JPS6127189Y2 - - Google Patents
Info
- Publication number
- JPS6127189Y2 JPS6127189Y2 JP1981100151U JP10015181U JPS6127189Y2 JP S6127189 Y2 JPS6127189 Y2 JP S6127189Y2 JP 1981100151 U JP1981100151 U JP 1981100151U JP 10015181 U JP10015181 U JP 10015181U JP S6127189 Y2 JPS6127189 Y2 JP S6127189Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat pipe
- printed circuit
- coupling
- fitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000008878 coupling Effects 0.000 claims description 35
- 238000010168 coupling process Methods 0.000 claims description 35
- 238000005859 coupling reaction Methods 0.000 claims description 35
- 238000001816 cooling Methods 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981100151U JPS587352U (ja) | 1981-07-07 | 1981-07-07 | 集積回路の冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981100151U JPS587352U (ja) | 1981-07-07 | 1981-07-07 | 集積回路の冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS587352U JPS587352U (ja) | 1983-01-18 |
| JPS6127189Y2 true JPS6127189Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-08-13 |
Family
ID=29894856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981100151U Granted JPS587352U (ja) | 1981-07-07 | 1981-07-07 | 集積回路の冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS587352U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160284624A1 (en) * | 2013-03-21 | 2016-09-29 | Nec Corporation | Heat sink structure, semiconductor device and heat sink mounting method |
| JP6303433B2 (ja) * | 2013-11-20 | 2018-04-04 | 富士通株式会社 | 電子部品のリワーク方法 |
-
1981
- 1981-07-07 JP JP1981100151U patent/JPS587352U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS587352U (ja) | 1983-01-18 |