JPS61279123A - Oxidation and diffusion device for semiconductor - Google Patents

Abstract

PURPOSE:To prevent the contamination caused by the intrusion of the outside air by a method wherein a push-rod inserting hole stopper is integrally formed at the end part of the tube of an oxidation and diffusion furnace, and said push-rod inserting hole is closed up by rotating an end cap. CONSTITUTION:A push-rod inserting hole stopper 8 is integrally formed at the furnace end part of an oxidation and diffusion furnace tube 1. When the end cap 4 is inserted into the tube 1 in such a manner that the stopper 8 and the push-rod inserting hole of the end cap 4 are overlapped by rotating the end cap, the intrusion of the outside air from the inserting hole 6 can be prevented. Gas is exhausted from a gas exhaust nozzle 9, and the intrusion of the outside air due to the variation of pressure caused by the expansion and contraction of the gas can also be prevented by having the nozzle of 20cm or more in length. When the boat 7 carrying a wafer is pushed to the core part of the furnace, the push-rod is inserted from the inserting hole 6 by rotating the end cap 4.

Description

DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to semiconductor oxidation, diffusion devices flt, and VC used in the manufacturing process of semiconductor devices.

B. Summary of the Invention The end cap of the semiconductor oxidation and diffusion device is provided with a push rod insertion port and a gas discharge nozzle. When the end cap is rotated, a stopper formed integrally with the tube closes the push rod insertion port.

C. Conventional technology Furnaces used for semiconductor oxidation, diffusion, etc. have a structure in which atmospheric gas, dobin gas, and other gases are introduced from the gas inlet on one side of the tube and discharged from the furnace 14 side. It has become. A conventionally used general oxidation and diffusion furnace is shown in Figure 3.

The gas introduced into the tube 1 flows out of the furnace through a push rod insertion port 6 provided in an end cap 4 at the end of the furnace and a mating portion between the tube 1 and the end cap 4. In the figure, 2 is a gas inlet, 3 is a resistance heater, and 5
is the push rod, 7 is the boat and sea urchin eight.

D In this structure, the gas that is heated to the temperature for oxidation, diffusion, etc. (usually 1000 C) in the reactor core expands and increases in volume, but at the end of the reactor The gas becomes 200 to 300 U or less, and the expanded gas contracts, reduces its volume, and exits from the furnace. Due to pressure changes due to the expansion and contraction of this gas, outside air from outside the furnace enters the furnace through the push rod member 6 of the end cap 4, causing contamination.

The object of the present invention is to prevent contamination due to intrusion of outside air from the end cap extension hole and to improve the reliability of oxidation and diffusion, thereby oxidizing semiconductors.

The purpose is to provide a diffusion device k.

In order to achieve the above objectives, the semiconductor oxidation and diffusion device according to the present invention is provided at the end of the diffusion furnace tube, and has a push rod insertion port and a gas discharge nozzle. The end gap is formed integrally with the diffusion furnace tube, and when the end cap is rotated, the push rod insertion port t
The idea is to include a stopper provided at the blocking position.

F Function If the push rod inlet is not needed, it can be closed by a stopper by rotating the end cap.

G Embodiment Figure 1 is a cross-sectional view of a semiconductor diffusion and diffusion device according to the present invention, and Figure 2 is a front view of a diffusion furnace tube.
Reference numbers common to the figure represent the same parts as in Figure 3, 8 is a push rod insertion lost collar formed integrally with the tube, 9 is a gas discharge nozzle'? :Represent.

In the oxidation and diffusion furnace shown in FIGS. 1 and 2, a stopper 8 is formed integrally with the quartz tube body 1 at the end of the furnace. When the end cap 4 is fitted into the tube 1 so as to cover the push rod inlet 6 of the end collar 7'4, entry of outside air from the insertion inlet 6 is prevented.

At this time, the gas is discharged from a gas discharge nozzle 9 separately provided on the end cap 4. The length of nozzle 9 is 'XJ
If it is more than rs, the distance from the gas outlet to the tube body l is sufficient (the temperature of the gas at the nozzle exit is sufficiently VC lowered, and the pressure changes due to the contraction of the gas). It is possible to prevent outside air from entering.It is also possible to exhaust gas (which is a nuisance).Furthermore, the effect of increasing the exhaust gas pressure by the nozzle can be expected.When pushing the boat into the reactor core, the end cap 4 18
09 Rotate it and fit it into the tube, and the insertion port 6
Insert the push rod from the bottom and you can easily center the boat.

As described in detail, according to the present invention, it is possible to prevent contamination caused by entry of outside air and to stabilize the characteristics of oxidation and diffusion processes.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a semiconductor oxidation/diffusion device according to the present invention, FIG. 2 is a front view of an oxidation/diffusion furnace tube, and FIG. 3 is a sectional view of a conventional semiconductor oxidation/diffusion device. 1... Oxidation, diffusion furnace tube, 2... Gas inlet,
3... Resistance heater, 4... End cap, 5
...Push rod, 6...Push rod insertion port of end cap, 7...To boat and square, 8.
・Push rod insertion lost collar, 9...Gas exhaust nozzle・

Claims (1)

[Claims] (a) An end cap provided at the end of the diffusion furnace tube and having a push rod insertion port and a gas discharge nozzle; and (b) An end cap formed integrally with the diffusion furnace tube and configured to rotate the end cap. A semiconductor oxidation and diffusion device comprising: a stopper provided at a position to block the push rod insertion port.