JPS6135526A - 半導体装置の冷却装置 - Google Patents

半導体装置の冷却装置

Info

Publication number
JPS6135526A
JPS6135526A JP15526884A JP15526884A JPS6135526A JP S6135526 A JPS6135526 A JP S6135526A JP 15526884 A JP15526884 A JP 15526884A JP 15526884 A JP15526884 A JP 15526884A JP S6135526 A JPS6135526 A JP S6135526A
Authority
JP
Japan
Prior art keywords
cooling
semiconductor device
cooling fin
fins
cooling fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15526884A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0455338B2 (enEXAMPLES
Inventor
Hitoshi Matsushima
均 松島
Takehiko Yanagida
柳田　武彦
Hisashi Nakayama
中山　恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15526884A priority Critical patent/JPS6135526A/ja
Publication of JPS6135526A publication Critical patent/JPS6135526A/ja
Publication of JPH0455338B2 publication Critical patent/JPH0455338B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP15526884A 1984-07-27 1984-07-27 半導体装置の冷却装置 Granted JPS6135526A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15526884A JPS6135526A (ja) 1984-07-27 1984-07-27 半導体装置の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15526884A JPS6135526A (ja) 1984-07-27 1984-07-27 半導体装置の冷却装置

Publications (2)

Publication Number Publication Date
JPS6135526A true JPS6135526A (ja) 1986-02-20
JPH0455338B2 JPH0455338B2 (enEXAMPLES) 1992-09-03

Family

ID=15602193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15526884A Granted JPS6135526A (ja) 1984-07-27 1984-07-27 半導体装置の冷却装置

Country Status (1)

Country Link
JP (1) JPS6135526A (enEXAMPLES)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4964458A (en) * 1986-04-30 1990-10-23 International Business Machines Corporation Flexible finned heat exchanger
JP2020117027A (ja) * 2019-01-22 2020-08-06 株式会社デンソー 車両用空調装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52159167U (enEXAMPLES) * 1976-05-28 1977-12-02
JPS55140255A (en) * 1979-04-18 1980-11-01 Nec Corp Heat sink structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52159167U (enEXAMPLES) * 1976-05-28 1977-12-02
JPS55140255A (en) * 1979-04-18 1980-11-01 Nec Corp Heat sink structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4964458A (en) * 1986-04-30 1990-10-23 International Business Machines Corporation Flexible finned heat exchanger
JP2020117027A (ja) * 2019-01-22 2020-08-06 株式会社デンソー 車両用空調装置

Also Published As

Publication number Publication date
JPH0455338B2 (enEXAMPLES) 1992-09-03

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees