JPS6130304Y2 - - Google Patents
Info
- Publication number
- JPS6130304Y2 JPS6130304Y2 JP17853280U JP17853280U JPS6130304Y2 JP S6130304 Y2 JPS6130304 Y2 JP S6130304Y2 JP 17853280 U JP17853280 U JP 17853280U JP 17853280 U JP17853280 U JP 17853280U JP S6130304 Y2 JPS6130304 Y2 JP S6130304Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- light emitting
- emitting diode
- substrate
- reflective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 18
- 239000011888 foil Substances 0.000 claims description 11
- 238000009792 diffusion process Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17853280U JPS6130304Y2 (enEXAMPLES) | 1980-12-11 | 1980-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17853280U JPS6130304Y2 (enEXAMPLES) | 1980-12-11 | 1980-12-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57100252U JPS57100252U (enEXAMPLES) | 1982-06-19 |
| JPS6130304Y2 true JPS6130304Y2 (enEXAMPLES) | 1986-09-05 |
Family
ID=29973414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17853280U Expired JPS6130304Y2 (enEXAMPLES) | 1980-12-11 | 1980-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6130304Y2 (enEXAMPLES) |
-
1980
- 1980-12-11 JP JP17853280U patent/JPS6130304Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57100252U (enEXAMPLES) | 1982-06-19 |
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