JPS61253890A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPS61253890A JPS61253890A JP9491185A JP9491185A JPS61253890A JP S61253890 A JPS61253890 A JP S61253890A JP 9491185 A JP9491185 A JP 9491185A JP 9491185 A JP9491185 A JP 9491185A JP S61253890 A JPS61253890 A JP S61253890A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- printed wiring
- wiring board
- foil pad
- polarity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリント配線板、特に電子部品を搭載し、電
子部品相互の配線を行なうサーフイスマウント形のプリ
ント配線板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board, and particularly to a surface mount type printed wiring board on which electronic components are mounted and wiring between the electronic components is performed.
従来のサーフイスマウント形のプリント配線板の電子部
品を取り付ける銅箔パッドの形状は前記部品のリード形
状により、はとんどは長方形となっていた。The shape of the copper foil pads on which electronic components are attached to conventional surface-mounted printed wiring boards is usually rectangular, depending on the shape of the leads of the components.
しかしながら、このような上述した従来のサーフイスマ
ウント形のプリント配線板においては。However, in the above-mentioned conventional surface mount type printed wiring board.
電子部品の極性や電源・ＧＮＤの区別を表示する場合は
、プリント配線板上に施されるマーキング印刷によって
行なわれていたため、高密度に部品が実装された場合微
細な表示ができないマーキング印刷では表示できない部
分を生ずるという欠点があった。When displaying the polarity of electronic components and the distinction between power supply and GND, it was done by printing markings on the printed wiring board, so when components are mounted in a high density, it is impossible to display fine details using marking printing. The disadvantage was that there were some parts that could not be used.
本発明のサーフイスマウント形のプリント配線板は表面
層に電子部品搭載用の銅箔パッドを有し、銅箔パッドの
形状が電子部品の極性２よび電源・ＧＮＤの種類によっ
て区別されている銅箔パッドを有して構成される。The surface mount type printed wiring board of the present invention has a copper foil pad for mounting electronic components on the surface layer, and the shape of the copper foil pad is differentiated depending on the polarity of the electronic component and the type of power supply/GND. Constructed with foil pads.
次に、本発明の実施例について、図面を参照して説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.
＠１図は本発明の第１の実施例を示す平面図であり、Ｍ
２図は第１図に示す銅箔パッドの一変形例である。@1 Figure is a plan view showing the first embodiment of the present invention, and M
FIG. 2 shows a modification of the copper foil pad shown in FIG.
プリント板１上に電子部品実装用の銅箔パッド２．３が
ある。ここでは搭載されるのはチップコンデンサ６であ
る。ここで、極性が十の側の銅箔パッド２の形状を１＋
“の形にすることによって。On the printed board 1 are copper foil pads 2.3 for mounting electronic components. Here, a chip capacitor 6 is mounted. Here, the shape of the copper foil pad 2 on the side with polarity 1 is 1+
“by making it into the form of.
極性が一目でわかり、誤実装しに（（なる。また、高密
度実装によりパッド間げきが小さくなった場合でもパッ
ド形状を第２図に示す銅箔パッド２′。The polarity can be seen at a glance, making it easier to avoid incorrect mounting.Also, even if the spacing between pads becomes small due to high-density mounting, the pad shape can be changed to copper foil pad 2' as shown in Figure 2.
３のようにすれば従来のマーキングでは不可能であった
極性表示も可能となる。3, it becomes possible to display polarity, which was impossible with conventional markings.
第３図は本発明の第２の実施例を示す平面図で、ＬＳＩ
チップ１ｏをプリント板９上に搭載したときの平面図で
ある。ここで電源を示す形状の銅箔パッド１１．ＧＮＤ
の形状を示す鋼箔パッド１２のように設定するだけでパ
ッド間隔を小さくせずに、電源・ＧＮＤ・信号の区別を
行なうことができる。FIG. 3 is a plan view showing a second embodiment of the present invention, in which an LSI
FIG. 3 is a plan view of a chip 1o mounted on a printed board 9. FIG. Here, a copper foil pad 11 shaped to indicate a power source. GND
By simply setting the steel foil pad 12 having the shape shown in FIG.
また、上述したように電子部品の極性表示、および電源
・ＧＮＤの区別のみのために従来、マーキング印刷を施
していたとするとこのプリント配線板についてはマーキ
ングの必要もなくなる。Further, if markings were conventionally printed only to indicate the polarity of electronic components and to distinguish between power supply and GND as described above, there is no need for markings on this printed wiring board.
本発明のプリント配線板は、サーフイスマウント形のプ
リント上に形成される電子部品搭載用の銅箔パクドを電
子部品の極性および電子部品の電源・ＧＮＤによって銅
箔パッドの形状を区別することにより、ｉ！電子部品誤
実装を少なくし、高密度実装の場合にでも電子部品の極
性およびｅ電源・ＧＮＤが区別でき、また場合によって
はプリント板に施されるマーキングも省略することがで
きるという効果がある。The printed wiring board of the present invention has a copper foil pad for mounting electronic components formed on a surface mount type print by distinguishing the shape of the copper foil pad according to the polarity of the electronic component and the power supply/GND of the electronic component. ,i! This has the effect of reducing erroneous mounting of electronic components, making it possible to distinguish the polarity of electronic components and e-power/GND even in the case of high-density mounting, and, in some cases, making it possible to omit markings on printed circuit boards.
＠１図は本発明の第１の実施例を示す平面図。
第２図は第１図に示す銅箔パッドの形状の一変形例を示
す平面図、第３図は本発明の第２の実施例を示す平面図
である。
１．９・・・・・・プリント板、２．２’、３・・・・
・・銅箔パッド、４，１５・・・・・・配線パターン、
５，１６・・・・・・スルーホール、６・・・・・・有
極性チップコンデンサ、７．８・・・・・・銅箔パッド
、１０・・・・・・Ｌ８Ｉチップ、１１・・・・・・銅
箔パッド、１２・・・・・・銅箔パッド、１３・・・・
・・銅箔パッド、１４・・・・・・リード。
代理人 弁理士 内 原 晋 （１、１，）−一
、、Ｉ′
第 ｌ 図
第 ３ 図@1 Figure is a plan view showing the first embodiment of the present invention. FIG. 2 is a plan view showing a modified example of the shape of the copper foil pad shown in FIG. 1, and FIG. 3 is a plan view showing a second embodiment of the present invention. 1.9...Printed board, 2.2', 3...
...Copper foil pad, 4,15...Wiring pattern,
5, 16... Through hole, 6... Polar chip capacitor, 7.8... Copper foil pad, 10... L8I chip, 11... ...Copper foil pad, 12...Copper foil pad, 13...
...Copper foil pad, 14...Lead. Agent Patent Attorney Susumu Uchihara (1, 1,)-1, I' Figure l Figure 3
Claims (1)
板上に形成され取り付けられる電子部品の極性に応じた
形状をなす銅箔パッドとを含むことを特徴とするプリン
ト配線板。A printed wiring board comprising a surface mount type printed board and a copper foil pad formed on the printed board and shaped according to the polarity of an electronic component to be attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9491185A JPS61253890A (en) | 1985-05-02 | 1985-05-02 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9491185A JPS61253890A (en) | 1985-05-02 | 1985-05-02 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61253890A true JPS61253890A (en) | 1986-11-11 |
Family
ID=14123192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9491185A Pending JPS61253890A (en) | 1985-05-02 | 1985-05-02 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61253890A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009026823A (en) * | 2007-07-17 | 2009-02-05 | Toshiba Corp | Printed wiring board, and electronic device |
-
1985
- 1985-05-02 JP JP9491185A patent/JPS61253890A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009026823A (en) * | 2007-07-17 | 2009-02-05 | Toshiba Corp | Printed wiring board, and electronic device |
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