JPS61284949A - リ−ドフレ−ム材料 - Google Patents

リ−ドフレ−ム材料

Info

Publication number
JPS61284949A
JPS61284949A JP60126752A JP12675285A JPS61284949A JP S61284949 A JPS61284949 A JP S61284949A JP 60126752 A JP60126752 A JP 60126752A JP 12675285 A JP12675285 A JP 12675285A JP S61284949 A JPS61284949 A JP S61284949A
Authority
JP
Japan
Prior art keywords
less
lead frame
base material
alloy
cladding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60126752A
Other languages
English (en)
Japanese (ja)
Other versions
JPH051618B2 (enExample
Inventor
Shinichiro Yahagi
慎一郎 矢萩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Original Assignee
Daido Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd filed Critical Daido Steel Co Ltd
Priority to JP60126752A priority Critical patent/JPS61284949A/ja
Publication of JPS61284949A publication Critical patent/JPS61284949A/ja
Publication of JPH051618B2 publication Critical patent/JPH051618B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP60126752A 1985-06-11 1985-06-11 リ−ドフレ−ム材料 Granted JPS61284949A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60126752A JPS61284949A (ja) 1985-06-11 1985-06-11 リ−ドフレ−ム材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60126752A JPS61284949A (ja) 1985-06-11 1985-06-11 リ−ドフレ−ム材料

Publications (2)

Publication Number Publication Date
JPS61284949A true JPS61284949A (ja) 1986-12-15
JPH051618B2 JPH051618B2 (enExample) 1993-01-08

Family

ID=14943036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60126752A Granted JPS61284949A (ja) 1985-06-11 1985-06-11 リ−ドフレ−ム材料

Country Status (1)

Country Link
JP (1) JPS61284949A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3161864B1 (de) * 2014-06-25 2020-01-22 Heraeus Deutschland GmbH & Co. KG Bandförmiges substrat zur herstellung von chipträgern, elektronisches modul mit einem solchen chipträger, elektronische einrichtung mit einem solchen modul und verfahren zur herstellung eines substrates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3161864B1 (de) * 2014-06-25 2020-01-22 Heraeus Deutschland GmbH & Co. KG Bandförmiges substrat zur herstellung von chipträgern, elektronisches modul mit einem solchen chipträger, elektronische einrichtung mit einem solchen modul und verfahren zur herstellung eines substrates

Also Published As

Publication number Publication date
JPH051618B2 (enExample) 1993-01-08

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