JP2680110B2 - Package for semiconductor device having heat radiator - Google Patents

Description

The present invention relates to a semiconductor device package having a heat radiator.

(Prior Art and Problems to be Solved) In a semiconductor laser device package or the like, in order to dissipate heat generated from the semiconductor laser element, the semiconductor laser element is mounted on a radiator by bonding.

6 and 7 are plan views showing a conventional example of a package for a semiconductor laser device. In the figure, 10 is eyelet, 12
Is a heat radiator formed on the eyelet, 14 is a terminal hole, and the lead 16 is hermetically glass-welded to the terminal hole 14. Radiator 12
A semiconductor laser device 20 is bonded on the front wall surface of the.

Here, the arrangement position of the terminal hole 14 on the eyelet 10 is determined by the standard, and is arranged on the center line of the eyelet 10 in the semiconductor laser device package. Therefore, the arrangement position and size of the heat radiator are restricted by the arrangement of the terminal holes 14.

FIG. 6 shows an example in which a quadrangular radiator is formed between the terminal holes 14, and FIG. 7 shows an example in which the radiator 12 is formed in a fan shape. The radiator 12 shown in FIG. 7 has a fan shape to enhance heat dissipation. In either case, if the heat sink 12 is near the terminal hole 14 or on the glass of the terminal hole 14, the brazing material that joins the heat sink 12 may flow into the terminal hole 14 and reduce the insulation and airtightness. The heat sink 12
Is formed at a position away from the terminal hole 14.

As described above, conventionally, it was not possible to form a large radiator by being restricted by the diameter size of the eyelet 10 and the arrangement positions of the terminal holes 14 and the like. Recently, high-power semiconductor elements are also often used, and in order to cope with this, improvement in heat dissipation of a heat radiator is required.

Therefore, the present invention has been made in view of the above problems, and an object thereof is to form a larger heat radiator even when there are predetermined standard conditions such as the size of the eyelet and the position of the terminal hole. The present invention aims to provide a semiconductor device package that can be manufactured.

(Means for Solving the Problems) The present invention has the following configuration to achieve the above object.

That is, in a package for a semiconductor device having a heat sink in which a lead wire is planted with glass in a terminal hole provided in an eyelet and a heat sink is joined to the eyelet, the heat sink is separated from the terminal hole. It is characterized in that the front end portion of the heat radiator is separated from the upper surface of the eyelet and protrudes above the terminal hole while being joined by the provided engagement protrusion.

(Operation) By interposing the joint projection, the front end portion of the heat sink can be extended to the upper side of the terminal hole to be joined, whereby the restriction by the terminal hole can be avoided and the size of the heat sink can be increased.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a front view showing an embodiment of a semiconductor laser device package as an example of a semiconductor device package having a radiator according to the present invention. Reference numeral 10 is an eyelet, 16 is a lead hermetically sealed to the eyelet 10 by glass welding, and 17 is a ground lead. Reference numeral 10a is a joint protrusion provided on the upper surface of the eyelet 10 so as to protrude, and is formed at a position that does not overlap the terminal hole position. The radiator 22 is this joint protrusion
It is fixed to the upper surface of 10a. As a result, the radiator 22 is slightly separated from the upper surface of the eyelet 10.

FIG. 2 is a plan view of the package for the semiconductor laser device. Here, the radiator 22 is arranged above both terminal holes 14 so that the radiator extends. Terminal hole 14 of heat sink 22
The upper protruding portion is separated from the glass welding portion. The front wall surface of the radiator 22 is arranged so as not to contact the lead 16.

When the radiator 22 is arranged so as to extend above the terminal hole 14 in this way, the size of the radiator 22 can be made extremely large. Since the package for the semiconductor laser device is originally very small, the effect of improving the heat radiation property by the fact that the size of the heat radiator can be increased by projecting the heat radiator above the terminal hole 14 in this way is very remarkable. is there.

FIG. 3 is a front view of the package before the heat radiator 22 is joined. At the time of molding the eyelet 10, a joint projection 10a for joining the radiator 22 is provided on the upper surface of the eyelet 10 in advance.

As a method of fixing the radiator 22 away from the upper surface of the eyelet 10, instead of providing the joint protrusion 10a on the eyelet 10 as described above, a joint protrusion may be provided on the lower surface of the radiator 22. Good. FIG. 4 shows an example of the radiator 24 in which the joint projection 24a is formed on the lower surface of the radiator. In this case, the front end of the radiator 24 is located above the terminal hole by joining the joint projection 24a to the upper surface of the eyelet 10. Can be overhanged and joined.

Also, without providing a joint protrusion on the upper surface of the eyelet or on the lower surface of the heat sink, insert a spacer between the upper surface of the eyelet and the lower surface of the heat sink to form a joint protrusion. The heat radiating body may be extended to the upper part of the above to be joined.

As described above, by joining the heat radiator so as to face it from the upper surface of the eyelet, the front end portion of the heat radiator can be arranged so as to project above the terminal hole. Further, as described above, the joining protrusion can avoid the restriction due to the terminal hole position when joining the heat radiator, and it is possible to form a significantly large heat radiator even with an eyelet of the same size as the conventional one. It will be possible. As a result, a larger semiconductor element can be mounted on the radiator, and the heat dissipation can be greatly improved, so that a higher power semiconductor element can be mounted.

Further, due to the large size of the heat radiator, in addition to mounting the semiconductor element alone on the heat radiator, it is also possible to mount the circuit boards 26 and 28 on the heat radiator 22, as shown in FIG. It will be possible. As a result, the package itself can be a module having a high packaging density, and the electronic device or the like can be highly integrated and miniaturized.

Although the above embodiment is an example of the semiconductor laser device package, the present invention can be similarly applied to other semiconductor device packages having a heat radiator.

As described above, the present invention has been described variously with reference to the preferred embodiments. However, the present invention is not limited to these embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. That is.

(Effects of the Invention) According to the present invention, with the configuration as described above, it is possible to avoid the restriction of the terminal hole position provided in the eyelet and dispose the radiator, and even on an eyelet of the same size as the conventional one. A significantly large radiator can be formed. As a result, the heat dissipation of the heat radiator can be improved, and a circuit board or the like can be mounted on the heat radiator to achieve high density mounting of electronic devices and the like.

[Brief description of the drawings]

1 and 2 are a front view and a plan view showing an embodiment of a semiconductor device package having a radiator according to the present invention, and FIG. 3 is a front view of the package before joining the radiator, and FIG.
FIG. 5 is a front view showing another example of a heat radiator, FIG. 5 is a perspective view showing an example in which a circuit board is provided on the heat radiator, and FIGS. 6 and 7 are conventional semiconductor device packages having a heat radiator. It is a top view which shows an example. 10 …… Eyelet, 10a …… Joint protrusion, 12 …… Heat radiator, 1
4 …… Terminal hole, 16 …… Lead, 17 …… Ground lead, 20
...... Semiconductor laser element, 22, 24 ...... Heat radiator, 24a …… Joint protrusion, 26,28 …… Circuit board.

Claims (1)

(57) [Claims] 1. A package for a semiconductor device having a heat radiator in which a lead wire is erected by glass in a terminal hole provided in an eyelet, and a heat radiator is joined to the eyelet, wherein the heat radiator is formed from the terminal hole. A package for a semiconductor device having a heat radiating body, characterized in that the front ends of the heat radiating body are spaced apart from the upper surface of the eyelet and project toward the information of the terminal holes while being joined by the engaging projections provided apart from each other.