JPS6131574B2 - - Google Patents
Info
- Publication number
- JPS6131574B2 JPS6131574B2 JP1745280A JP1745280A JPS6131574B2 JP S6131574 B2 JPS6131574 B2 JP S6131574B2 JP 1745280 A JP1745280 A JP 1745280A JP 1745280 A JP1745280 A JP 1745280A JP S6131574 B2 JPS6131574 B2 JP S6131574B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- parts
- weight
- fuse
- fuse element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910045601 alloy Inorganic materials 0.000 claims description 19
- 239000000956 alloy Substances 0.000 claims description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 15
- 229910052738 indium Inorganic materials 0.000 claims description 14
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 description 13
- 230000008018 melting Effects 0.000 description 10
- 238000002844 melting Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910001325 element alloy Inorganic materials 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 229910000925 Cd alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H2037/768—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material characterised by the composition of the fusible material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1745280A JPS56114240A (en) | 1980-02-14 | 1980-02-14 | Temperature fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1745280A JPS56114240A (en) | 1980-02-14 | 1980-02-14 | Temperature fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56114240A JPS56114240A (en) | 1981-09-08 |
| JPS6131574B2 true JPS6131574B2 (US07860544-20101228-C00003.png) | 1986-07-21 |
Family
ID=11944407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1745280A Granted JPS56114240A (en) | 1980-02-14 | 1980-02-14 | Temperature fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56114240A (US07860544-20101228-C00003.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853386A (ja) * | 1981-09-25 | 1983-03-29 | Nec Home Electronics Ltd | 接合方法 |
| JPH0782795B2 (ja) * | 1986-11-06 | 1995-09-06 | 内橋エステツク株式会社 | 温度ヒユ−ズ |
| US5139883A (en) * | 1989-05-09 | 1992-08-18 | Grigory Raykhtsaum | Intermetallic time-temperature integration fuse |
-
1980
- 1980-02-14 JP JP1745280A patent/JPS56114240A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56114240A (en) | 1981-09-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4787135A (en) | Method of attaching leads to PTC devices | |
| US4944084A (en) | Fuse and manufacturing method thereof | |
| US5752310A (en) | Method of making a slowly-breaking fuse | |
| US20020012608A1 (en) | Pb-free solder composition and soldered article | |
| US3199004A (en) | Connections in semiconductor devices | |
| US7068141B2 (en) | Thermal fuse | |
| US6819215B2 (en) | Alloy type thermal fuse and fuse element thereof | |
| GB2038093A (en) | Fused electrolytic capacitor assembly | |
| JPH06504875A (ja) | 高定格電流用平形ヒューズ | |
| US6774761B2 (en) | Alloy type thermal fuse and fuse element thereof | |
| EP1383149B1 (en) | Alloy type thermal fuse and wire member for a thermal fuse element | |
| JPS6131574B2 (US07860544-20101228-C00003.png) | ||
| US20050030148A1 (en) | Thermal fuse and method of manufacturing fuse | |
| US3769007A (en) | Lead-bismuth alloy for soldering aluminum | |
| JP2669674B2 (ja) | ヒューズ | |
| US3140371A (en) | Fuse constructions | |
| JPS6166329A (ja) | ブロツク形ヒユ−ズ | |
| US3716909A (en) | Improved method of soldering | |
| JPH03255637A (ja) | ダイボンディング用半田 | |
| JPH01241729A (ja) | ヒューズ | |
| EP0507718A1 (en) | Low lead content Pb-Sn-Ag-Sb solder alloy useful in an interconnect metallization structure | |
| JPH01241728A (ja) | ヒューズ及びその製造方法 | |
| JPS58142505A (ja) | 過負荷溶断形抵抗器 | |
| JPS6335359B2 (US07860544-20101228-C00003.png) | ||
| JPS6322599Y2 (US07860544-20101228-C00003.png) |
