JPS6134990A - 電子部品搭載用基板およびその製造方法 - Google Patents

電子部品搭載用基板およびその製造方法

Info

Publication number
JPS6134990A
JPS6134990A JP15642684A JP15642684A JPS6134990A JP S6134990 A JPS6134990 A JP S6134990A JP 15642684 A JP15642684 A JP 15642684A JP 15642684 A JP15642684 A JP 15642684A JP S6134990 A JPS6134990 A JP S6134990A
Authority
JP
Japan
Prior art keywords
substrate
metal plate
recess
printed wiring
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15642684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0446478B2 (enExample
Inventor
矢津　一
勝美 馬淵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP15642684A priority Critical patent/JPS6134990A/ja
Publication of JPS6134990A publication Critical patent/JPS6134990A/ja
Publication of JPH0446478B2 publication Critical patent/JPH0446478B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Die Bonding (AREA)
JP15642684A 1984-07-25 1984-07-25 電子部品搭載用基板およびその製造方法 Granted JPS6134990A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15642684A JPS6134990A (ja) 1984-07-25 1984-07-25 電子部品搭載用基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15642684A JPS6134990A (ja) 1984-07-25 1984-07-25 電子部品搭載用基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPS6134990A true JPS6134990A (ja) 1986-02-19
JPH0446478B2 JPH0446478B2 (enExample) 1992-07-30

Family

ID=15627485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15642684A Granted JPS6134990A (ja) 1984-07-25 1984-07-25 電子部品搭載用基板およびその製造方法

Country Status (1)

Country Link
JP (1) JPS6134990A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6165490A (ja) * 1984-09-06 1986-04-04 イビデン株式会社 電子部品搭載用基板の製造方法
JPS63261840A (ja) * 1987-04-20 1988-10-28 Matsushita Electric Ind Co Ltd プリント配線板
JPS6439093A (en) * 1987-08-05 1989-02-09 Matsushita Electric Works Ltd Manufacture of electronic part mounting board
JPH03152985A (ja) * 1989-11-09 1991-06-28 Ibiden Co Ltd 電子部品搭載用基板
JPH03183195A (ja) * 1989-09-14 1991-08-09 Litton Syst Inc 集積回路装置及びその製造方法
JPH0379440U (enExample) * 1989-12-01 1991-08-13
JPH04192551A (ja) * 1990-11-27 1992-07-10 Matsushita Electric Works Ltd 半導体チップキャリア

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3779721B1 (ja) * 2005-07-28 2006-05-31 新神戸電機株式会社 積層回路基板の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60111489A (ja) * 1983-11-21 1985-06-17 イビデン株式会社 電子部品塔載用基板およびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60111489A (ja) * 1983-11-21 1985-06-17 イビデン株式会社 電子部品塔載用基板およびその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6165490A (ja) * 1984-09-06 1986-04-04 イビデン株式会社 電子部品搭載用基板の製造方法
JPS63261840A (ja) * 1987-04-20 1988-10-28 Matsushita Electric Ind Co Ltd プリント配線板
JPS6439093A (en) * 1987-08-05 1989-02-09 Matsushita Electric Works Ltd Manufacture of electronic part mounting board
JPH03183195A (ja) * 1989-09-14 1991-08-09 Litton Syst Inc 集積回路装置及びその製造方法
JPH03152985A (ja) * 1989-11-09 1991-06-28 Ibiden Co Ltd 電子部品搭載用基板
JPH0379440U (enExample) * 1989-12-01 1991-08-13
JPH04192551A (ja) * 1990-11-27 1992-07-10 Matsushita Electric Works Ltd 半導体チップキャリア

Also Published As

Publication number Publication date
JPH0446478B2 (enExample) 1992-07-30

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term