JPS61258439A - 厚膜混成集積回路 - Google Patents

厚膜混成集積回路

Info

Publication number
JPS61258439A
JPS61258439A JP60100940A JP10094085A JPS61258439A JP S61258439 A JPS61258439 A JP S61258439A JP 60100940 A JP60100940 A JP 60100940A JP 10094085 A JP10094085 A JP 10094085A JP S61258439 A JPS61258439 A JP S61258439A
Authority
JP
Japan
Prior art keywords
paste
conductor
carbon atoms
conductor film
metallo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60100940A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0561723B2 (enExample
Inventor
Kazuo Baba
馬場　和夫
Yoshinori Yamaguchi
義紀 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP60100940A priority Critical patent/JPS61258439A/ja
Publication of JPS61258439A publication Critical patent/JPS61258439A/ja
Publication of JPH0561723B2 publication Critical patent/JPH0561723B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
JP60100940A 1985-05-13 1985-05-13 厚膜混成集積回路 Granted JPS61258439A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60100940A JPS61258439A (ja) 1985-05-13 1985-05-13 厚膜混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60100940A JPS61258439A (ja) 1985-05-13 1985-05-13 厚膜混成集積回路

Publications (2)

Publication Number Publication Date
JPS61258439A true JPS61258439A (ja) 1986-11-15
JPH0561723B2 JPH0561723B2 (enExample) 1993-09-07

Family

ID=14287346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60100940A Granted JPS61258439A (ja) 1985-05-13 1985-05-13 厚膜混成集積回路

Country Status (1)

Country Link
JP (1) JPS61258439A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6020048A (en) * 1996-10-02 2000-02-01 Denso Corporation Thick film circuit board and method of forming wire bonding electrode thereon

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6020048A (en) * 1996-10-02 2000-02-01 Denso Corporation Thick film circuit board and method of forming wire bonding electrode thereon
DE19743737B4 (de) * 1996-10-02 2009-07-30 Denso Corporation, Kariya Verfahren zur Bildung einer Drahtbondelektrode auf einer Dickschichtleiterplatte

Also Published As

Publication number Publication date
JPH0561723B2 (enExample) 1993-09-07

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term