JPS6127089Y2 - - Google Patents
Info
- Publication number
- JPS6127089Y2 JPS6127089Y2 JP1980125896U JP12589680U JPS6127089Y2 JP S6127089 Y2 JPS6127089 Y2 JP S6127089Y2 JP 1980125896 U JP1980125896 U JP 1980125896U JP 12589680 U JP12589680 U JP 12589680U JP S6127089 Y2 JPS6127089 Y2 JP S6127089Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- board
- boards
- adhesive layer
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012790 adhesive layer Substances 0.000 claims description 19
- 238000007747 plating Methods 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000009429 electrical wiring Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 6
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980125896U JPS6127089Y2 (zh) | 1980-09-03 | 1980-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980125896U JPS6127089Y2 (zh) | 1980-09-03 | 1980-09-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5750978U JPS5750978U (zh) | 1982-03-24 |
| JPS6127089Y2 true JPS6127089Y2 (zh) | 1986-08-13 |
Family
ID=29486344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980125896U Expired JPS6127089Y2 (zh) | 1980-09-03 | 1980-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127089Y2 (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6044976A (ja) * | 1983-08-19 | 1985-03-11 | アルプス電気株式会社 | 電子部品の端子部接続構造 |
| JPS61274394A (ja) * | 1985-05-29 | 1986-12-04 | シャープ株式会社 | 端子の接続方法 |
| JPS62130537U (zh) * | 1986-02-07 | 1987-08-18 | ||
| JP5113390B2 (ja) * | 2006-01-12 | 2013-01-09 | パナソニック株式会社 | 配線間接続方法 |
| JP2008071812A (ja) * | 2006-09-12 | 2008-03-27 | Fujikura Ltd | 基板間接続構造 |
| JP2011077126A (ja) * | 2009-09-29 | 2011-04-14 | Sumitomo Electric Ind Ltd | 配線板、配線板の製造方法、配線板の接続構造及び配線板の接続方法 |
| JP2011077125A (ja) * | 2009-09-29 | 2011-04-14 | Sumitomo Electric Ind Ltd | 配線板、配線板の製造方法、配線板の接続構造及び配線板の接続方法 |
| US9883583B2 (en) * | 2015-09-02 | 2018-01-30 | Apple Inc. | Fabric signal path structures for flexible devices |
-
1980
- 1980-09-03 JP JP1980125896U patent/JPS6127089Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5750978U (zh) | 1982-03-24 |
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