JPS61279156A - マルチチツプモジユ−ル - Google Patents

マルチチツプモジユ−ル

Info

Publication number
JPS61279156A
JPS61279156A JP60120439A JP12043985A JPS61279156A JP S61279156 A JPS61279156 A JP S61279156A JP 60120439 A JP60120439 A JP 60120439A JP 12043985 A JP12043985 A JP 12043985A JP S61279156 A JPS61279156 A JP S61279156A
Authority
JP
Japan
Prior art keywords
chip
substrate
integrated circuit
chip module
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60120439A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0342702B2 (enExample
Inventor
Hisashi Nakayama
中山　恒
Tadakatsu Nakajima
忠克 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60120439A priority Critical patent/JPS61279156A/ja
Publication of JPS61279156A publication Critical patent/JPS61279156A/ja
Publication of JPH0342702B2 publication Critical patent/JPH0342702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60120439A 1985-06-05 1985-06-05 マルチチツプモジユ−ル Granted JPS61279156A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60120439A JPS61279156A (ja) 1985-06-05 1985-06-05 マルチチツプモジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60120439A JPS61279156A (ja) 1985-06-05 1985-06-05 マルチチツプモジユ−ル

Publications (2)

Publication Number Publication Date
JPS61279156A true JPS61279156A (ja) 1986-12-09
JPH0342702B2 JPH0342702B2 (enExample) 1991-06-28

Family

ID=14786230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60120439A Granted JPS61279156A (ja) 1985-06-05 1985-06-05 マルチチツプモジユ−ル

Country Status (1)

Country Link
JP (1) JPS61279156A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019043835A1 (ja) * 2017-08-30 2019-03-07 日本電気株式会社 電子装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019043835A1 (ja) * 2017-08-30 2019-03-07 日本電気株式会社 電子装置
JPWO2019043835A1 (ja) * 2017-08-30 2020-09-24 日本電気株式会社 電子装置

Also Published As

Publication number Publication date
JPH0342702B2 (enExample) 1991-06-28

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