JPH06314749A - Semiconductor device - Google Patents

Abstract

PURPOSE:To obtain a semiconductor device which is small in dispersion of high frequency characteristics and wherein a semiconductor chip mounted on a chip mount is restrained from getting out of mounting position. CONSTITUTION:A chip mount 8, which is so protruding trapezoidal in cross section as to make its base angle equal to an angle of 45 deg. or below to the other part of a mount 2 and equal to a semiconductor chip 3 in width, is provided to the mount 2, and the semiconductor chip 3 is mounted on the chip mount 8 by soldering.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency semiconductor device, and more particularly to a high-frequency semiconductor device which is less likely to be displaced when mounting a semiconductor chip on a mount portion.

[0002]

2. Description of the Related Art FIG. 4 is a perspective view showing a structure of a semiconductor device used in a conventional microwave power amplifier.
In the figure, 101 is a package, 103 is a semiconductor chip composed of transistors mounted on the mount 102 by soldering, 105 is a bonding pad,
Reference numeral 104 denotes the semiconductor chip 103 and the bonding pad 10.
Gold wire connecting 5 and 106 bonding pad 1
05 is a lead connected to.

Next, the assembly method will be described. As shown in FIG. 4, the semiconductor chip 103 is manually attached by soldering to a predetermined attachment position on the mount portion 102 of the package 101 under a microscope, and then the semiconductor chip 103 and the bonding pad 105 are connected to the wire 104. To obtain a semiconductor device.

[0004]

Since the conventional semiconductor device is configured as described above, it is difficult to define the mounting position of the semiconductor chip 103 on the mount portion 102, and the mounting position tends to vary. Due to the influence of the variation in the length of the wire 104 due to this variation, there is a problem in that the high frequency characteristics of the semiconductor device greatly vary.

The semiconductor chip 103 is mounted on the mount unit 1.
If too much solder is used when mounting on 02,
By soldering, the chip 103 for the mount portion 102
However, there is a problem that the heat radiation efficiency from the bottom surface of the semiconductor chip 103 deteriorates.

The present invention has been made to solve the above problems, and an object thereof is to obtain a semiconductor device in which variations in high frequency characteristics are suppressed by stabilizing the mounting position of the semiconductor chip.

Another object of the present invention is to obtain a semiconductor device excellent in heat dissipation efficiency by eliminating the floating of the semiconductor chip with respect to the mount portion caused by an excessive amount of solder.

[0008]

A semiconductor device according to the present invention has a trapezoidal shape whose cross-sectional shape is 45 ° or less in a predetermined area where a semiconductor chip of a mount portion is mounted, with respect to other areas. As described above, the chip mounting portion is formed so that the lateral width of the upper surface thereof is approximately the same as the lateral width of the semiconductor chip, and the semiconductor chip is soldered thereto.

Further, the semiconductor device according to the present invention is distinguished from the other regions by the grooves having the predetermined depth and width provided on both outer sides of the predetermined region where the semiconductor chip of the mount portion is mounted. A chip mounting portion having a width of the upper surface that is approximately the same as the lateral width of the semiconductor chip is provided, and the semiconductor chip is soldered thereto.

[0010]

According to the present invention, a predetermined area of the mount portion to which the semiconductor chip is attached is raised so that its sectional shape is a trapezoidal shape having a base angle of 45 ° or less with respect to other areas, and Provide a chip mounting portion formed so that the lateral width of its upper surface is approximately the same as the lateral width of the semiconductor chip,
Since the semiconductor chip is soldered to this, the chip mounting portion is easy to see and the mounting position when mounting the semiconductor chip can be easily confirmed, so that a semiconductor device with less displacement of the mounting position of the semiconductor chip is obtained. It becomes possible. Moreover, even if too much solder is used when soldering the semiconductor chip, the solder flows out of the chip mounting part along the slope, so that the semiconductor chip does not float and the heat dissipation efficiency is excellent. A semiconductor device can be obtained.

Further, according to the present invention, the width of the upper surface of the mounting portion, which is distinguished from the other areas by the grooves having the predetermined depth and width provided on both outer sides of the predetermined area for mounting the semiconductor chip. Is provided with a chip mounting portion having the same width as the semiconductor chip, and the semiconductor chip is soldered to this.Therefore, as a mark for visual inspection of this groove, it is possible to confirm the mounting position when mounting the semiconductor chip. Since it can be easily performed, it is possible to obtain a semiconductor device in which the mounting position is less displaced. Moreover, even if too much solder is used when soldering the semiconductor chip to the chip mounting part, the solder flows out into the groove around the chip mounting part, so the chip does not float and the heat dissipation efficiency is excellent. A semiconductor device can be obtained.

[0012]

【Example】

Example 1. 1 is a perspective view showing the configuration of a semiconductor device according to a first embodiment of the present invention. In the figure, 1 is a package, 2 is a mount portion, 3 is a semiconductor chip made of a transistor, 8 is a chip mounting portion provided at a predetermined position of the mounting portion 2 for mounting the semiconductor chip 3, and with respect to the mounting portion 2. It is raised in a trapezoidal shape so that the base angle is 45 ° or less, and the width of the chip mounting portion 8 is formed to be approximately the same as the width of the semiconductor chip 3. 4 is a gold wire,
Reference numeral 5 is a bonding pad, and 6 is a lead.

Next, the manufacturing process will be described. After the semiconductor chip 3 is mounted on the chip mounting portion 8 of the package 1 by soldering, the semiconductor chip 3 and the bonding pad 5 are connected by the wire 4 to obtain a semiconductor device.

In the present embodiment, the semiconductor chip 3 is mounted on the chip mounting portion 8 by visual inspection using a microscope or the like, but the width of the chip mounting portion 8 is almost the same as that of the semiconductor chip 3. Since it is formed so as to be raised with respect to the mount portion 2, it is easy to visually recognize the chip mounting position, and the semiconductor chip 3
When the mounting position of 1 is largely deviated from the predetermined mounting position, the chip is dropped from the chip mounting portion 8 so that the displacement of the mounting position can be confirmed, so that the mounting position of the semiconductor chip can be made constant.

Further, in the manufacturing process described above, even when a large amount of solder is used to fix the semiconductor chip 3 to the chip mounting portion 8, the solder flows out from between the mount portion 2 and the semiconductor chip 3, so that the semiconductor chip 3 is The floating can be eliminated.

FIG. 2 schematically shows how the heat is dissipated from the bottom surface of the semiconductor chip when the semiconductor chip is mounted on the mount portion. In the figure, 50 is a chip attached to a chip mounting part 54 on a mount part 52, 51 is an edge part of the bottom surface of the chip 50, 53 is heat dissipated from the edge part 51, and 54 is a bottom surface of the chip 50. As shown in the figure,
The heat from the semiconductor chip edge portion 51 is radiatively dissipated. Therefore, in order to dissipate the heat efficiently, the angle formed between the mount portion 52 and the chip bottom surface 54 in the chip edge portion 51 is 45 ° or less. Will be required. In the present embodiment, the chip mounting portion 8 is 4 times larger than the mounting portion 2.
Since it is formed at an angle of 5 ° or less, it is possible to prevent the thermal resistance of the mount portion 2 from increasing and prevent the characteristic deterioration of the semiconductor device due to the provision of the chip mounting portion 8.

As described above, in the first embodiment, the chip mounting portion 8 is provided at the position where the semiconductor chip is mounted so as to be raised with respect to the mount portion 2 and whose width is equal to that of the semiconductor chip 3. Since the semiconductor chip 3 is soldered onto the chip mounting portion 8, the semiconductor chip 3
Since the mounting position is easy to see, the semiconductor chip 3
It is possible to easily confirm the mounting position when mounting the semiconductor device, obtain a semiconductor device with less displacement of the mounting position, reduce the influence of the variation in the length of the wire 4, and obtain a semiconductor device having stable high frequency characteristics. To be

If too much solder is used to mount the semiconductor chip 3, the solder will flow out of the chip mounting portion 8 along the slope, and the chip 3 will not float. It is possible to obtain the semiconductor device in which the reduction of the heat radiation efficiency from the to the mount portion 2 is prevented.

Example 2. FIG. 3 is a perspective view showing the configuration of a semiconductor device according to a second embodiment of the present invention. In the figure, the same reference numerals as those in FIG. 1 denote the same or corresponding parts,
Reference numeral 12 is a chip mounting portion, 9 is a chip mounting portion provided at a predetermined position for mounting the semiconductor chip 3, and 7 is provided on both outer sides of the semiconductor chip mounting portion 9 while maintaining a lateral width similar to that of the semiconductor chip 3. It is a groove. Here, in order to prevent the deterioration of the characteristics of the semiconductor device, both the width and the depth of the groove 7 are set so that the thermal resistance of the mount portion 12 with respect to the semiconductor chip 3 does not become high.

In the second embodiment, as in the first embodiment, the semiconductor chip 3 is mounted on the semiconductor chip mounting portion 9 by a visual check using a microscope or the like. At this time, by using the groove 7 as a mark, the chip mounting portion 9 can be easily confirmed, so that the positioning when mounting the semiconductor chip 3 can be performed accurately.

Further, when the semiconductor chip 3 is mounted on the semiconductor chip mounting portion 8, even if there is a lot of solder for fixing the chip, the solder flows out into the groove 7 and the floating of the chip 3 can be eliminated.

As described above, in the second embodiment, the chip mounting portion 9 having the lateral width equivalent to that of the semiconductor chip 3 and the groove 7 having the predetermined width and depth is provided on both outer sides of the chip mounting portion 9. The semiconductor chip 3 on the semiconductor chip 3 is provided at a predetermined position for mounting the semiconductor chip 3 on the semiconductor chip mounting portion 9.
Since the groove 7 is attached, the groove 7 can be used as a mark for visual inspection, the attachment position can be easily confirmed when the semiconductor chip 3 is attached, and a semiconductor device with less displacement of the attachment position can be obtained. It is possible to obtain a semiconductor device having stable high frequency characteristics in which the influence of the variation in the length of the wire 4 is reduced.

Further, even if too much solder is used to attach the semiconductor chip 3 to the semiconductor chip mounting portion 9, since the solder flows out into the groove 7 around the chip mounting portion 9, the chip 3 is prevented from floating. A semiconductor device having excellent heat dissipation efficiency can be obtained.

[0024]

As described above, according to the present invention, a predetermined area where a semiconductor chip of a mount portion is mounted has a trapezoidal cross section whose base angle is 45 ° or less with respect to other areas. Since the semiconductor chip is soldered to the chip mounting part that is raised and whose upper surface has a width that is approximately the same as the width of the semiconductor chip, the chip mounting part is visible. In addition, it is easy to confirm the mounting position when mounting the semiconductor chip, and it is possible to obtain a semiconductor device in which the mounting position is less displaced.

Further, according to the present invention, in the predetermined region where the semiconductor chip of the mount portion is mounted, the protrusion is formed so that its cross-sectional shape is a trapezoidal shape having a base angle of 45 ° or less with respect to other regions. Moreover, since the chip mounting portion is formed so that the lateral width of the upper surface thereof is approximately the same as the lateral width of the semiconductor chip and the semiconductor chip is soldered to this, the solder used when mounting the semiconductor chip. Even if the amount is too large, the solder flows out of the chip mounting portion along the slope, so that the semiconductor chip is prevented from floating and a semiconductor device having excellent heat dissipation efficiency can be obtained.

Further, according to the present invention, in the predetermined region where the semiconductor chip of the mount portion is mounted, the upper surface of the upper region is distinguished from the other regions by the grooves provided on both outer sides thereof and having the predetermined depth and width. Since the width of the chip mounting portion is about the same as the width of the semiconductor chip and the semiconductor chip is soldered to the chip mounting portion, this groove is used as a visual mark, so that the mounting position when mounting the semiconductor chip There is an effect that the confirmation becomes easy and a semiconductor device in which the mounting position is less displaced can be obtained.

Further, according to the present invention, in a predetermined region where the semiconductor chip of the mount portion is mounted, a groove having a predetermined depth and width provided on both outer sides of the mount region distinguishes it from other regions, and The width of the chip is about the same as the width of the semiconductor chip, and the semiconductor chip is soldered to the chip mounting part. Since it flows into the groove around the portion, the semiconductor chip is prevented from floating, and a semiconductor device having excellent heat dissipation efficiency can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram showing a heat dissipation state of the semiconductor device according to the first embodiment of the present invention.

FIG. 3 is a perspective view showing a configuration of a semiconductor device according to a second embodiment of the present invention.

FIG. 4 is a perspective view showing a configuration of a conventional semiconductor device.

[Explanation of symbols]

 1 Package 2 Mount Part 3 Semiconductor Chip Composed of Transistor 4 Wire 5 Bonding Pad 6 Lead 7 Groove 8 Chip Mount Part 9 Chip Mount Part 12 Mount Part 50 Semiconductor Chip 51 Chip Edge Part 52 Mount Part 53 Heat Dissipation 54 Chip Bottom 101 Package 102 mount portion 103 semiconductor chip composed of transistors 104 wire 105 bonding pad 106 lead

Claims (3)

[Claims] 1. A semiconductor device in which a semiconductor chip is soldered to a predetermined region of a mount portion provided in a package, wherein the mount portion is raised from another region so as to have a trapezoidal cross section. A semiconductor device, in which a chip mounting portion whose upper surface has a lateral width substantially equal to the lateral width of the semiconductor chip, and the semiconductor chip is soldered to the chip mounting portion. 2. The semiconductor device according to claim 1, wherein the chip mounting portion is raised at a base angle of the trapezoid of 45 ° or less. 3. A semiconductor device in which a semiconductor chip is soldered to a predetermined region of a mount portion provided in a package, wherein the mount portion has grooves provided on both outer sides thereof and having a predetermined depth and width. A semiconductor device characterized in that a chip mounting portion whose upper surface width, which is distinguished from other regions by the same width as the lateral width of the semiconductor chip, is formed, and the semiconductor chip is soldered to the chip mounting portion.