JPS6125236B2 - - Google Patents
Info
- Publication number
- JPS6125236B2 JPS6125236B2 JP54113741A JP11374179A JPS6125236B2 JP S6125236 B2 JPS6125236 B2 JP S6125236B2 JP 54113741 A JP54113741 A JP 54113741A JP 11374179 A JP11374179 A JP 11374179A JP S6125236 B2 JPS6125236 B2 JP S6125236B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- chip
- chip parts
- transferred
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 8
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11374179A JPS5637698A (en) | 1979-09-04 | 1979-09-04 | Method of mounting chip part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11374179A JPS5637698A (en) | 1979-09-04 | 1979-09-04 | Method of mounting chip part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5637698A JPS5637698A (en) | 1981-04-11 |
| JPS6125236B2 true JPS6125236B2 (enrdf_load_stackoverflow) | 1986-06-14 |
Family
ID=14619946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11374179A Granted JPS5637698A (en) | 1979-09-04 | 1979-09-04 | Method of mounting chip part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5637698A (enrdf_load_stackoverflow) |
-
1979
- 1979-09-04 JP JP11374179A patent/JPS5637698A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5637698A (en) | 1981-04-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4314870A (en) | Method of mounting electronic components | |
| JP2743262B2 (ja) | 多層プリント基板の穴の貫通部を導通状態にする方法 | |
| JPS6125236B2 (enrdf_load_stackoverflow) | ||
| CN109392254B (zh) | 焊球或焊膏搭载装置 | |
| JPS61500047A (ja) | 電子回路組立方法 | |
| JPH10520A (ja) | 基板固定治具及び基板固定方法 | |
| JP2001062362A (ja) | ペースト塗布方法及びペースト塗布装置 | |
| JPS6255717B2 (enrdf_load_stackoverflow) | ||
| JPS63122202A (ja) | 電子部品の端面電極塗布用治具および電子部品の端面電極塗布方法 | |
| JPS63215093A (ja) | 厚膜混成集積回路の外装法 | |
| JPS6348440B2 (enrdf_load_stackoverflow) | ||
| JP2000309151A (ja) | ペースト状物質の印刷方法 | |
| JPS59219983A (ja) | チツプ部品用の接着剤塗布装置の塗布部クリ−ニング方法 | |
| JP3040378U (ja) | 接着剤塗布装置 | |
| JPH0810218Y2 (ja) | 混成集積回路モジュール | |
| JPH0249493A (ja) | 厚膜基板のスルーホール印刷方法と印刷基板ホルダー | |
| JPH03206693A (ja) | テーピング部品の供給装置 | |
| JPS63190679A (ja) | 塗布材料の塗布装置 | |
| JPH01175187A (ja) | 基板形電気部品の接着方法 | |
| JPS63182892A (ja) | 厚膜ハイブリツドｉｃのスル−ホ−ル形成方法 | |
| JPH0428286A (ja) | 電子部品のプリント基板への取付方法および電子部品装置 | |
| JPH01179499A (ja) | 超小型半導体集積回路の実装方法 | |
| JP2001167991A (ja) | 表面実装型チップ部品の電極に導電性金属を被覆する方法及び装置 | |
| JPS61100995A (ja) | チツプ部品の取付装置 | |
| JPS60223191A (ja) | チツプ部品搭載装置 |