JPS61290010A - Dicing device - Google Patents
Dicing deviceInfo
- Publication number
- JPS61290010A JPS61290010A JP60132829A JP13282985A JPS61290010A JP S61290010 A JPS61290010 A JP S61290010A JP 60132829 A JP60132829 A JP 60132829A JP 13282985 A JP13282985 A JP 13282985A JP S61290010 A JPS61290010 A JP S61290010A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- pressure water
- dicing
- photomask
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（発明の技術分野〕
本発明は半導体装置製造用フォトマスクに切断溝を形成
するダイシング装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to a dicing apparatus for forming cutting grooves in a photomask for manufacturing semiconductor devices.
第２図は従来のダイシング装置の側面図である。 FIG. 2 is a side view of a conventional dicing device.
このダイシング装置は高速回転するダイヤモンドブレー
ド等の切断刃１と、フォトマスク２が載置されて水平面
内で回転すると共に、前後左右に移動する移動台３と、
切断刃に冷却水を噴き付ける冷却水ノズル４とからなっ
ている。この装置は切断刃１を図示しない駆動源によっ
て高速回転させながら移動台３を水平に移動させること
により、フォトマスク２に所定深さの切断溝５を形成す
るものであり、切断の際には冷却水ノズル４からの冷却
水によって切断刃１の冷却が行なわれる。そして、フォ
トマスク２に切断溝を形成した後は、切断溝に沿ってフ
ォトマスク２を押し割り、個々のフォトマスクの分離が
行なわれる。This dicing device includes a cutting blade 1 such as a diamond blade that rotates at high speed, a movable table 3 on which a photomask 2 is placed, which rotates in a horizontal plane, and which moves back and forth and left and right.
It consists of a cooling water nozzle 4 that sprays cooling water onto the cutting blade. This device forms a cutting groove 5 of a predetermined depth in a photomask 2 by horizontally moving a movable table 3 while rotating a cutting blade 1 at high speed by a drive source (not shown). The cutting blade 1 is cooled by cooling water from the cooling water nozzle 4. After the cutting grooves are formed in the photomask 2, the photomask 2 is pushed along the cutting grooves to separate the individual photomasks.
しかしながら、この従来装置においては、切断溝の形成
の際に発生する切削屑６が切断溝５内に付着、堆積し、
しかも、強固に付着するため、通常の洗浄作業では除去
することができない。従って、ダイシング加工後の他の
工程に切削屑が持ち込まれ、後工程で切削屑が周囲に飛
散して作業環境を悪化させると共に、製品の歩留り低下
の原因ともなっている。However, in this conventional device, cutting debris 6 generated during the formation of the cutting grooves adheres and accumulates within the cutting grooves 5.
Furthermore, it adheres strongly and cannot be removed by normal cleaning operations. Therefore, the cutting waste is brought into other processes after the dicing process, and the cutting waste is scattered around in the subsequent process, deteriorating the working environment and causing a decrease in product yield.
本発明は上記事情を考慮してなされたものであり、切削
溝内に付着する切削屑をダイシング時に確実に除去して
、後工程での飛散を防止したダイシング装置を提供する
ことを目的としている。The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a dicing device that reliably removes cutting debris adhering to cutting grooves during dicing and prevents them from scattering in subsequent processes. .
上記目的を達成するため本発明によるダイシング装置は
、高圧水を噴出させるノズルを切断刃に近接して配設し
、ダイシング時に高圧水を切断溝内に噴射させて切削屑
を溝外に排出させることを特徴としている。In order to achieve the above object, the dicing device according to the present invention has a nozzle that spouts high-pressure water disposed close to the cutting blade, and during dicing, the high-pressure water is jetted into the cutting groove to discharge cutting waste out of the groove. It is characterized by
（発明の実施例）
以下、本発明によるダイシング装置の一実施例を第１図
を参照して具体的に説明する。なお、図示の実施例にお
いて従来装置と同一の要素は同一の符号で対応させて説
明する。(Embodiment of the Invention) Hereinafter, an embodiment of a dicing apparatus according to the present invention will be specifically described with reference to FIG. In addition, in the illustrated embodiment, the same elements as those of the conventional device will be explained using the same reference numerals.
ダイヤモンドブレード等からなる切断刃１が図示しない
駆動源によって高速回転され、この切断刃１の下方に移
動台３が設けられている。この移動台３は図示しない操
作手段によって水平面内で回転すると共に前後、左右に
移動可能となっており、上面にはフォトマスク２が載置
されるようになっている。そして、切断刃１に近接した
両側には高圧水を噴出させるノズル７．８が配設されて
いる。このノズル７．８はいずれも接続管９の先端部に
取り付けられており、接続管９が図示しないポンプ答の
加圧源に接続され、加圧源の駆動で各ノズル７．８から
所定圧力および所定水流の高圧水を噴出させるものであ
る。かかるノズル７゜８は前記切断刃１を含む平面内に
配設されており、これにより、切断刃１の回転で半導体
ウェーハ２に切込まれる切断溝５内に高圧水が噴射され
て、ダイシング時に発生して切断ｆ％７５内に堆積、付
着する切断屑６を満５外に確実に排出させるようになっ
ている。A cutting blade 1 made of a diamond blade or the like is rotated at high speed by a drive source (not shown), and a movable table 3 is provided below the cutting blade 1. This movable table 3 can be rotated in a horizontal plane and moved back and forth, left and right by an operation means (not shown), and a photomask 2 is placed on the upper surface. Further, nozzles 7.8 for spouting high-pressure water are arranged on both sides close to the cutting blade 1. These nozzles 7.8 are all attached to the tip of a connecting pipe 9, and the connecting pipe 9 is connected to a pressurizing source of a pump (not shown). and jets out a predetermined stream of high-pressure water. The nozzle 7° 8 is disposed in a plane containing the cutting blade 1, and as a result, high-pressure water is injected into the cutting groove 5 cut into the semiconductor wafer 2 by the rotation of the cutting blade 1, thereby performing dicing. Cutting debris 6 that is generated and accumulates and adheres inside the cutting f% 75 is reliably discharged outside the cutting f% 75.
なお、ここで右側のノズル８は移動台３が右に移動する
際に高圧水の噴出を行ない、左側のノズル７は移動台３
が左に移動する際に高圧水の噴出を行なうようにしても
よいが、左右のノズルから同時に高圧水を噴出するよう
にしてもよい。Note that the nozzle 8 on the right side sprays high-pressure water when the moving table 3 moves to the right, and the nozzle 7 on the left side sprays high-pressure water when the moving table 3 moves to the right.
The high-pressure water may be ejected when the nozzle moves to the left, or the high-pressure water may be ejected from the left and right nozzles at the same time.
又、噴出する高圧水の水流は例えば直径０．０１〜１
ｍｔｔｒの範囲内である。高圧水の圧力も切削屑の大き
さ、ｍ等によって調整され、３Ｋｇ／ ｃｉないし３５
０に９／ｄの範囲内で選定される。In addition, the jet of high-pressure water that is ejected has a diameter of, for example, 0.01 to 1
It is within the mttr range. The pressure of high-pressure water is also adjusted depending on the size of cutting chips, m, etc., and is 3Kg/ci to 35
0 to 9/d.
このような本実施例によると、切断刃によってフォトマ
スクに切断溝を形成する際に、高圧水によって切削屑が
切断溝内から排出されるから、分割される各フォトマス
クには切削屑が付着することがない。According to this embodiment, when cutting grooves are formed on the photomask by the cutting blade, the cutting waste is discharged from the cutting groove by high-pressure water, so that the cutting waste does not adhere to each photomask to be divided. There's nothing to do.
なお、ノズルは最適の角度、位置、角度で噴射を行なう
べく調整可能に構成しておくのが望ましい。Note that it is desirable that the nozzle be configured to be adjustable so as to spray at the optimum angle, position, and angle.
また、ノズルは、図示の例では２個であるが、その数は
、適宜変えうる。さらに、ノズルを、移動台の移動方向
に応じて常に下流側に位置するように、位置調整できる
ようにすればノズルの数を減らすことができ、装置の簡
略化が可能となる。Further, although there are two nozzles in the illustrated example, the number can be changed as appropriate. Furthermore, if the position of the nozzle can be adjusted so that it is always located on the downstream side depending on the moving direction of the moving table, the number of nozzles can be reduced, and the apparatus can be simplified.
以上のとおり、本発明によれば、ノズルから高圧水を切
断溝内に噴射させてダイシング時に切削屑の除去を行な
うようにしたから、後工程まで切削屑が持ち込まれるこ
となく、作業環境の汚染や製品歩留の低下を防止するこ
とができる。As described above, according to the present invention, cutting waste is removed during dicing by injecting high-pressure water into the cutting groove from the nozzle, so cutting waste is not carried into the subsequent process, thereby contaminating the working environment. It is possible to prevent a decrease in product yield.
第１図は本発明の一実施例の側面図、第２図は従来装置
の側面図である。
１・・・切断刃、２・・・フォトマスク、３・・・移動
台、５・・・切断溝、７，８・・・ノズル。FIG. 1 is a side view of one embodiment of the present invention, and FIG. 2 is a side view of a conventional device. DESCRIPTION OF SYMBOLS 1... Cutting blade, 2... Photomask, 3... Moving table, 5... Cutting groove, 7, 8... Nozzle.
Claims (1)
前記フォトマスクに切断溝を形成する切断刃と、切断溝
内の切削屑を溝外に排出させる高圧水を切断溝内に噴出
するノズルとからなることを特徴とするダイシング装置
。 ２、ノズルが切断刃の両側に配設されている特許請求の
範囲第１項記載のダイシング装置。 ３、高圧水の圧力が３Ｋｇ／ｃｍ＾２〜３５０Ｋｇ／ｃ
ｍ＾２である特許請求の範囲第１項記載のダイシング装
置。[Claims] 1. A movable table on which a photomask is placed, a cutting blade that rotates at high speed to form cutting grooves in the photomask, and high-pressure water that discharges cutting waste in the cutting grooves to the outside of the grooves. A dicing device comprising: a nozzle that ejects water into a cutting groove; 2. The dicing device according to claim 1, wherein the nozzles are arranged on both sides of the cutting blade. 3. High pressure water pressure is 3Kg/cm^2~350Kg/c
The dicing apparatus according to claim 1, wherein the dicing device has a diameter of m^2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60132829A JPS61290010A (en) | 1985-06-18 | 1985-06-18 | Dicing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60132829A JPS61290010A (en) | 1985-06-18 | 1985-06-18 | Dicing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61290010A true JPS61290010A (en) | 1986-12-20 |
Family
ID=15090509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60132829A Pending JPS61290010A (en) | 1985-06-18 | 1985-06-18 | Dicing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61290010A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010062487A (en) * | 2008-09-08 | 2010-03-18 | Tokyo Seimitsu Co Ltd | Cutting processing apparatus and cutting processing method |
-
1985
- 1985-06-18 JP JP60132829A patent/JPS61290010A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010062487A (en) * | 2008-09-08 | 2010-03-18 | Tokyo Seimitsu Co Ltd | Cutting processing apparatus and cutting processing method |
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