JPS6134990A - 電子部品搭載用基板およびその製造方法 - Google Patents
電子部品搭載用基板およびその製造方法Info
- Publication number
- JPS6134990A JPS6134990A JP15642684A JP15642684A JPS6134990A JP S6134990 A JPS6134990 A JP S6134990A JP 15642684 A JP15642684 A JP 15642684A JP 15642684 A JP15642684 A JP 15642684A JP S6134990 A JPS6134990 A JP S6134990A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- metal plate
- recess
- printed wiring
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 38
- 238000000034 method Methods 0.000 title claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 56
- 239000002184 metal Substances 0.000 claims description 56
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 20
- 230000017525 heat dissipation Effects 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- -1 sulfo- Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15642684A JPS6134990A (ja) | 1984-07-25 | 1984-07-25 | 電子部品搭載用基板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15642684A JPS6134990A (ja) | 1984-07-25 | 1984-07-25 | 電子部品搭載用基板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6134990A true JPS6134990A (ja) | 1986-02-19 |
| JPH0446478B2 JPH0446478B2 (enrdf_load_stackoverflow) | 1992-07-30 |
Family
ID=15627485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15642684A Granted JPS6134990A (ja) | 1984-07-25 | 1984-07-25 | 電子部品搭載用基板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6134990A (enrdf_load_stackoverflow) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6165490A (ja) * | 1984-09-06 | 1986-04-04 | イビデン株式会社 | 電子部品搭載用基板の製造方法 |
| JPS63261840A (ja) * | 1987-04-20 | 1988-10-28 | Matsushita Electric Ind Co Ltd | プリント配線板 |
| JPS6439093A (en) * | 1987-08-05 | 1989-02-09 | Matsushita Electric Works Ltd | Manufacture of electronic part mounting board |
| JPH03152985A (ja) * | 1989-11-09 | 1991-06-28 | Ibiden Co Ltd | 電子部品搭載用基板 |
| JPH03183195A (ja) * | 1989-09-14 | 1991-08-09 | Litton Syst Inc | 集積回路装置及びその製造方法 |
| JPH0379440U (enrdf_load_stackoverflow) * | 1989-12-01 | 1991-08-13 | ||
| JPH04192551A (ja) * | 1990-11-27 | 1992-07-10 | Matsushita Electric Works Ltd | 半導体チップキャリア |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3779721B1 (ja) * | 2005-07-28 | 2006-05-31 | 新神戸電機株式会社 | 積層回路基板の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60111489A (ja) * | 1983-11-21 | 1985-06-17 | イビデン株式会社 | 電子部品塔載用基板およびその製造方法 |
-
1984
- 1984-07-25 JP JP15642684A patent/JPS6134990A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60111489A (ja) * | 1983-11-21 | 1985-06-17 | イビデン株式会社 | 電子部品塔載用基板およびその製造方法 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6165490A (ja) * | 1984-09-06 | 1986-04-04 | イビデン株式会社 | 電子部品搭載用基板の製造方法 |
| JPS63261840A (ja) * | 1987-04-20 | 1988-10-28 | Matsushita Electric Ind Co Ltd | プリント配線板 |
| JPS6439093A (en) * | 1987-08-05 | 1989-02-09 | Matsushita Electric Works Ltd | Manufacture of electronic part mounting board |
| JPH03183195A (ja) * | 1989-09-14 | 1991-08-09 | Litton Syst Inc | 集積回路装置及びその製造方法 |
| JPH03152985A (ja) * | 1989-11-09 | 1991-06-28 | Ibiden Co Ltd | 電子部品搭載用基板 |
| JPH0379440U (enrdf_load_stackoverflow) * | 1989-12-01 | 1991-08-13 | ||
| JPH04192551A (ja) * | 1990-11-27 | 1992-07-10 | Matsushita Electric Works Ltd | 半導体チップキャリア |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0446478B2 (enrdf_load_stackoverflow) | 1992-07-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |