JPS61253885A - Metal substrate and making thereof - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a metal substrate locally having an insulating resin substrate.

[Conventional technology]

In the electronics industry, which is becoming increasingly dense and highly integrated, there are strong demands for substrates to have good heat conductivity to accommodate the increasing density of heat-generating elements, be easy to process, and be inexpensive.

Ceramic substrates have traditionally been used in this field, so-called thick film circuits. This method involves forming an expensive noble metal paste on ceramics by screen printing.

However, as the size of the substrate increases, there are problems in processing, such as the ceramic being broken, and the screen printing method naturally has limitations in forming high-density circuits. Therefore, it has drawbacks such as being expensive. Therefore, in recent years, a method has been developed in which a high-density circuit is formed by forming a resist on a foil-covered metal substrate using a photographic method and then etching it.

[Problem that the invention seeks to solve]

However, it is essentially impossible to connect a metal board to the backside circuit using through-hole technology or to connect connector pins from the backside. In order to achieve this structure, a method of applying an insulating paint inside the through hole was devised, but this method had the drawback of poor insulation reliability.

The present invention solves such drawbacks, by making a metal plate penetrate at any desired location, and laminating a metal foil on the metal plate with an insulating resin plate fitted to the penetration location via an insulating layer. To provide a metal substrate that can maintain insulation between a metal plate and a conductive object passing through the resin plate, and that does not peel off because the insulating resin is fitted as a structure, and a method for manufacturing the same. .

[Means for solving problems]

That is, the present invention provides: 1. A metal substrate characterized in that a metal foil is laminated with an insulating layer interposed on a metal plate whose holes are fitted with a resin plate; 2. A metal plate is partially punched, and the punched holes are formed by punching out a portion of the metal plate. This method of manufacturing a metal substrate is characterized in that a metal foil is laminated with an insulating layer interposed on a metal plate fitted with a resin plate processed or punched to match the shape of the metal plate.

[Examples] The present invention will be explained in detail below using Examples. Figure 5 shows
It is a sectional view of a conventional example, in which a metal foil 3 is laminated on a metal plate 1 with an insulating layer 2 interposed therebetween.

FIG. 1 is a sectional view of the present invention, in which a hole is provided in a metal plate 1 and a resin plate 4 is fitted therein. Although the fitting portion of the resin plate 4 in FIG. 1 is one, there is no problem even if a plurality of resin plates 4 are fitted into the hole portions of the metal plate 1. The resin plate-fitting metal plate 1 has a metal foil 3 laminated on one main surface with an insulating layer 2 interposed therebetween. Further, in FIG. 3, metal foil 3 is laminated on both sides of the metal plate 10 fitted with the resin plate with an insulating layer 2 interposed therebetween.

For the metal plate 1, metals such as aluminum, aluminum alloy, alumite, iron, stainless steel, copper, etc. can be used depending on the purpose.

The insulating layer 2 can be made of glass fiber cloth impregnated with a thermosetting resin, but a filler-containing epoxy resin composition is generally used. This composition is an insulating resin containing an epoxy resin and an insulating filler with good thermal conductivity, such as silica, alumina, boron nitride, beryllia, magnesia, etc., singly or in combination, to improve thermal conductivity. ing.

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puC+mu^8 gold etc.

Further, the resin plate 4 is a resin plate reinforced with glass fibers, and commonly used substrate materials such as epoxy resin and polyimide can be used.

One example of the method for manufacturing a metal substrate of the present invention is to manually or mechanically punch out a metal plate 1 into a predetermined shape at a desired position, and then punch out a glass fiber reinforced resin plate 4 having the same thickness as the metal plate. The outer shape is processed to match the punched hole, or the metal plate is punched and fitted into the hole, and the surface is made flat by pressing. Next, the metal plate having the resin portion is subjected to surface conditioning such as degreasing, an insulating adhesive material and metal foil are laminated on one or both sides, and the metal plate is integrated by hot pressing to produce the metal substrate of the present invention.

FIG. 3 is an application example using a metal board of the present invention, and shows a connector pin 7 that penetrates a resin plate 4 fitted to a metal plate 1 and is attached to a conductor 31 with solder 8. be. Further, in FIG. 4, conductors 31 on both sides of the metal plate 1 are connected via a resin group 4 with a conductor paste or a conductor 5.

〔Effect of the invention〕

As explained above, by using the metal substrate of the present invention, the locally existing resin plate portion can be used to adopt the through-hole structure or connector connection structure of a general resin substrate without losing any of the performance as a metal substrate. I can do it.

[Brief explanation of drawings]

1 and 2 are cross-sectional views showing one embodiment of the present invention. FIG. 3 shows an example of a connector connection structure to which the metal substrate of the present invention is applied. Figure 4 shows an example of application to through holes. FIG. 5 shows a sectional view of a conventional metal substrate. Code 1...Metal plate, 2...Insulating layer, 3...Metal foil, 3
1... Conductor, 4... Resin plate, 5... Conductor paste or plated conductor, 6... Connector constituent resin, γ
... Connector pin, 8... Solder.

Claims (9)

[Claims] (1) A metal substrate characterized in that a metal foil is laminated with an insulating layer interposed on a metal plate whose holes are fitted with a resin plate. (2) The metal substrate according to claim 1, wherein the resin plate is a resin reinforced with glass fiber. (3) The metal substrate according to claim 1, wherein the insulating layer is an epoxy resin composition containing inorganic powder. (4) The metal substrate according to claims 1 and 3, wherein the insulating layer is a glass fiber cloth impregnated with a thermosetting resin. (5) A metal substrate characterized in that a metal plate is partially punched out and a metal foil is laminated with an insulating layer interposed on the metal plate, which is fitted with a resin plate that is processed or punched to match the punched holes. manufacturing method. (6) The method for manufacturing a metal substrate according to claim 5, wherein the metal plate fitted with the resin plate is surface-smoothed by press working. (7) The method for manufacturing a metal substrate according to claim 5, wherein the resin plate is a resin reinforced with glass fiber. (8) The method for manufacturing a metal substrate according to claim 5, wherein the insulating layer is an epoxy resin composition containing inorganic powder. (9) The method for manufacturing a metal substrate according to claims 5 and 8, wherein the insulating layer is a glass fiber cloth impregnated with a thermosetting resin.