JPS6126250A - Heat-dissipating device for diode - Google Patents
Heat-dissipating device for diodeInfo
- Publication number
- JPS6126250A JPS6126250A JP14803784A JP14803784A JPS6126250A JP S6126250 A JPS6126250 A JP S6126250A JP 14803784 A JP14803784 A JP 14803784A JP 14803784 A JP14803784 A JP 14803784A JP S6126250 A JPS6126250 A JP S6126250A
- Authority
- JP
- Japan
- Prior art keywords
- diode
- solder
- recess
- heat
- aperture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は放熱板にハンダ付けにより接合されるダイオー
ドの放熱装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a heat dissipation device for a diode that is joined to a heat dissipation plate by soldering.
従来例の構成とその問題点
従来のこの種のダイオードの放熱装置は、第３図に示す
ように、放熱板１１に円形状の凹部１２を設け、との凹
部１２内にハンダ１３を介してダイオード１４を接合す
ることにより、ダイオード１４の放熱面積を増やし、こ
れによりダイオード１４の発熱による温度上昇を許容範
囲におさえ、特性の劣化を生じさせないようにしていた
。Structure of the conventional example and its problems As shown in FIG. 3, in the conventional heat dissipating device for a diode of this type, a circular recess 12 is provided in the heat dissipating plate 11, and a solder 13 is inserted into the recess 12. By joining the diode 14, the heat dissipation area of the diode 14 is increased, thereby suppressing the temperature rise due to heat generation of the diode 14 within an allowable range, and preventing deterioration of characteristics.
しかしながら、この構成では、ダイオード１４のハンダ
付は作業を行なう場合、ハンダ１３の介在面積が大きい
とともに、円形状の凹部１２において空気の逃げ場がな
いため、ハンダ１３が円形状の凹部１２内に十分まわら
ずに空洞が生じやすく、その結果、熱伝導面積がばらつ
いてしまって安定した放熱特性を得ることができなかっ
た。一方、空洞の発生をおさえようとしてハンダ付けの
温度を高くシ、かつハンダ付けの時間を長くした場合は
、ダイオード１４自体の温度も上がるため、その特性を
劣化させてしまうことになり、さらにはダイオード１４
の接合部の構造が閉構造であるため、ハンダ１３のまわ
り具合の良否をチェックする場合も、外観検査のみでは
チェックすることができず、その結果、工程管理が煩雑
になって割高になるという問題点を有していた。However, in this configuration, when soldering the diode 14, the intervening area of the solder 13 is large, and there is no place for air to escape in the circular recess 12, so the solder 13 is sufficiently inserted into the circular recess 12. Cavities tend to occur without rotation, and as a result, the heat conduction area varies, making it impossible to obtain stable heat dissipation characteristics. On the other hand, if the soldering temperature is increased and the soldering time is increased in an attempt to suppress the formation of cavities, the temperature of the diode 14 itself will also rise, deteriorating its characteristics. diode 14
Since the structure of the joint is a closed structure, it is not possible to check the quality of the surroundings of the solder 13 only by visual inspection, and as a result, process control becomes complicated and expensive. It had some problems.
発明の目的
本発明は上記従来の問題点を解消するもので、ダイオー
ドの半田付は作業を行なう場合、ハンダに空洞が生じる
ことなく、安定した放熱特性を得ることかできるととも
に、外観上ハンダのまわシ具合も容易に判別することが
できるダイオードの放熱装置を提供することを目的とす
る。OBJECT OF THE INVENTION The present invention solves the above-mentioned conventional problems. When soldering diodes, it is possible to obtain stable heat dissipation characteristics without creating cavities in the solder, and to improve the appearance of the solder. It is an object of the present invention to provide a diode heat dissipation device whose degree of rotation can be easily determined.
発明の構成
上記目的を達成するために本発明は、ダイオードと、こ
のダイオードをハンダ付けにより接合する放熱板とを備
え、前記放熱板にダイオードの接合部と対応する位置に
開孔を設けたもので、この構成によれば、開孔の存在に
より、ハンダの介在面積が少なく、かつ空気が開孔から
逃げやすくなるため、ハンダに空洞が生じるようなこと
はなく、その結果、熱伝導面積のばらつきもなくなるた
め、安定した放熱特性を得ることができ、またハンダの
まわシ具合も一目瞭然で容易に判別することができるも
のである。Structure of the Invention In order to achieve the above object, the present invention comprises a diode and a heat sink to which the diode is joined by soldering, and the heat sink is provided with an opening at a position corresponding to the joint of the diode. According to this configuration, due to the presence of the holes, the intervening area of the solder is small and air easily escapes from the holes, so no cavities are created in the solder, and as a result, the heat conduction area is reduced. Since there is no variation, stable heat dissipation characteristics can be obtained, and the degree of solder spreading can be easily determined at a glance.
実施例の説明
以下、本発明の実施例を添付図面にもとづいて説明する
。第１図は本発明の一実施例を示したもので、図におい
て、１は円形状の凹部２を有する放熱板で、この放熱板
１の凹部２には開孔３を設けている。４はダイオードで
、このダイオード４は前記凹部２にハンダ６により接合
される。DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 shows an embodiment of the present invention. In the figure, reference numeral 1 denotes a heat sink having a circular recess 2, and an opening 3 is provided in the recess 2 of the heat sink 1. As shown in FIG. 4 is a diode, and this diode 4 is bonded to the recess 2 with solder 6.
上記構成において、ダイオード４を放熱板１の凹部２に
ハンダ付は作業を行なった場合、放熱板１の凹部２に開
孔３を設けているため、凹部２内の空気はとの開孔３よ
シ逃げることになシ、その結果、ハンダ５はハンダ接合
面に沿ってすみやかにまわるため、空洞が生じるような
ことはなく、安定した放熱特性を得ることができる。ま
たハンダ６のまわシ具合も矢印イ方向および開孔３側の
矢印口方向から直視することができるため、良否の判別
が容易に行々えるものである。In the above configuration, when the diode 4 is soldered to the recess 2 of the heat sink 1, since the hole 3 is provided in the recess 2 of the heat sink 1, the air inside the recess 2 will be removed from the hole 3. As a result, the solder 5 quickly rotates along the solder bonding surface, so no cavities are created, and stable heat dissipation characteristics can be obtained. Furthermore, since the degree of twisting of the solder 6 can be directly observed from the direction of arrow A and from the direction of the arrow on the side of the opening 3, it is easy to determine whether the solder is good or bad.
第２図は本発明の他の実施例を示したもので、この実施
例は放熱板１に設けた開孔６にダイオード４を貫通させ
、そして開孔６の周囲端部にハンダ６を流すことによシ
、ダイオード４を放熱板１にハンダ付けしたものである
。このハンダ付は作業を行々っだ場合、空気は開孔６よ
りすみやかに逃げ、かつハンダ６もすみやかにまわるた
め、空洞が生じるようなことはなく、安定した放熱特性
を得ることができる。またハンダのまわシ具合も矢印ハ
方向から直視することができるため、良否の判別が容易
に行なえる。FIG. 2 shows another embodiment of the present invention, in which a diode 4 is passed through an opening 6 provided in a heat sink 1, and solder 6 is poured around the edge of the opening 6. In particular, the diode 4 is soldered to the heat sink 1. When this soldering work is repeated, air quickly escapes through the openings 6 and the solder 6 also quickly circulates, so no cavities are created and stable heat dissipation characteristics can be obtained. Furthermore, since the solder twist can be directly observed from the direction of arrow C, it is easy to judge whether the solder is good or bad.
発明の効果
以上のように本発明によれば、ダイオードと、このダイ
オードをハンダ付けにより接合する放熱板とを備え、前
記放熱板にダイオードの接合部と対応する位置に開孔を
設けたもので、この開孔の存在によシハンダの介在面積
が少なく、かつ空気が開孔から逃げやすくなるため、ハ
ンダに空洞が生じるようなことはなく、その結果、熱伝
導面積のばらつきもなくなるため、安定した放熱特性を
得ることができ、またハンダのまわり具合も一目瞭然で
容易に判別することができるものである。Effects of the Invention As described above, the present invention includes a diode and a heat sink to which the diode is joined by soldering, and the heat sink is provided with an opening at a position corresponding to the joint of the diode. Due to the presence of these openings, the intervening area of the solder is small, and air easily escapes from the openings, so there are no cavities in the solder, and as a result, there is no variation in the heat conduction area, so it is stable. It is possible to obtain excellent heat dissipation characteristics, and the degree of solder surrounding can be easily determined at a glance.
第１図は本発明の一実施例におけるダイオードの放熱装
置の断面図、第２図は本発明の他の実施例を示すダイオ
ードの放熱装置の断面図、第３図は従来例を示すダイオ
ードの放熱装置の断面図である。
１・・・・・・放熱板、３，６・・・・・・開孔、４・
・・・・・ダイオード、６・・・・・・ハンダ。FIG. 1 is a cross-sectional view of a diode heat dissipation device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a diode heat dissipation device showing another embodiment of the present invention, and FIG. 3 is a cross-sectional view of a diode heat dissipation device showing a conventional example. It is a sectional view of a heat dissipation device. 1... Heat sink, 3, 6... Hole, 4.
...Diode, 6...Solder.
Claims (1)
合する放熱板とを備え、前記放熱板にダイオードの接合
部と対応する位置に開孔を設けてなるダイオードの放熱
装置。A heat dissipation device for a diode, comprising a diode and a heat dissipation plate to which the diode is joined by soldering, and an opening is provided in the heat dissipation plate at a position corresponding to a joint portion of the diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14803784A JPS6126250A (en) | 1984-07-16 | 1984-07-16 | Heat-dissipating device for diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14803784A JPS6126250A (en) | 1984-07-16 | 1984-07-16 | Heat-dissipating device for diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6126250A true JPS6126250A (en) | 1986-02-05 |
Family
ID=15443705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14803784A Pending JPS6126250A (en) | 1984-07-16 | 1984-07-16 | Heat-dissipating device for diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6126250A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63221960A (en) * | 1987-03-10 | 1988-09-14 | Kikukawa Tekkosho:Kk | Wide belt sander |
-
1984
- 1984-07-16 JP JP14803784A patent/JPS6126250A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63221960A (en) * | 1987-03-10 | 1988-09-14 | Kikukawa Tekkosho:Kk | Wide belt sander |
| JPH0624683B2 (en) * | 1987-03-10 | 1994-04-06 | 株式会社菊川鉄工所 | Wide belt sanda |
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