JP2010062487A - Cutting processing apparatus and cutting processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting processing apparatus and a cutting processing method which can facilitate separation without damaging a device formed on a wafer surface, and can efficiently remove contamination remaining in a gap between a wafer and a protection member. <P>SOLUTION: The work W is cut while a fluid 21 is supplied by a fluid supply means 11 from a processing groove 20 to the gap 19 between the protection member 16 and wafer 15. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a cutting apparatus and a cutting method for cutting a protective member side of a workpiece in which a wafer and a protective member are bonded to each other via an adhesive layer formed on an outer peripheral portion.

  A cutting device for cutting or grooving a workpiece such as a wafer on which a semiconductor device or an electronic component is formed includes a thin disk-shaped blade formed by diamond abrasive grains rotated at high speed by a spindle. A work table for sucking and holding the work and X, Y, Z, and θ movement axes for changing the relative positions of the work table and the blade are provided. When machining a workpiece, a cutting fluid for cooling or lubrication is supplied from a nozzle to a rotating blade or a machining point where the workpiece and the blade are in contact with each other, and the blade and the workpiece are relatively moved by each moving axis. Cutting or grooving is performed on the workpiece by cutting the workpiece with the blade.

  FIG. 1 shows an example of a cutting apparatus. The cutting apparatus 1 includes a high-frequency motor built-in spindles 3 and 3 that are disposed to face each other and have a blade 2 and a wheel cover (not shown) attached to the tip, an imaging unit 4 that images the surface of the workpiece W, and a workpiece W Is provided with a work table 6 having a work table 5 that holds the work table 5 and a moving shaft that relatively moves the work table 5 and the blade 2.

  The cutting device 1 includes a wafer cleaning device 7 that spin-cleans a processed workpiece W in addition to the processing unit 6, a load port 8 that mounts a cassette that stores a large number of workpieces W mounted on the frame F, Conveying means 9 for conveying the workpiece W, display means 10 for displaying an image picked up by the image pickup means 4 and inputting an operation to each part, a controller (not shown) for controlling the operation of each part, and the like. .

  In recent years, wafers processed by such a cutting device have been processed thinner by grinding the backside with a grinding device before cutting, in order to reduce the size and weight of semiconductor devices and electronic components. Yes. Since the wafer thinned in this way is very thin with a thickness of 100μ or less and low rigidity, it is difficult to carry and perform various processing, and a method of processing with a support bonded to the surface of the wafer has been proposed. (For example, refer to Patent Document 1 or Patent Document 2).

  However, if the support is bonded to such a wafer surface, the support must be peeled off after processing, and the adhesive must be degraded by various methods to reduce the adhesive force and peel off. I had to. Further, it is necessary to remove the adhesive remaining on the wafer surface after peeling, and complete removal of the adhesive is a very difficult operation.

In order to deal with such problems, a protective member is attached to the outer peripheral area of the wafer via an adhesive, and the inner side of the adhesive layer of the protective member is cut into a circular shape by a cutting device after the back surface grinding. A wafer processing method for removing the protective member has been proposed (see, for example, Patent Document 3).
Japanese Patent Laid-Open No. 2004-22634 JP 2003-209083 A JP 2005-123568 A

  However, when the inner side of the adhesive layer of the protective member is cut as described in Patent Document 3, the center of the protective member falls after the cutting is finished, and the device formed on the wafer is damaged, and the protective member center and the wafer are also damaged. This causes a problem that adsorption becomes difficult to separate. Further, there also arises a problem that processing residues (hereinafter referred to as “contamination”) such as cutting chips generated during the cutting process enter the gap between the wafer and the protective member and are fixed inside.

  The present invention has been made for such a problem, and facilitates separation without causing scratches on devices formed on the wafer surface, and prevents contamination remaining in the gap between the wafer and the protective member. It aims at providing the cutting device and cutting method which remove efficiently.

  In order to achieve the above object, the present invention provides a disk-shaped blade, a spindle for rotating the blade, a wafer having a plurality of devices formed on the surface, and a surface of the wafer. A work table for holding a work in which a protective member to be protected is bonded to each other via an adhesive layer formed on an outer peripheral portion; a moving shaft for relatively moving the work table and the blade; Fluid supply means for supplying a fluid to a gap between the protection member formed by the adhesive layer and the wafer from a processing groove formed on the protection member side is provided.

  According to the invention described in claim 1, the cutting apparatus includes a disk-shaped blade, a spindle that rotates the blade, a wafer having a plurality of devices formed on the surface, and a protective member that protects the surface of the wafer. Formed inside the adhesive layer on the protective member side of the workpiece by the work table that holds the work bonded together via the adhesive layer formed on the outer periphery, the moving shaft that relatively moves the work table and the blade, and the blade Fluid supply means for supplying fluid to the gap between the protective member formed by the adhesive layer and the wafer from the processed groove formed.

  As a result, the fluid is continuously sealed into the gap through the machining groove from the fluid supply means, the contamination generated by the cutting process is flowed out to the outside, and the center of the cut protection member is not dropped by the fluid. Therefore, it is possible to efficiently remove the contaminants remaining in the gap between the wafer and the protective member without causing scratches on the device formed on the wafer surface.

  According to a second aspect of the present invention, in the first aspect of the invention, the fluid supplied from the fluid supply means is a fluid equivalent to a cutting fluid supplied in the vicinity of the blade or a fluid supply source different from the cutting fluid. It is characterized by being a more supplied fluid.

  According to the invention of claim 2, the fluid supplied from the machining groove to the gap between the protective member and the wafer is pure water supplied from a fluid supply source equivalent to the cutting fluid sprayed to the vicinity of the blade at the time of machining. Or a fluid such as air or pure water supplied from a fluid supply source different from the cutting fluid.

  According to a third aspect of the present invention, a work having a wafer having a plurality of devices formed on the surface and a protective member for protecting the surface of the wafer bonded via an adhesive layer formed on the outer peripheral portion is placed on a work table. Then, the work table and a blade rotated by a spindle are relatively moved by a moving shaft to cut the protection member side of the work, and the protection member and the work piece are formed by machining grooves formed on the protection member side. The cutting device for supplying fluid to the gap between the wafer and the wafer by supplying fluid to the gap between the protection member and the wafer from the machining groove formed on the protection member side. It is characterized by cutting the workpiece.

  According to invention of Claim 3, the workpiece | work which bonded together the wafer in which the several device was formed in the surface, and the protection member which protects the surface of a wafer through the contact bonding layer formed in the outer peripheral part is a blade, a blade A cutting apparatus comprising: a spindle that rotates the workpiece; a work table; a moving shaft that relatively moves the work table and the blade; and a fluid supply means that supplies fluid to a gap between the protective member and the wafer. The protective member side is cut into a circular shape, a circular arc shape, a polygonal shape, or a shape by a circular arc and a straight line.

  When cutting is started and a processing groove is formed, fluid such as pure water or air is supplied to the gap between the protective member formed by the adhesive layer and the wafer through the processing groove by the fluid supply means. As a result, the contamination generated by the cutting process is discharged to the outside and the center of the cut protective member is not dropped by the fluid. Therefore, it is possible to efficiently remove the contaminants remaining in the gap between the wafer and the protective member without causing scratches on the device formed on the wafer surface.

  According to a fourth aspect of the present invention, a work having a wafer having a plurality of devices formed on the surface and a protective member for protecting the surface of the wafer bonded via an adhesive layer formed on an outer peripheral portion is placed on a work table. Then, the work table and a blade rotated by a spindle are relatively moved by a moving shaft to cut the protection member side of the work, and the protection member and the work piece are formed by machining grooves formed on the protection member side. A cutting device that supplies fluid to the gap between the wafer and the wafer by a fluid supply means while supplying fluid to the gap between the protection member and the wafer from the machining groove formed on the protection member side. The protective member is separated later.

  According to invention of Claim 4, the workpiece | work which bonded together the wafer in which the several device was formed in the surface, and the protection member which protects the surface of a wafer through the contact bonding layer formed in the outer peripheral part is protected by a cutting apparatus. The member side is cut into a circular shape, a circular arc shape, a polygonal shape, or a shape formed by a circular arc and a straight line.

  When machining is started and a machining groove is formed, fluid such as pure water or air is supplied to the gap between the protective member formed by the adhesive layer and the wafer through the machining groove by the fluid supply means. Are sucked and adsorbed by a conveying means or the like.

  As a result, the center of the cut protective member does not fall due to the fluid, and separation can be easily performed by the fluid pressure even during separation.

  As described above, according to the cutting apparatus and the cutting method of the present invention, the fluid is continuously sealed into the gap through the processing groove from the fluid supply means, and the device formed on the wafer surface is separated without causing scratches. It is possible to easily remove the contamination remaining in the gap between the wafer and the protective member.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a cutting apparatus and a cutting method according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view showing an appearance of a cutting apparatus. The cutting apparatus 1 includes a high-frequency motor built-in spindles 3 and 3 that are disposed to face each other and have a blade 2 and a wheel cover (not shown) attached to the tip, an imaging unit 4 that images the surface of the workpiece W, and a workpiece W Is provided with a work table 6 having a work table 5 that holds the work table 5 and a moving shaft that relatively moves the work table 5 and the blade 2.

  The cutting device 1 includes a wafer cleaning device 7 that spin-cleans a processed workpiece W in addition to the processing unit 6, a load port 8 that mounts a cassette that stores a large number of workpieces W mounted on the frame F, Conveying means 9 for conveying the workpiece W, display means 10 for displaying an image picked up by the image pickup means 4 and inputting an operation to each part, a controller (not shown) for controlling the operation of each part, and the like. .

  The spindle 3 of the cutting apparatus 1 configured as described above is provided with a fluid supply means 11 as shown in FIG. The fluid supply means 11 includes a nozzle 13 having a flexible tip 12 formed of a material such as resin or rubber that comes into contact with the workpiece W, and a nozzle jig 14 that fixes the nozzle 13 to the spindle 3. . A flow path connected to a fluid supply source (not shown) or a cutting water supply flow path connected to a wheel cover (not shown) is formed inside the nozzle jig 14, and the fluid that has passed through the flow path inside the nozzle jig 14. Is ejected from the tip 12 through the nozzle 13.

  As shown in FIG. 3, the workpiece W has a wafer 15 having a plurality of devices D formed on its surface and a plate-like protective member 16 made of glass, silicon, or the like, bonded together via an adhesive layer 17 made of polyimide resin or the like. As shown in FIG. At this time, the adhesive layer 17 is formed in a ring shape on the surplus area 18 on the outer peripheral portion of the wafer 15 where the device D shown in FIG. 3 is not formed. As a result, as shown in FIG. A gap 19 is formed between them.

  The workpiece W thus formed is ground from the back surface side of the wafer 15 by a back surface grinding device, and the wafer 15 is thinned. The workpiece W after back grinding is mounted on the frame F with the wafer 15 side attached to the tape T as shown in FIG.

  In this state, the work W sucked and placed on the work table 5 of the cutting apparatus 1 is cut by the blade 2 that rotates at high speed by the spindle 3 as shown in FIG. In the cutting process, as shown in FIG. 8, the blade 2 is cut into the gap 19 at a position inside the adhesive layer 17 of the protective member 16, and the work W is rotated in the direction of the arrow θ by the work table 5 to perform the cutting process. . As a result, the protection member 16 of the workpiece W is cut into a plurality of arcs in a circular shape, leaving a full-circumferentially-cut or unprocessed portion as shown in FIG.

  In addition, the work W is cut into a polygonal shape as shown in FIG. 10 by rotating the work table 5 according to the arrangement of the device D and performing a plurality of linear cutting processes while changing the angle. Alternatively, the work W is cut in the direction of the arrow θ while the work W is cut in accordance with the arrangement of the device D, and the whole circumference is cut into a shape by an arc and a straight line as shown in FIG. Processed.

  At this time, the tip 12 of the nozzle 13 comes into contact with the machining groove 20 formed in the protection member 16 by the blade 2, and as shown in FIG. Through the gap 19.

  Thereby, the contamination produced by the cutting process is poured out. Further, the center of the cut protective member 16 is not dropped onto the wafer 2 by the fluid 21, and the center of the protective member 16 is sucked and sucked by the transport means 9 etc. It becomes possible to do. Therefore, the device D formed on the wafer surface can be easily separated without causing scratches, and the contamination remaining in the gap 19 between the wafer 15 and the protective member 16 can be efficiently removed.

  The tip of the nozzle 13 is in contact with the workpiece. However, the present invention is not limited to this, and the tip of the nozzle 13 is thinned and high-pressure fluid is ejected with a small diameter as in the fluid supply means 11A shown in FIG. The fluid may be ejected toward the machining groove 20 by the nozzle 22 that can perform the above-described operation. The fluid supply means 11 and 11A are fixed to the spindle 3 by the nozzle jig 14, but the present invention is not limited to this, and the fluid supply means 11 and 11A are provided near the spindle 3 by a moving shaft (not shown). In this way, it can be implemented.

  In the present embodiment, the blade 2 is cut to the gap 19 at a position inside the adhesive layer 17, but the present invention is not limited to this, and the blade 2 may be cut to the wafer 15 or the tape T. It can be implemented even when the processed groove 20 reaches the adhesive layer 17.

  As described above, according to the cutting device and the cutting method according to the present invention, the fluid is continuously sealed in the gap through the processing groove by the fluid supply means provided in the vicinity of the spindle, and the contamination generated by the cutting is While being poured out, the center of the cut protective member is not dropped by the fluid, facilitating separation. Therefore, it is possible to easily separate the devices formed on the wafer surface without causing scratches, and to efficiently remove the contaminants remaining in the gap between the wafer and the protective member.

  In the present embodiment, the cutting process to the protective member 16 by the blade 2 is performed only on the inner side of the adhesive layer 17, but the present invention is not limited to this, and the processing groove 20 may reach the inside of the adhesive layer 17. Good.

The perspective view which shows the external appearance of a cutting apparatus. The perspective view which shows the external appearance of the fluid supply means provided in the spindle. The perspective view which showed the structure of the workpiece | work. The perspective view which shows the external appearance of a workpiece | work. Sectional drawing which shows the structure of a workpiece | work. The perspective view which showed the state of the workpiece | work in which cutting is performed. The perspective view which showed the state by which a protection member is cut. Sectional drawing which showed the state by which a protection member is cut. The perspective view which showed the state by which the protection member was cut circularly. The perspective view which showed the state by which the protection member was cut into polygonal shape. The perspective view which showed the state by which the protection member was cut by the shape by a circular arc and a straight line. Sectional drawing which showed the state which supplies a fluid from a process groove to a clearance gap. The perspective view which shows the external appearance of the fluid supply means of another form.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Cutting processing apparatus, 2 ... Blade, 3 ... Spindle, 4 ... Imaging device, 5 ... Work table, 6 ... Processing part, 7 ... Wafer cleaning apparatus, 8 ... Load port, 9 ... Conveyance means, 10 ... Display means, DESCRIPTION OF SYMBOLS 11 ... Fluid supply means, 12 ... Tip part, 13, 22 ... Nozzle, 14 ... Nozzle jig | tool, 15 ... Wafer, 16 ... Protection member, 17 ... Adhesive layer, 18 ... Excess area | region, 19 ... Gap, 20 ... Process groove , 21 ... Fluid, D ... Device, F ... Frame, T ... Tape, Workpiece ... W

Claims (7)

A disk-shaped blade,
A spindle for rotating the blade;
A work table for holding a work in which a wafer having a plurality of devices formed on the surface and a protective member for protecting the surface of the wafer are bonded together via an adhesive layer formed on the outer periphery;
A movement axis for relatively moving the work table and the blade;
A cutting apparatus comprising: a fluid supply unit configured to supply a fluid to a gap between the protection member and the wafer from a machining groove formed on the protection member side of the workpiece by the blade.   2. The fluid supplied from the fluid supply means is a fluid equivalent to a cutting fluid supplied in the vicinity of the blade or a fluid supplied from a fluid supply source different from the cutting fluid. The cutting apparatus described. A work having a wafer having a plurality of devices formed on the surface and a protective member for protecting the surface of the wafer bonded through an adhesive layer formed on the outer periphery is placed on the work table, and the work table and the spindle The rotating blade is moved relatively by the moving shaft to cut the protective member side of the workpiece, and from the processing groove formed on the protective member side to the gap between the protective member and the wafer By the cutting device that supplies fluid by the fluid supply means,
A cutting method, wherein the workpiece is cut while supplying a fluid to a gap between the protection member and the wafer from the machining groove formed on the protection member side. A work having a wafer having a plurality of devices formed on the surface and a protective member for protecting the surface of the wafer bonded through an adhesive layer formed on the outer periphery is placed on the work table, and the work table and the spindle The rotating blade is moved relatively by the moving shaft to cut the protective member side of the workpiece, and from the processing groove formed on the protective member side to the gap between the protective member and the wafer By the cutting device that supplies fluid by the fluid supply means,
A cutting method, comprising: separating the protective member after processing while supplying a fluid to a gap between the protective member and the wafer from a processing groove formed on the protective member side.   The cutting method according to claim 3 or 4, wherein an inner side of the adhesive layer on the protective member side of the workpiece is cut into a circular shape or an arc shape.   The cutting method according to claim 3 or 4, wherein an inner side of the adhesive layer on the protection member side of the workpiece is cut into a polygonal shape.   5. The cutting method according to claim 3, wherein an inner side of the adhesive layer on the protection member side of the workpiece is cut into a shape formed by an arc and a straight line.

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