JPS6132819B2 - - Google Patents
Info
- Publication number
- JPS6132819B2 JPS6132819B2 JP55178885A JP17888580A JPS6132819B2 JP S6132819 B2 JPS6132819 B2 JP S6132819B2 JP 55178885 A JP55178885 A JP 55178885A JP 17888580 A JP17888580 A JP 17888580A JP S6132819 B2 JPS6132819 B2 JP S6132819B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit chip
- heat
- cap
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 14
- 239000004020 conductor Substances 0.000 description 12
- 239000001307 helium Substances 0.000 description 10
- 229910052734 helium Inorganic materials 0.000 description 10
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000002470 thermal conductor Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 239000011888 foil Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 241000195955 Equisetum hyemale Species 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17888580A JPS57103337A (en) | 1980-12-19 | 1980-12-19 | Heat transfer connecting device and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17888580A JPS57103337A (en) | 1980-12-19 | 1980-12-19 | Heat transfer connecting device and manufacture thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57103337A JPS57103337A (en) | 1982-06-26 |
JPS6132819B2 true JPS6132819B2 (de) | 1986-07-29 |
Family
ID=16056393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17888580A Granted JPS57103337A (en) | 1980-12-19 | 1980-12-19 | Heat transfer connecting device and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57103337A (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4448240A (en) * | 1982-12-20 | 1984-05-15 | International Business Machines Corporation | Telescoping thermal conduction element for cooling semiconductor devices |
JPS59144153A (ja) * | 1983-02-07 | 1984-08-18 | Nec Corp | 集積回路パツケ−ジ冷却構造 |
US4535841A (en) * | 1983-10-24 | 1985-08-20 | International Business Machines Corporation | High power chip cooling device and method of manufacturing same |
JPS60126853A (ja) * | 1983-12-14 | 1985-07-06 | Hitachi Ltd | 半導体デバイス冷却装置 |
US4714953A (en) * | 1986-05-12 | 1987-12-22 | International Business Machines Corporation | Welded wire cooling |
JP2507561B2 (ja) * | 1988-10-19 | 1996-06-12 | 株式会社日立製作所 | 半導体の冷却装置 |
DE69126686T2 (de) * | 1990-08-14 | 1997-10-23 | Texas Instruments Inc | Wärmetransportmodul für Anwendungen ultrahoher Dichte und Silizium auf Siliziumpackungen |
US5239200A (en) * | 1991-08-21 | 1993-08-24 | International Business Machines Corporation | Apparatus for cooling integrated circuit chips |
US5177667A (en) * | 1991-10-25 | 1993-01-05 | International Business Machines Corporation | Thermal conduction module with integral impingement cooling |
JPH0786471A (ja) * | 1993-09-20 | 1995-03-31 | Hitachi Ltd | 半導体モジュ−ル |
EP0848469B1 (de) * | 1996-12-10 | 2003-05-07 | Barat S.A. | Wärmesenkevorrichtung für einem elektrischen Verteilerschrank oder dergleichen zur unterirdischen Montage |
KR20050079962A (ko) * | 2005-06-22 | 2005-08-11 | 박재석 | 압축가스를 이용한 발열체의 냉각방법 및 그 장치 |
JP5805838B1 (ja) | 2014-09-29 | 2015-11-10 | 株式会社日立製作所 | 発熱体の冷却構造、電力変換器ユニットおよび電力変換装置 |
CN105118811B (zh) * | 2015-07-27 | 2018-10-23 | 电子科技大学 | 一种采用均热板及微通道对多热源器件散热的均温装置 |
JP6533755B2 (ja) * | 2016-03-22 | 2019-06-19 | 株式会社日立製作所 | 発熱体の冷却構造 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3524479A (en) * | 1968-07-19 | 1970-08-18 | Scovill Manufacturing Co | Woven zipper stringer and method of making the same |
-
1980
- 1980-12-19 JP JP17888580A patent/JPS57103337A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3524479A (en) * | 1968-07-19 | 1970-08-18 | Scovill Manufacturing Co | Woven zipper stringer and method of making the same |
Also Published As
Publication number | Publication date |
---|---|
JPS57103337A (en) | 1982-06-26 |
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