JPS6125221B2 - - Google Patents

Info

Publication number
JPS6125221B2
JPS6125221B2 JP53024651A JP2465178A JPS6125221B2 JP S6125221 B2 JPS6125221 B2 JP S6125221B2 JP 53024651 A JP53024651 A JP 53024651A JP 2465178 A JP2465178 A JP 2465178A JP S6125221 B2 JPS6125221 B2 JP S6125221B2
Authority
JP
Japan
Prior art keywords
layer
insulating film
titanium
gold
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53024651A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54117680A (en
Inventor
Hiroshi Tsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP2465178A priority Critical patent/JPS54117680A/ja
Publication of JPS54117680A publication Critical patent/JPS54117680A/ja
Publication of JPS6125221B2 publication Critical patent/JPS6125221B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area

Landscapes

  • Electrodes Of Semiconductors (AREA)
JP2465178A 1978-03-03 1978-03-03 Semiconductor device Granted JPS54117680A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2465178A JPS54117680A (en) 1978-03-03 1978-03-03 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2465178A JPS54117680A (en) 1978-03-03 1978-03-03 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS54117680A JPS54117680A (en) 1979-09-12
JPS6125221B2 true JPS6125221B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-06-14

Family

ID=12144034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2465178A Granted JPS54117680A (en) 1978-03-03 1978-03-03 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54117680A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10941251B2 (en) 2018-03-22 2021-03-09 Momentive Performance Materials Inc. Silicone polymer and composition comprising the same
US10968351B2 (en) 2018-03-22 2021-04-06 Momentive Performance Materials Inc. Thermal conducting silicone polymer composition
US11319414B2 (en) 2018-03-22 2022-05-03 Momentive Performance Materials Inc. Silicone polymer
US11472925B2 (en) 2018-03-22 2022-10-18 Momentive Performance Materials Inc. Silicone polymer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112045A (ja) * 1984-06-28 1986-01-20 Oki Electric Ind Co Ltd バンプ電極の形成方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5937576B2 (ja) * 1976-04-28 1984-09-11 株式会社日立製作所 半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10941251B2 (en) 2018-03-22 2021-03-09 Momentive Performance Materials Inc. Silicone polymer and composition comprising the same
US10968351B2 (en) 2018-03-22 2021-04-06 Momentive Performance Materials Inc. Thermal conducting silicone polymer composition
US11319414B2 (en) 2018-03-22 2022-05-03 Momentive Performance Materials Inc. Silicone polymer
US11472925B2 (en) 2018-03-22 2022-10-18 Momentive Performance Materials Inc. Silicone polymer

Also Published As

Publication number Publication date
JPS54117680A (en) 1979-09-12

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