of drawings]

Fig. 1 is a plan view of one embodiment of the present invention, Fig. 2 is a front view including a partial cross section of the embodiment, Fig. 3 is a plan view showing the transfer means of the embodiment, and Fig. 4 is a 5 is an enlarged view showing details around the slider of the embodiment transfer means, FIG. 6 is an enlarged sectional view of the slider of the embodiment transfer means, and FIG. 7 is a chain connection of the embodiment transfer means. An enlarged view showing the state, FIG. 8 is a front view showing the positioning means and suction means of the embodiment,
Fig. 9 is a sectional view taken along the line ■-IX of the eighth cause, Fig. 10 is a sectional view taken along the line X-X of the ninth prisoner, Fig. 11 is an explanatory diagram showing a part of the positioning means of the embodiment, and Fig. 12 is FIG. 13 is a sectional view showing the relationship between the substrate of the positioning means and the positioning pins of the embodiment, and FIG.
Fig. 14 is a front view of the optical system of the heating means of the embodiment;
Xv line sectional view, Figure 16 is a bottom view of Figure 17,
The figure is an explanatory diagram showing the relationship between the substrate and the optical system in the example.
Figure 8 (al, (Jl), (C1 is a process explanatory diagram of the example, Figure 19 is an explanatory diagram explaining the relationship with the foundation stone on the electronic component of the example, and Figure 20 is the magnet pulling force and spring of the example. Figure 21 is an explanatory diagram illustrating the relationship between the electronic components and the magnet arrangement in the example, and Figure 22 is an explanatory diagram illustrating the relationship between the warpage of the board and the magnet in the example. , FIG. 23 is a perspective view showing the prior art. 10... Substrates 11a, 111...,
Reference hole 7... mount? 2...Support stand 2
5.24, 29.76...Rail 26.78...
Lid 27...stand 2B...between supports
...Roller 51...Slider 33...
・Claw 34... Arm 37... Plunger 39... Cylinder 41... Piece
42...Groove 46.57...Connection frame
dB, Spring 52.53...Chain 56
... Bearing 58.59 ... Suffrocket 62 ... Motor 65 ... Frame 66.6B ... Bearing 67 ... Shaft 69 ... Base 70
...Cylinder 75...Support stand 73α...
・Guide bin 74...Guide collar 75...
Spring 79...Positioning hole 81...Bracket 82...Positioning pin 85.91...Cylinder 88.98...Positioning pin 104.
...Pace 105...Bearing 106...Shaft 1.12...Bearing 113...Shaft
110,115... Spring 116.117.
...Plate 118...Magnet 120...Laser oscillator 121...Optical 7 eyeper 122...Optical system 125...Feed screw 127.152...
・Motor 133...Slider 134...Moving table 137...Rotating table 139...Nozzle Almost 2 figures Gate 4 figure Helmet 5 figure closed 6 figure 7 figure corner cJ figure 2 Paste 10 figure penalty 1. 1 Prisoner y512 Figure Closed 14 Figure 1 X7 AQ9- Porridge I''7 Figure 22 Figure 23

Claims (1)

[Claims] In a soldering machine, solder is interposed between the wiring pattern of the board and the lead of the electronic component mounted on the board, and the solder is heated and melted to join the wiring pattern and the lead. Support and bring this in,
a transfer means for intermediate stopping and carrying out; a positioning means disposed at the intermediate stopping position for positioning and holding the substrate at a predetermined position; an attraction means having a flat magnet in close contact with the substrate and a shock absorbing mechanism for reducing the impact force between the magnet and the substrate; and an attraction means disposed above the substrate facing the attraction means and moved to the lead position. 1. A soldering device for electronic component leads, comprising a heating means that freely engages and heats and melts the solder.