JPH0342702B2 - - Google Patents

Info

Publication number
JPH0342702B2
JPH0342702B2 JP60120439A JP12043985A JPH0342702B2 JP H0342702 B2 JPH0342702 B2 JP H0342702B2 JP 60120439 A JP60120439 A JP 60120439A JP 12043985 A JP12043985 A JP 12043985A JP H0342702 B2 JPH0342702 B2 JP H0342702B2
Authority
JP
Japan
Prior art keywords
chip
substrate
heat transfer
integrated circuit
transfer body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60120439A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61279156A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60120439A priority Critical patent/JPS61279156A/ja
Publication of JPS61279156A publication Critical patent/JPS61279156A/ja
Publication of JPH0342702B2 publication Critical patent/JPH0342702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60120439A 1985-06-05 1985-06-05 マルチチツプモジユ−ル Granted JPS61279156A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60120439A JPS61279156A (ja) 1985-06-05 1985-06-05 マルチチツプモジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60120439A JPS61279156A (ja) 1985-06-05 1985-06-05 マルチチツプモジユ−ル

Publications (2)

Publication Number Publication Date
JPS61279156A JPS61279156A (ja) 1986-12-09
JPH0342702B2 true JPH0342702B2 (enExample) 1991-06-28

Family

ID=14786230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60120439A Granted JPS61279156A (ja) 1985-06-05 1985-06-05 マルチチツプモジユ−ル

Country Status (1)

Country Link
JP (1) JPS61279156A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019043835A1 (ja) * 2017-08-30 2019-03-07 日本電気株式会社 電子装置

Also Published As

Publication number Publication date
JPS61279156A (ja) 1986-12-09

Similar Documents

Publication Publication Date Title
US12080614B2 (en) Lidded semiconductor package
US4092697A (en) Heat transfer mechanism for integrated circuit package
US4034469A (en) Method of making conduction-cooled circuit package
US4758926A (en) Fluid-cooled integrated circuit package
JP3949724B2 (ja) サーマル・グリースを集積回路に塗布する方法
CN100442964C (zh) 用于电子部件的流体冷却系统和方法
US5016138A (en) Three dimensional integrated circuit package
US4069498A (en) Studded heat exchanger for integrated circuit package
US9082645B2 (en) Manufacturing method of semiconductor module
US7190585B2 (en) Thermal heat spreaders designed for lower cost manufacturability, lower mass and increased thermal performance
US5307240A (en) Chiplid, multichip semiconductor package design concept
US4860444A (en) Method of assembling a fluid-cooled integrated circuit package
US5905299A (en) Thermally enhanced thin quad flatpack package
US7285446B2 (en) Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device
JPH0566025B2 (enExample)
US20050117296A1 (en) Ball grid array package with heat sink device
JPH09129817A (ja) 半導体装置
US5306866A (en) Module for electronic package
US20080265404A1 (en) Structure and Methods of Processing for Solder Thermal Interface Materials for Chip Cooling
US5963428A (en) Cooling cap method and apparatus for tab packaged integrated circuit
US5206713A (en) Mounting silicon chips
US20040104467A1 (en) Thermal design for minimizing interface in a multi-site thermal contact condition
JPH0342702B2 (enExample)
JPS63293965A (ja) 半導体装置およびその製造方法
US20240055317A1 (en) Compliant Pad Spacer for Three-Dimensional Integrated Circuit Package