JPS6128572A - 半導体ウエハー用粘着シートの使用法 - Google Patents

半導体ウエハー用粘着シートの使用法

Info

Publication number
JPS6128572A
JPS6128572A JP59148566A JP14856684A JPS6128572A JP S6128572 A JPS6128572 A JP S6128572A JP 59148566 A JP59148566 A JP 59148566A JP 14856684 A JP14856684 A JP 14856684A JP S6128572 A JPS6128572 A JP S6128572A
Authority
JP
Japan
Prior art keywords
adhesive
pressure
sensitive adhesive
radiation
adhesive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59148566A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0242393B2 (en:Method
Inventor
Kazunari Okita
一成 大北
Yoshiro Tahira
田平　芳郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
F S K KK
FSK Corp
Original Assignee
F S K KK
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by F S K KK, FSK Corp filed Critical F S K KK
Priority to JP59148566A priority Critical patent/JPS6128572A/ja
Publication of JPS6128572A publication Critical patent/JPS6128572A/ja
Publication of JPH0242393B2 publication Critical patent/JPH0242393B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
JP59148566A 1984-07-19 1984-07-19 半導体ウエハー用粘着シートの使用法 Granted JPS6128572A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59148566A JPS6128572A (ja) 1984-07-19 1984-07-19 半導体ウエハー用粘着シートの使用法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59148566A JPS6128572A (ja) 1984-07-19 1984-07-19 半導体ウエハー用粘着シートの使用法

Publications (2)

Publication Number Publication Date
JPS6128572A true JPS6128572A (ja) 1986-02-08
JPH0242393B2 JPH0242393B2 (en:Method) 1990-09-21

Family

ID=15455609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59148566A Granted JPS6128572A (ja) 1984-07-19 1984-07-19 半導体ウエハー用粘着シートの使用法

Country Status (1)

Country Link
JP (1) JPS6128572A (en:Method)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6254778A (ja) * 1985-09-04 1987-03-10 Bando Chem Ind Ltd 感圧接着性シート
JPS6317981A (ja) * 1986-07-09 1988-01-25 F S K Kk 粘着シ−ト
JPH01110584A (ja) * 1987-10-22 1989-04-27 Nichiban Co Ltd 硬化型粘着テープまたはシート
JPH01252684A (ja) * 1988-04-01 1989-10-09 Furukawa Electric Co Ltd:The 放射線硬化性粘着テープ
US4999242A (en) * 1987-07-08 1991-03-12 Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
JPH03278444A (ja) * 1990-09-07 1991-12-10 Bando Chem Ind Ltd 半導体ウエハーのダイシング方法
US5149586A (en) * 1987-07-08 1992-09-22 Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
US5187007A (en) * 1985-12-27 1993-02-16 Lintec Corporation Adhesive sheets
US5281473A (en) * 1987-07-08 1994-01-25 Furakawa Electric Co., Ltd. Radiation-curable adhesive tape
JPH06184521A (ja) * 1992-12-21 1994-07-05 Nichiban Co Ltd 表面保護材及びその形成方法
US5356949A (en) * 1988-07-21 1994-10-18 Lintec Corporation Adhesive composition comprising (meth)acrylate polymer and epoxy resin
EP0715341A1 (en) 1994-11-29 1996-06-05 LINTEC Corporation Method of preventing a transfer of adhesive substance to a ring frame in a dicing process, pressure-sensitive adhesive sheet and wafer support comprising said pressure-sensitive adhesive sheet
KR100351705B1 (ko) * 2000-06-27 2002-09-11 한솔제지주식회사 다이싱테이프용 감광성 점착 조성물
WO2009028455A1 (ja) * 2007-08-27 2009-03-05 Lintec Corporation 再剥離型粘着シートおよび不完全硬化塗膜の保護方法
US7906582B2 (en) 2007-02-20 2011-03-15 Fujifilm Corporation Polymerizable composition, tacky material, and adhesive

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850164A (ja) * 1981-09-19 1983-03-24 Nippon Steel Corp 連続鋳造設備

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850164A (ja) * 1981-09-19 1983-03-24 Nippon Steel Corp 連続鋳造設備

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6254778A (ja) * 1985-09-04 1987-03-10 Bando Chem Ind Ltd 感圧接着性シート
US5187007A (en) * 1985-12-27 1993-02-16 Lintec Corporation Adhesive sheets
JPS6317981A (ja) * 1986-07-09 1988-01-25 F S K Kk 粘着シ−ト
US4999242A (en) * 1987-07-08 1991-03-12 Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
US5281473A (en) * 1987-07-08 1994-01-25 Furakawa Electric Co., Ltd. Radiation-curable adhesive tape
US5149586A (en) * 1987-07-08 1992-09-22 Furukawa Electric Co., Ltd. Radiation-curable adhesive tape
JPH01110584A (ja) * 1987-10-22 1989-04-27 Nichiban Co Ltd 硬化型粘着テープまたはシート
JPH01252684A (ja) * 1988-04-01 1989-10-09 Furukawa Electric Co Ltd:The 放射線硬化性粘着テープ
US5356949A (en) * 1988-07-21 1994-10-18 Lintec Corporation Adhesive composition comprising (meth)acrylate polymer and epoxy resin
JPH03278444A (ja) * 1990-09-07 1991-12-10 Bando Chem Ind Ltd 半導体ウエハーのダイシング方法
JPH06184521A (ja) * 1992-12-21 1994-07-05 Nichiban Co Ltd 表面保護材及びその形成方法
EP0715341A1 (en) 1994-11-29 1996-06-05 LINTEC Corporation Method of preventing a transfer of adhesive substance to a ring frame in a dicing process, pressure-sensitive adhesive sheet and wafer support comprising said pressure-sensitive adhesive sheet
KR100351705B1 (ko) * 2000-06-27 2002-09-11 한솔제지주식회사 다이싱테이프용 감광성 점착 조성물
US7906582B2 (en) 2007-02-20 2011-03-15 Fujifilm Corporation Polymerizable composition, tacky material, and adhesive
WO2009028455A1 (ja) * 2007-08-27 2009-03-05 Lintec Corporation 再剥離型粘着シートおよび不完全硬化塗膜の保護方法

Also Published As

Publication number Publication date
JPH0242393B2 (en:Method) 1990-09-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term